公开(公告)号：WO2008054326A1

公开(公告)日：2008-05-08

申请号：PCT/SG2006/000330

申请日：2006-11-03

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  RAMADAN, Qasem ,  YOON, Seung Uk ,  KRIPESH, Vaidyanathan ,  TEO, Poi Siong ,  IYER, Mahadevan Krishna

Inventor： RAMADAN, Qasem ,  YOON, Seung Uk ,  KRIPESH, Vaidyanathan ,  TEO, Poi Siong ,  IYER, Mahadevan Krishna

IPC: H01L21/68 ,  H01L21/50

CPC classification number: H01L23/13 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/45 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49133 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81 ,  H01L2224/0401

Abstract: A magnetically-assisted chip assembly unit for assembling at least one chip having a mounting surface and an attachment surface, wherein the attachment surface supports a magnetisable layer thereon and opposes said mounting surface, onto a substrate that has a corresponding chip mounting surface. The unit comprises a template wafer having at least one recess adapted to accommodate therein said chip; and a master wafer having at least one magnetisable element; wherein the template wafer is mounted on the master wafer and said magnetisable element is located at least proximate to the at least one recess such that the magnetisable element is capable of manipulating the chip into the recess, via its magnetisable layer when the magnetisable element is magnetized and generates a magnetic field. Once in the recess, the attachment surface of the chip faces at least a portion of the recess and the mounting surface of the chip faces an opening of the recess.

Abstract translation: 一种用于组装具有安装表面和附接表面的至少一个芯片的磁辅助芯片组装单元，其中所述附接表面在其上支撑可磁化层并将其与所述安装表面相对，到达具有相应芯片安装表面的基板上。 该单元包括具有适于在其中容纳其中的至少一个凹部的模板晶片; 以及具有至少一个可磁化元件的母晶片; 其中所述模板晶片安装在所述主晶片上，并且所述可磁化元件至少位于所述至少一个凹部处，使得所述可磁化元件能够通过其可磁化层将所述芯片操纵到所述凹槽中，当所述可磁化元件被磁化时 并产生磁场。 一旦在凹部中，芯片的附接表面面向凹部的至少一部分，并且芯片的安装表面面向凹部的开口。

公开(公告)号：WO2006041261A1

公开(公告)日：2006-04-20

申请号：PCT/KR2005/003418

申请日：2005-10-13

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE ,  GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY ,  YUN, Kug Jin ,  KIM, Dae Hee ,  CHO, Suk Hee ,  AHN, Chung Hyun ,  LEE, Soo In ,  HO, Yo Sung ,  YOON, Seung Uk ,  KIM, Sung Yeol

Inventor： YUN, Kug Jin ,  KIM, Dae Hee ,  CHO, Suk Hee ,  AHN, Chung Hyun ,  LEE, Soo In ,  HO, Yo Sung ,  YOON, Seung Uk ,  KIM, Sung Yeol

IPC: H04N7/26

CPC classification number: H04N19/50 ,  G06T15/205 ,  H04N13/128 ,  H04N19/597 ,  H04N19/85 ,  H04N2213/005

Abstract: Provided are a method and an apparatus for enoding/decoding a multi-view video using LDI. Specifically, provided are a method and an apparatus for enoding/decoding a multi-view video using LDI, which uses a linear decorrelation process to improve compression efficiency. The LDI encoding method according to present invention includes: (i) generating the LDI including multiple layers by using color and depth information of each viewpoint image of the multi-view video; (ii) performing linear decorrelation in each layer of the LDI; (iii) performing data aggregation in each linearly-decorrelated layer of the LDI; and (iv) encoding the aggregated data in each layer of the LDI to generate an encoded LDI bit stream.

Abstract translation: 提供了一种使用LDI对多视点视频进行编码/解码的方法和装置。 具体地，提供了使用LDI对使用LDI的多视图视频进行编码/解码的方法和装置，其使用线性去相关处理来提高压缩效率。 根据本发明的LDI编码方法包括：（i）通过使用多视点视频的每个视点图像的颜色和深度信息来生成包括多个层的LDI; （ii）在LDI的每个层中执行线性去相关; （iii）在LDI的每个线性去相关层中执行数据聚合; 以及（iv）对LDI的每层中的聚合数据进行编码，以生成编码的LDI比特流。