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    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE
    1.
    发明申请
    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE 审中-公开
    使用多个较小的MEMS器件来替换更大的MEMS器件的方法

    公开(公告)号：WO2010054244A3

    公开(公告)日：2011-02-24

    申请号：PCT/US2009063616

    申请日：2009-11-06

    Applicant: CAVENDISH KINETICS INC ,  SMITH CHARLES GORDON ,  KNIPE RICHARD L ,  JOSHI VIKRAM ,  GADDI ROBERTO ,  UNAMUNO ANARTZ ,  VAN KAMPEN ROBERTUS PETRUS

    Inventor： SMITH CHARLES GORDON ,  KNIPE RICHARD L ,  JOSHI VIKRAM ,  GADDI ROBERTO ,  UNAMUNO ANARTZ ,  VAN KAMPEN ROBERTUS PETRUS

    IPC: B81C1/00

    CPC classification number: B81B7/04 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/135 ,  H01G5/18 ,  H01G5/40

    Abstract: Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

    Abstract translation: 这里公开的实施例通常包括使用大量的小型MEMS器件来代替单个较大的MEMS器件或数字可变电容器的功能。 大量较小的MEMS器件执行与较大器件相同的功能，但由于尺寸较小，因此可以使用互补金属氧化物半导体（CMOS）兼容工艺将其封装在腔中。 对大量较小的设备进行信号平均可以使较小设备阵列的精度等同于较大的设备。 该过程通过考虑使用基于MEMS的加速度计开关阵列以及惯性响应的集成式模数转换来加以说明。 该过程还通过考虑使用基于MEMS的器件结构来实现，其中MEMS器件作为数字可变电容器并联工作。

    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS
    3.
    发明申请
    RF MEMS ISOLATION, SERIES AND SHUNT DVC, AND SMALL MEMS 审中-公开
    RF MEMS隔离，串联和分流DVC，以及小型MEMS

    公开(公告)号：WO2013033613A2

    公开(公告)日：2013-03-07

    申请号：PCT/US2012053481

    申请日：2012-08-31

    Applicant: CAVENDISH KINETICS INC ,  GADDI ROBERTO ,  KNIPE RICHARD L ,  VAN KAMPEN ROBERTUS PETRUS ,  UNAMUNO ANARTZ

    Inventor： GADDI ROBERTO ,  KNIPE RICHARD L ,  VAN KAMPEN ROBERTUS PETRUS ,  UNAMUNO ANARTZ

    IPC: H01G5/18

    CPC classification number: H01L28/60 ,  B81B3/0086 ,  B81B2201/016 ,  B81B2207/015 ,  H01G5/18 ,  H01G5/38 ,  H01G5/40 ,  H01H59/0009 ,  H03K17/162 ,  H03K17/6872 ,  H03K2217/0009 ,  H03K2217/0036 ,  H03K2217/009

    Abstract: The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate.

    Abstract translation: 本发明总体上涉及用于将RF MEMS器件与衬底和驱动电路，串联和并联DVC管芯结构以及用于高频通信的更小的MEMS阵列隔离的架构。 半导体器件具有其中具有多个MEMS器件的一个或多个单元。 MEMS器件通过向上拉电极或下拉电极施加电偏压来操作，以使MEMS器件的开关元件在与RF电极隔开第一距离的第一位置和隔开第二位置的第二位置之间移动 距离不同于距RF电极的第一距离。 上拉和/或拉出电极可以耦合到电阻器以将MEMS器件与衬底隔离。

    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE
    5.
    发明申请
    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE 审中-公开
    使用多个小型MEMS器件来替代大型MEMS器件的方法

    公开(公告)号：WO2010054244A4

    公开(公告)日：2011-04-07

    申请号：PCT/US2009063616

    申请日：2009-11-06

    Applicant: CAVENDISH KINETICS INC ,  SMITH CHARLES GORDON ,  KNIPE RICHARD L ,  JOSHI VIKRAM ,  GADDI ROBERTO ,  UNAMUNO ANARTZ ,  VAN KAMPEN ROBERTUS PETRUS

    Inventor： SMITH CHARLES GORDON ,  KNIPE RICHARD L ,  JOSHI VIKRAM ,  GADDI ROBERTO ,  UNAMUNO ANARTZ ,  VAN KAMPEN ROBERTUS PETRUS

    IPC: B81C1/00

    CPC classification number: B81B7/04 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/135 ,  H01G5/18 ,  H01G5/40

    Abstract: Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

    Abstract translation: 本文公开的实施例通常包括使用大量的小MEMS器件来代替单个更大的MEMS器件或数字可变电容器的功能。 大量较小的MEMS器件具有与较大器件相同的功能，但是由于尺寸较小，因此可以使用互补金属氧化物半导体（CMOS）兼容工艺封装在腔中。 通过大量较小器件的信号平均，允许较小器件阵列的精度等同于较大的器件。 通过考虑使用具有惯性响应的集成模数转换的基于MEMS的加速度计开关阵列来举例说明该过程。 还通过考虑使用MEMS器件结构（其中MEMS器件并行地作为数字可变电容器）来使用该过程。

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