公开(公告)号：WO2016203369A1

公开(公告)日：2016-12-22

申请号：PCT/IB2016/053504

申请日：2016-06-14

申请人： KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY

发明人： ZIDAN, Mohammed Affan ,  KOSEL, Jurgen ,  SALAMA, Khaled Nabil

IPC分类号： H01H59/00 ,  B81B7/00

CPC分类号： H01H59/0009 ,  B81B7/0035 ,  H01H49/00 ,  H01H59/00 ,  H01H2059/0018 ,  H01H2059/0072 ,  H01H2201/038

摘要： A microelectromechanical system (MEMS) switch with liquid dielectric and a method of fabrication thereof are provided. In the context of the MEMS switch, a MEMS switch is provided including a cantilevered source switch, a first actuation gate disposed parallel to the cantilevered source switch, a first drain disposed parallel to a movable end of the cantilevered source switch, and a liquid dielectric disposed within a housing of the microelectromechanical system switch.

摘要翻译： 提供了具有液体电介质的微机电系统（MEMS）开关及其制造方法。 在MEMS开关的上下文中，提供了一种MEMS开关，其包括悬臂源开关，平行于悬臂源开关设置的第一驱动栅极，平行于悬臂源开关的可移动端设置的第一漏极和液体电介质 设置在微机电系统开关的壳体内。

公开(公告)号：WO2007087021A2

公开(公告)日：2007-08-02

申请号：PCT/US2006/047049

申请日：2006-12-08

申请人： SITIME CORPORATION ,  PARTRIDGE, Aaron ,  LUTZ, Markus ,  GUPTA, Pavan

发明人： PARTRIDGE, Aaron ,  LUTZ, Markus ,  GUPTA, Pavan

IPC分类号： H01L29/84

CPC分类号： B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, • gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。 本发明的制造或制造微机电系统及其制造的系统采用晶片接合封装技术。

公开(公告)号：WO2017098454A1

公开(公告)日：2017-06-15

申请号：PCT/IB2016/057472

申请日：2016-12-09

申请人： INVENSENSE, INC

发明人： CORONATO, Luca ,  GAFFORELLI, Giacomo ,  GIAMBASTIANI, Adolfo

IPC分类号： G01C19/5769 ,  G01P15/08 ,  G01C19/5726 ,  B81B7/00

CPC分类号： G01M3/26 ,  B81B7/0035 ,  G01C19/5726 ,  G01C19/5769 ,  G01C19/5776 ,  G01C19/5783 ,  G01P1/023 ,  G01P15/125 ,  G01P15/18

摘要： A microelectromechanical sensor (MEMS) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions, the accelerometer seal holds the accelerometer cavity at a higher pressure than the pressure of the enclosing gyroscope cavity. In the event that one of the gyroscope seal or the accelerometer seal is broken, the gyroscope senses the change in pressure.

摘要翻译： 微机电传感器（MEMS）封装包括陀螺仪和加速度计。 陀螺仪位于密封的外部压力低压腔内。 加速计位于腔体内，加速计腔体的密封完全位于陀螺腔内。 在正常的操作条件下，加速度计密封件将加速度计腔体保持在比封闭的陀螺仪腔体的压力更高的压力下。 如果陀螺仪密封件或加速度计密封件中的一个破裂，则陀螺仪感测到压力的变化。

公开(公告)号：WO2012145485A2

公开(公告)日：2012-10-26

申请号：PCT/US2012/034210

申请日：2012-04-19

申请人： CAVENDISH KINETICS, INC ,  VAN DEN HOEK, Willibrordus Gerardus Maria ,  VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L. ,  SMITH, Charles G.

发明人： VAN DEN HOEK, Willibrordus Gerardus Maria ,  VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L. ,  SMITH, Charles G.

