公开(公告)号：WO2005057653A1

公开(公告)日：2005-06-23

申请号：PCT/CA2004/002140

申请日：2004-12-15

Applicant: MICROBONDS, INC. ,  WANG, Daniel ,  LYN, Robert, J. ,  PERSIC, John, I.

Inventor： WANG, Daniel ,  LYN, Robert, J. ,  PERSIC, John, I.

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L21/485 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5382 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01203 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00015 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/01202 ,  H01L2924/01201 ,  H01L2924/01006

Abstract: An integrated circuit package comprising a substrate having terminal pads arranged in at least one row along a perimeter of a surface of the substrate, vias connecting the terminal pads directly to connectors on an opposite side of the substrate, a semiconductor chip mounted on the substrate, inside the perimeter, the chip having bond pads located on a surface of the chip, and a plurality of insulated bond wires, each of the bond wires extending from a bond pad on the chip to a terminal pad on the substrate, the substrate being sized and shaped to provide a sufficient number of rows of terminal pads and associated vias so that horizontal traces through the substrate are not required.

Abstract translation: 一种集成电路封装，包括：衬底，具有沿着衬底的表面的周边排列成至少一行的端子焊盘，将端子焊盘直接连接到衬底相对侧上的连接器的通孔;安装在衬底上的半导体芯片; 在周边内，芯片具有位于芯片表面上的接合焊盘，以及多个绝缘接合线，每个接合线从芯片上的接合焊盘延伸到衬底上的端子焊盘，衬底的尺寸 并且成形为提供足够数量的端子焊盘和相关通孔的行，使得不需要穿过基板的水平迹线。

公开(公告)号：WO2006060913A1

公开(公告)日：2006-06-15

申请号：PCT/CA2005/001865

申请日：2005-12-07

Applicant: MICROBONDS INC. ,  PERSIC, John, I. ,  SONG, Young-Kyu ,  UPSHALL, Morgan, Lee ,  MUNAR, Juan, Florencio

Inventor： PERSIC, John, I. ,  SONG, Young-Kyu ,  UPSHALL, Morgan, Lee ,  MUNAR, Juan, Florencio

IPC: H01L21/60

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48463 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/4569 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2075

Abstract: A microchip wire bonder for bonding insulated bond wire to a surface, the microchip wire bonder comprising: a) a body having a stationary electrical contact configured to receive an electrical potential; b) a bond head attached to the body, to position the insulated bond wire adjacent to the surface; c) a rotating wire spooler attached to the body, to hold the insulated bond wire and to advance the insulated bond wire from the spooler to the bond head as needed; and d) an electrical contact device comprising: i) a rotating electrical connector fixed to the rotating wire spooler and being sized and shaped to receive an electrical connection with an uninsulated portion of the insulated bond wire at one end, and having a moving electrical contact at the other end, the two ends being electrically connected; and ii) a conductive bearing configured to electrically couple the moving electrical contact of the electrical connector and the stationary electrical contact; wherein, upon connecting the stationary electrical contact to an electrical potential, and upon connecting the bond wire to the electrical connector, the insulated bond wire will acquire the electrical potential.

Abstract translation: 一种用于将绝缘接合线接合到表面的微芯片引线接合器，所述微芯片引线接合器包括：a）具有被配置为接收电势的固定电接触的本体; b）连接到主体的接合头，将绝缘接合线定位在表面附近; c）安装在主体上的旋转线卷轴，以保持绝缘接合线，并根据需要将绝缘接合线从卷绕机推进到接合头; 以及d）电接触装置，包括：i）旋转电连接器，其固定到所述旋转线卷轴并且其尺寸和形状被设计成在一端处接收与所述绝缘接合线的未绝缘部分的电连接，并且具有移动电接触 在另一端，两端电连接; 以及ii）导电轴承，其构造成电连接所述电连接器和所述固定电触头的移动电触头; 其中，在将固定电触点连接到电位上时，并且在将所述接合线连接到所述电连接器时，所述绝缘接合线将获得所述电位。

公开(公告)号：WO2003043774A1

公开(公告)日：2003-05-30

申请号：PCT/CA2002/001770

申请日：2002-11-19

Applicant: MICROBONDS, INC. ,  LYN, Robert, J. ,  PERSIC, John, I. ,  SONG, Young-Kyu

Inventor： LYN, Robert, J. ,  PERSIC, John, I. ,  SONG, Young-Kyu

IPC: B23K20/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4569 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00

Abstract: A wire bonder for bonding an insulated wire (100) to a surface (110) is disclosed. The bonder includes a bond head (106, 114), having a bonding position adjacent to said surface (100) and a wire preparation position spaced apart from the surface (110). There is a wire holder (106) on the bond head (106, 114), the wire holder (106) being sized and shaped to permit a free end of the insulated wire (100) to extend from the wire holder (106) when the bond head (106, 114) is in the spaced apart position. A source (102) of insulated wire (100) for said bond head (106, 114) is provided as well as an electrical discharge wand (112) positioned adjacent to said bond head (106, 114) when the bond head (106, 114) is in the spaced apart position. The wand (112) directs sufficient electricity at the extending free end (104) of the insulated wire (100) to form a bond ball on the free end. A ground (124) associated with the insulated wire (100), is provided the ground (124) being sized and positioned to conduct electrical energy away from the insulated bond wire (100) to prevent the insulation on the bond wire remote from the free end (104) from being damaged.

Abstract translation: 公开了一种用于将绝缘线（100）接合到表面（110）的引线接合器。 接合器包括具有与所述表面（100）相邻的接合位置的接合头（106,114）和与表面（110）间隔开的线制备位置。 在接合头（106,114）上有电线保持架（106），电线保持器（106）的尺寸和形状被设计成允许绝缘电线（100）的自由端从电线保持架（106）延伸， 接合头（106,114）处于间隔开的位置。 提供用于所述结合头（106,114）的绝缘线（100）的源（102）以及当所述接合头（106,114）与所述接合头（106,114）相邻定位的放电棒（112） 114）处于间隔开的位置。 所述棒（112）在绝缘线（100）的延伸自由端（104）处引导足够的电力，以在自由端上形成粘结球。 设置与绝缘电线（100）相关联的接地（124），接地（124）的尺寸和位置被定位成将电能远离绝缘接合线（100），以防止接合线上的绝缘远离自由 端部（104）被损坏。