実装装置および実装方法
    2.
    发明申请
    実装装置および実装方法 审中-公开
    安装和安装方法

    公开(公告)号:WO2003041478A1

    公开(公告)日:2003-05-15

    申请号:PCT/JP2002/011496

    申请日:2002-11-05

    CPC classification number: H05K13/08 H01L2224/75

    Abstract: A mounter mounts a first bonding wrokpiece 2 with a register mark 4 on a below-arranged second bonding workpiece 3 with a register mark 5. This mounter is provided in a first bonding workpiece holder 6 with an optical path direction conversion means 9 which sideways converts a position reading optical path 10 from each register mark 4, 5, and by side the holder 6 with a recognition means 11 for adjusting a position and focal distance to read each register mark. During bonding, the first bonding workpiece 2 is pressurized at the center to prevent misregistration, and to finely control the pressurization force, resulting in a marked improvement in mounting precision and reliability.

    Abstract translation: 安装器在具有对准标记5的下部配置的第二接合工件3上安装具有对准标记4的第一接合片W 2。该贴片机设置在第一接合工件保持器6中,光路方向转换装置9侧向转换 来自每个对准标记4,5的位置读取光路10和具有用于调整位置和焦距以读取每个对准标记的识别装置11的保持器6的侧面。 在接合期间,第一接合工件2在中心被加压以防止不对准,并且精细地控制加压力,导致安装精度和可靠性的显着提高。

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