IPC分类号： B81B7/00

CPC分类号： H01L29/84 ,  B81B3/0059 ,  B81B7/0035 ,  B81B2203/0127 ,  B81C1/00285 ,  B81C1/00293 ,  B81C1/00682

摘要： The present invention generally relates to methods for increasing the lifetime of MEMS devices by reducing the landing velocity on switching by introducing gas into the cavity surrounding the switching element of the MEMS device. The gas is introduced using ion implantation into a cavity close to the cavity housing the switching element and connected to that cavity by a channel through which the gas can flow from one cavity to the other. The implantation energy is chosen to implant many of the atoms close to the inside roof and floor of the cavity so that on annealing those atoms diffuse into the cavity. The gas provides gas damping which reduces the kinetic energy of the switching MEMS device which then should have a longer lifetime.

摘要翻译： 本发明一般涉及通过将气体引入到围绕MEMS装置的开关元件的空腔中来降低开关时降低着陆速度来增加MEMS器件寿命的方法。 使用离子注入将气体引入到容纳开关元件的腔附近的空腔中，并且通过通道将气体连接到该空腔，气体可以通过该通道从一个空腔流到另一个空腔。 选择植入能量以植入靠近腔室的内部屋顶和底部的许多原子，使得在退火时，这些原子扩散到空腔中。 气体提供气体阻尼，其降低开关MEMS器件的动能，然后应该具有更长的寿命。

公开(公告)号：WO2007087021A3

公开(公告)日：2007-11-29

申请号：PCT/US2006047049

申请日：2006-12-08

申请人： SITIME CORP ,  PARTRIDGE AARON ,  LUTZ MARKUS ,  GUPTA PAVAN

发明人： PARTRIDGE AARON ,  LUTZ MARKUS ,  GUPTA PAVAN

IPC分类号： H01L21/00

CPC分类号： B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

摘要翻译： 这里描述和说明了许多发明。 在一个方面中，本发明涉及封装和制造机电结构或元件（例如，加速度计，陀螺仪或其它换能器（例如，压力传感器，应变传感器，触觉传感器，磁性传感器和等）的装置，系统和/ /或温度传感器），滤波器或谐振器。 制造或制造本发明的微机电系统以及由此制造的系统采用晶片键合封装技术。

公开(公告)号：WO2017098445A1

公开(公告)日：2017-06-15

申请号：PCT/IB2016/057461

申请日：2016-12-09

申请人： INVENSENSE, INC

发明人： CORONATO, Luca ,  GAFFORELLI, Giacomo ,  GIAMBASTIANI, Adolfo

IPC分类号： G01C19/5769 ,  G01P15/08 ,  G01C19/5726 ,  B81B7/00

CPC分类号： G01M3/26 ,  B81B7/0035 ,  G01C19/5726 ,  G01C19/5769 ,  G01C19/5776 ,  G01C19/5783 ,  G01P1/023 ,  G01P15/125 ,  G01P15/18

摘要： A microelectromechanical sensor (MEMS) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions, the accelerometer seal holds the accelerometer cavity at a higher pressure than the pressure of the enclosing gyroscope cavity. In the event that one of the gyroscope seal or the accelerometer seal is broken, the gyroscope senses the change in pressure and a failure is identified.

摘要翻译： 微机电传感器（MEMS）封装包括陀螺仪和加速度计。 陀螺仪位于密封的外部压力低压腔内。 加速计位于腔体内，加速计腔体的密封完全位于陀螺腔内。 在正常的操作条件下，加速度计密封件将加速度计腔体保持在比封闭的陀螺仪腔体的压力更高的压力下。 如果陀螺仪密封件或加速度计密封件中的一个破裂，则陀螺仪感测到压力的变化并识别出故障。

公开(公告)号：WO2015082952A1

公开(公告)日：2015-06-11

申请号：PCT/IB2013/002990

申请日：2013-12-06

申请人： COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES ,  EPCOS AG

发明人： SAINT-PATRICE, Damien ,  DEN DEKKER, Arnold ,  GIESEN, Marcel ,  GRECO, Florent ,  HENN, Gudrun ,  PORNIN, Jean-Louis ,  REIG, Bruno

IPC分类号： B81C1/00

CPC分类号： B81C1/00277 ,  B81B7/0035 ,  B81C1/00293 ,  B81C2203/0145

摘要： Method for packaging a microelectronic device (100) in an hermetically sealed cavity (110) and managing an atmosphere of the cavity with a dedicated hole (130), comprising: - making said cavity between a support (102) and a cap layer (106) such that a sacrificial material and the device are arranged in the cavity; - removing the sacrificial material through at least one release hole (108), and hermetically sealing the release hole; - making a portion of wettable material (128) on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; - making a portion of fuse material (126) on the portion of wettable material; - making the dedicated hole by etching the cap layer; - reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material (132) which hermetically plugs said dedicated hole.

