公开(公告)号：WO2003049495A1

公开(公告)日：2003-06-12

申请号：PCT/DK2002/000810

申请日：2002-12-02

Applicant: OTICON A/S ,  KRAGELUND, Lasse ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders, Erik

Inventor： KRAGELUND, Lasse ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders, Erik

IPC: H04R25/00

CPC classification number: H04R25/604 ,  B29C45/14639 ,  B29C45/14836 ,  B29C2045/14844 ,  H04R25/405 ,  H04R25/602

Abstract: The invention concerns a hearing aid, which has a casing accommodating one or more sound to electric signal converting transducers (11,12) and a signal path from the transducer (11,12) to a receiver which provides a sound signal at the ear of the user. The signal processing is provided in the signal path to ensure a signal amplification/attenuation according to the needs of the user. A battery (6) is accommodated in the casing and a battery lid is arranged with a first side (1) facing the surrounding and a second side (2) facing the interior of the casing whereby the battery lid is operable for replacement of the battery. According to the invention the battery lid has means (3) for receiving at least one sound to electric signal converting transducer (11,12) and a sound transmission path is provided between the first side (1) of the battery lid and the at least one transducer (11,12).

Abstract translation: 本发明涉及助听器，其具有容纳一个或多个声音到电信号转换换能器（11,12）的外壳以及从换能器（11,12）到接收器的信号路径 在用户的耳朵处提供声音信号。 在信号路径中提供信号处理以根据用户的需要确保信号放大/衰减。 电池（6）容纳在外壳中，并且电池盖布置成具有面向周围的第一侧（1）和面向外壳内部的第二侧（2），由此电池盖可操作以更换电池 。 根据本发明，电池盖具有用于接收至少一个声音到电信号转换换能器（11,12）的装置（3），并且声音传输路径设置在电池盖的第一侧（1）与至少一个 一个传感器（11,12）。

公开(公告)号：WO2006029970A1

公开(公告)日：2006-03-23

申请号：PCT/EP2005/054355

申请日：2005-09-05

Applicant: OTICON A/S ,  RASMUSSEN, Frank Engel ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders Erik

Inventor： RASMUSSEN, Frank Engel ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders Erik

IPC: H04R19/04 ,  H04R19/00 ,  H01L23/31

CPC classification number: H05K3/4694 ,  H01L23/315 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4644 ,  H01L2224/0401

Abstract: The invention regards an audio processing device with at least one encapsulated electronic component mounted and electrically connected to electric leads in a mounting substrate. Further electric components are mounted for connection with the encapsulated electronic component through the substrate and the encapsulation material is moulded onto the substrate. According to the invention at least one metal layer is deposited on a surface part of the encapsulation material. The invention further regards a method for producing an amplifier for an audio device whereby at least one encapsulated electronic component is mounted on, and electrically connected to a PCB and where the encapsulation material is provided to protect the electronic component wherein further a metal layer is generated at least on a surface area of the encapsulation material.

Abstract translation: 本发明涉及一种具有至少一个被封装的电子部件的音频处理装置，并且在安装基板中电连接到电引线。 另外的电气部件被安装用于通过衬底与封装的电子部件连接，并且封装材料被模制到衬底上。 根据本发明，至少一个金属层沉积在封装材料的表面部分上。 本发明还涉及一种用于制造用于音频装置的放大器的方法，其中至少一个封装的电子部件安装在PCB上并电连接到PCB，并且其中提供封装材料以保护电子部件，其中还产生金属层 至少在封装材料的表面积上。

公开(公告)号：WO2004109770A2

公开(公告)日：2004-12-16

申请号：PCT/DK2004/000367

申请日：2004-05-26

Applicant: OTICON A/S ,  RASMUSSEN, Frank, Engel ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders, Erik

Inventor： RASMUSSEN, Frank, Engel ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders, Erik

IPC: H01L21/00

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401

Abstract: The invention concerns a process for generating a through wafer via from a first to a second external surface of a CMOS or similar circuitry containing wafer, whereby a metal layer is deposited on the second surface of the wafer and where a DRIE process is subsequently used to generate the hole through the wafer material from the first surface to the metal layer and using the metal layer as an etch stop, and whereafter an electrical insulation layer is deposited on the side walls of the hole and an electrically conducting material is provided on top of the electrical insulation material.

Abstract translation: 本发明涉及一种用于从CMOS或类似的包含晶片的电路的第一外部表面产生通过晶片通孔的方法，由此金属层沉积在晶片的第二表面上，并且随后将DRIE工艺用于 通过晶片材料从第一表面到金属层产生孔，并使用金属层作为蚀刻停止层，然后在孔的侧壁上沉积电绝缘层，并且导电材料设置在 电绝缘材料。

公开(公告)号：WO2002103784A1

公开(公告)日：2002-12-27

申请号：PCT/DK2002/000402

申请日：2002-06-14

Applicant: OTICON A/S ,  SKINDHØJ, Jørgen ,  PETERSEN, Anders, Erik

Inventor： SKINDHØJ, Jørgen ,  PETERSEN, Anders, Erik

IPC: H01L21/78

CPC classification number: H01L21/568 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00

Abstract: The invention concerns a method for producing miniature amplifier and signal processing unit. The method comprises the steps of: producing arrays of individual integrated circuits on a side of a wafer, where each circuit has a number of I/O connection points; providing a number of solder connection pads at each integrated circuit for redistribution of the I/O connection points of the integrated circuit; coating the side of the wafer having the solder connection pads with a protection coating and ensuing through going apertures in the coating to provide electrical contact with the solder connection pads; applying electrical components onto the coating and gaining electrical contact with the solder connection pads through the apertures of the coating material; singulating the individual amplifiers from the wafer and ensuring light protection of the edges and possible unprotected side of the amplifiers.

Abstract translation: 本发明涉及一种用于生产微型放大器和信号处理单元的方法。 该方法包括以下步骤：在晶片的一侧产生单个集成电路的阵列，其中每个电路具有多个I / O连接点; 在每个集成电路处提供多个焊接连接焊盘，用于重新分配集成电路的I / O连接点; 用具有保护涂层涂覆具有焊料连接焊盘的晶片的侧面，并且随后通过涂层中的通孔进行与焊料连接焊盘的电接触; 将电气部件施加到涂层上并通过涂层材料的孔与焊料连接焊盘电接触; 从晶圆上分离单个放大器，并确保放大器的边缘和可能的未受保护侧的光保护。