公开(公告)号：WO2007075352A3

公开(公告)日：2007-10-11

申请号：PCT/US2006047777

申请日：2006-12-14

Applicant: AVERY DENNISON CORP ,  FERGUSON SCOTT W ,  MEHRABI ALI ,  MEHRABI REZA

Inventor： FERGUSON SCOTT W ,  MEHRABI ALI ,  MEHRABI REZA

IPC: G06K19/077 ,  B29C43/00 ,  B29C45/14 ,  B32B37/04 ,  B42D15/10 ,  G01V15/00 ,  H01L21/02 ,  H01L23/498

CPC classification number: B29C35/0888 ,  B29C43/18 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0855 ,  B29C2043/3615 ,  B32B2519/02 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

Abstract: A chip (20) or other electrical component is embedded in a substrate (32). The substrate (32) may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. An RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure (52) is applied to the substrate (32), and the RFID chip (20) and antenna structure (52) are coupled together.

Abstract translation: 芯片（20）或其他电气部件嵌入在基板（32）中。 衬底（32）可以是能够在芯片周围变形并且至少部分地包围芯片的热塑性材料。 诸如近红外辐射的电磁辐射可用于加热基底。 衬底可以包括可压缩和/或压碎以形成可以插入芯片的凹槽的可压缩层。 一旦被嵌入，芯片或电气部件被基板固定，并且可以耦合到另一个电气部件。 使用热和/或压力将RFID芯片嵌入到基板中，天线结构（52）被施加到基板（32），并且RFID芯片（20）和天线结构（52）耦合在一起。

公开(公告)号：WO2004071677B1

公开(公告)日：2005-03-24

申请号：PCT/US0338513

申请日：2003-12-05

Applicant: AVERY DENNISON CORP

Inventor： MEHRABI ALI ,  AKHAVE JAY R ,  LICON MARK ,  KOCH CAROL A

IPC: B05D1/18 ,  B05D7/00 ,  B32B7/02 ,  B05D1/36

CPC classification number: B82Y30/00 ,  B05D1/18 ,  B05D1/185 ,  B05D7/534 ,  B05D7/574 ,  B05D2201/02 ,  B05D2252/10 ,  B82Y40/00 ,  Y10T428/24942

Abstract: A continuous process for manufacturing self-assembled multilayer coatings, and more particularly, to a continuous process for making multilayer coatings in a roll-to-roll process. A predetermined number of alternating nanoscopic layers of positively charged and negatively charged species are deposited on a moving substrate (170) to form a multilayer composite coating on a substrate in roll form.

Abstract translation: 一种用于制造自组装多层涂料的连续工艺，更具体地涉及用于以卷对卷工艺制造多层涂料的连续工艺。 预定数量的带正电和负带电物质的交替纳米层沉积在移动基底（170）上以在卷材形式的基底上形成多层复合涂层。

公开(公告)号：WO2004031311A3

公开(公告)日：2005-02-03

申请号：PCT/US0331201

申请日：2003-09-30

Applicant: AVERY DENNISON CORP

Inventor： HOLGUIN DANIEL ,  AKHAVE JAY R ,  CHUANG HSIAO KEN ,  REAVES JESSIE C ,  KOCH CAROL A ,  MEHRABI ALI ,  LICON MARK ,  SAUNDERS DENNIS

IPC: B01J19/00 ,  B01L3/00 ,  C07B61/00 ,  C09J11/00 ,  G01N19/04 ,  G01N33/32 ,  G01N35/00 ,  G01N35/02 ,  G01N35/04 ,  G01N31/00 ,  B21D9/05 ,  C12M1/34 ,  G01N1/28

CPC classification number: B01L3/50853 ,  B01J19/0046 ,  B01L3/505 ,  B01L2300/0887 ,  B01L2400/0409 ,  C07B2200/11 ,  C09J11/00 ,  C40B40/00 ,  G01N19/04 ,  G01N33/32 ,  G01N35/028 ,  G01N2035/00534 ,  G01N2035/0424

Abstract: The present invention is directed generally to methods and apparatus for the efficient identification of components, formulations and materials produced therefrom. More particularly, the invention relates to automated apparatus (Fig. 10) and associated methods of utilizing arrays of materials (30) for expeditious screening, testing, identification and optimization of formulations of materials and application parameters that provide novel materials having desired physical characteristics.

Abstract translation: 本发明一般涉及用于有效识别由其制备的组分，制剂和材料的方法和设备。 更具体地说，本发明涉及自动化装置（图10）和利用材料阵列（30）的相关方法，用于快速筛选，测试，鉴定和优化材料配方和提供具有期望物理特性的新型材料的应用参数。

公开(公告)号：WO2008033680A9

公开(公告)日：2008-05-29

申请号：PCT/US2007077303

申请日：2007-08-30

Applicant: AVERY DENNISON CORP ,  KIAN KOUROCHE ,  HE XIAOMING ,  MEHRABI ALI ,  WANG HAOCHUAN

Inventor： KIAN KOUROCHE ,  HE XIAOMING ,  MEHRABI ALI ,  WANG HAOCHUAN

IPC: H01L21/68

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68322 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83868 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2224/0401

Abstract: A method for creating a plurality of semiconductor assemblies that includes the steps of creating a plurality of quasi-wafers, each quasi-wafer comprising a plurality of semiconductor devices; transferring the plurality of semiconductor devices on each quasi-wafers onto a carrier having a functional adhesive; and bonding the plurality of semiconductor devices to a substrate.

Abstract translation: 一种用于产生多个半导体组件的方法，包括以下步骤：产生多个准晶片，每个准晶片包括多个半导体器件; 将每个准晶片上的多个半导体器件转移到具有功能性粘合剂的载体上; 以及将所述多个半导体器件接合到基板。

公开(公告)号：WO2004071677A3

公开(公告)日：2005-01-27

申请号：PCT/US0338513

申请日：2003-12-05

Applicant: AVERY DENNISON CORP

Inventor： MEHRABI ALI ,  AKHAVE JAY R ,  LICON MARK ,  KOCH CAROL A

IPC: B05D1/18 ,  B05D7/00 ,  B32B7/02 ,  B05D1/36

CPC classification number: B82Y30/00 ,  B05D1/18 ,  B05D1/185 ,  B05D7/534 ,  B05D7/574 ,  B05D2201/02 ,  B05D2252/10 ,  B82Y40/00 ,  Y10T428/24942

Abstract: A continuous process for manufacturing self-assembled multilayer coatings, and more particularly, to a continuous process for making multilayer coatings in a roll-to-roll process. A predetermined number of alternating nanoscopic layers of positively charged and negatively charged species are deposited on a moving substrate (170) to form a multilayer composite coating on a substrate in roll form.

Abstract translation: 用于制造自组装多层涂层的连续方法，更具体地说，涉及在卷对卷方法中制备多层涂层的连续方法。 将预定数量的带正电荷和带负电荷的物质的交替纳米层沉积在移动的衬底（170）上以在辊状的基底上形成多层复合涂层。