公开(公告)号：WO2006084349A1

公开(公告)日：2006-08-17

申请号：PCT/CA2006/000075

申请日：2006-01-20

Applicant: MICROBONDS INC. ,  LYN, Robert ,  PERSIC, John ,  UPSHALL, Morgan, Lee

Inventor： LYN, Robert ,  PERSIC, John ,  UPSHALL, Morgan, Lee

IPC: H01L23/50 ,  H01L21/60

CPC classification number: H01L24/85 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48599 ,  H01L2224/49052 ,  H01L2224/4917 ,  H01L2224/49176 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2224/4569 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate. Further, the bond pads may be staggered such that the effective pitch of the bond pads is less than the diameter of the wire, and the bond fingers may be positioned on a bond finger ring and to bonding locations outside the ring providing an effective pitch of the bond fingers of less than the diameter of the wire.

Abstract translation: 介绍了一种新颖的线型互连IC封装以及IC封装的设计方法和方法。 IC封装包括一个或多个信号承载线以及与每个信号承载线相关联的接地返回线，以将芯片电耦合到载体衬底。 信号承载线及其相关联的接地返回线都可以是绝缘的，但至少信号承载线或接地线绝缘。 信号承载线的电感可以通过使引线尽可能短的方式保持较低，并且通过将数个接地线对称地放置在信号承载线附近并且紧邻信号承载线。 信号承载线和接地返回线连接到芯片上的接合焊盘，并将指状物粘结在载体衬底上以将芯片耦合到衬底。 此外，接合焊盘可以交错，使得接合焊盘的有效节距小于导线的直径，并且接合指状物可以定位在接合指环上并且与环之间的接合位置提供有效间距 键指小于导线的直径。

公开(公告)号：WO2006060913A1

公开(公告)日：2006-06-15

申请号：PCT/CA2005/001865

申请日：2005-12-07

Applicant: MICROBONDS INC. ,  PERSIC, John, I. ,  SONG, Young-Kyu ,  UPSHALL, Morgan, Lee ,  MUNAR, Juan, Florencio

Inventor： PERSIC, John, I. ,  SONG, Young-Kyu ,  UPSHALL, Morgan, Lee ,  MUNAR, Juan, Florencio

IPC: H01L21/60

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48463 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/4569 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2075

Abstract: A microchip wire bonder for bonding insulated bond wire to a surface, the microchip wire bonder comprising: a) a body having a stationary electrical contact configured to receive an electrical potential; b) a bond head attached to the body, to position the insulated bond wire adjacent to the surface; c) a rotating wire spooler attached to the body, to hold the insulated bond wire and to advance the insulated bond wire from the spooler to the bond head as needed; and d) an electrical contact device comprising: i) a rotating electrical connector fixed to the rotating wire spooler and being sized and shaped to receive an electrical connection with an uninsulated portion of the insulated bond wire at one end, and having a moving electrical contact at the other end, the two ends being electrically connected; and ii) a conductive bearing configured to electrically couple the moving electrical contact of the electrical connector and the stationary electrical contact; wherein, upon connecting the stationary electrical contact to an electrical potential, and upon connecting the bond wire to the electrical connector, the insulated bond wire will acquire the electrical potential.

Abstract translation: 一种用于将绝缘接合线接合到表面的微芯片引线接合器，所述微芯片引线接合器包括：a）具有被配置为接收电势的固定电接触的本体; b）连接到主体的接合头，将绝缘接合线定位在表面附近; c）安装在主体上的旋转线卷轴，以保持绝缘接合线，并根据需要将绝缘接合线从卷绕机推进到接合头; 以及d）电接触装置，包括：i）旋转电连接器，其固定到所述旋转线卷轴并且其尺寸和形状被设计成在一端处接收与所述绝缘接合线的未绝缘部分的电连接，并且具有移动电接触 在另一端，两端电连接; 以及ii）导电轴承，其构造成电连接所述电连接器和所述固定电触头的移动电触头; 其中，在将固定电触点连接到电位上时，并且在将所述接合线连接到所述电连接器时，所述绝缘接合线将获得所述电位。