摘要翻译： 一种用于将微电子器件（100）封装在气密密封空腔（110）中并用专用孔（130）管理空腔的气氛的方法，包括： - 使所述空腔在支撑件（102）和盖层（106）之间 ），使得牺牲材料和装置布置在空腔中; - 通过至少一个释放孔（108）去除所述牺牲材料，并气密地密封所述释放孔; - 在所述盖层上，围绕所述专用孔的位置的盲孔或所述外表面的一部分制造可湿性材料（128）的一部分; - 将一部分熔丝材料（126）制成在可润湿材料的一部分上; - 通过蚀刻盖层制造专用孔; - 在可控气氛下回流熔断体材料部分，形成密封所述专用孔的保险丝材料凸块（132）。

公开(公告)号：WO2015061212A1

公开(公告)日：2015-04-30

申请号：PCT/US2014/061346

申请日：2014-10-20

申请人： ANALOG DEVICES, INC.

发明人： CHEN, Li ,  NUNAN, Thomas Kieran ,  YANG, Kuang L.

IPC分类号： B81B7/00

CPC分类号： B81B7/0035 ,  B81B3/0094 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00293 ,  B81C3/001 ,  B81C2203/019

摘要： A capped micromachined device has a movable micromachined structure in a first hermetic chamber and one or more interconnections in a second hermetic chamber that is hermetically isolated from the first hermetic chamber, and a barrier layer on its cap where the cap faces the first hermetic chamber, such that the first hermetic chamber is isolated from outgassing from the cap.

摘要翻译： 封盖的微加工装置在第一密封室中具有可移动的微机械加工结构，并且在与第一密封室气密隔离的第二密封室中的一个或多个互连以及其顶盖面向第一密封室的阻挡层， 使得第一密封室与盖的排气隔离。

公开(公告)号：WO2012145485A3

公开(公告)日：2013-01-24

申请号：PCT/US2012034210

申请日：2012-04-19

申请人： CAVENDISH KINETICS INC ,  VAN DEN HOEK WILLIBRORDUS GERARDUS MARIA ,  VAN KAMPEN ROBERTUS PETRUS ,  KNIPE RICHARD L ,  SMITH CHARLES G

发明人： VAN DEN HOEK WILLIBRORDUS GERARDUS MARIA ,  VAN KAMPEN ROBERTUS PETRUS ,  KNIPE RICHARD L ,  SMITH CHARLES G

IPC分类号： B81C1/00

CPC分类号： H01L29/84 ,  B81B3/0059 ,  B81B7/0035 ,  B81B2203/0127 ,  B81C1/00285 ,  B81C1/00293 ,  B81C1/00682

摘要： The present invention generally relates to methods for increasing the lifetime of MEMS devices by reducing the landing velocity on switching by introducing gas into the cavity surrounding the switching element of the MEMS device. The gas is introduced using ion implantation into a cavity close to the cavity housing the switching element and connected to that cavity by a channel through which the gas can flow from one cavity to the other. The implantation energy is chosen to implant many of the atoms close to the inside roof and floor of the cavity so that on annealing those atoms diffuse into the cavity. The gas provides gas damping which reduces the kinetic energy of the switching MEMS device which then should have a longer lifetime.

摘要翻译： 本发明一般涉及通过将气体引入到围绕MEMS装置的开关元件的空腔中来降低开关时降低着陆速度来增加MEMS器件寿命的方法。 使用离子注入将气体引入到容纳开关元件的腔附近的空腔中，并且通过通道将气体连接到该空腔，气体可以通过该通道从一个空腔流到另一个空腔。 选择植入能量以植入靠近腔室的内部屋顶和底部的许多原子，使得在退火时，这些原子扩散到空腔中。 气体提供气体阻尼，其降低开关MEMS器件的动能，然后应该具有更长的寿命。