UNDERFILL FOR HIGH DENSITY INTERCONNECT FLIP CHIPS
    3.
    发明申请
    UNDERFILL FOR HIGH DENSITY INTERCONNECT FLIP CHIPS 审中-公开
    适用于高密度互连卷烟夹

    公开(公告)号:WO2011032120A2

    公开(公告)日:2011-03-17

    申请号:PCT/US2010048706

    申请日:2010-09-14

    摘要: Underfill materials include inorganic fill materials (e.g., functionalized CNT' s, organo clay, ZnO) that are functionalized reactive with other organic constituents (e.g., organics with epoxy groups, amine groups, or PMDA). The underfill materials also beneficially include polyhedral oligomeric silsesquioxane and/or dendritic siloxane groups that are functionalized with a reactive group (e.g., glycidyl) that reacts with other components of an epoxy system of the underfill.

    摘要翻译: 底部填充材料包括与其它有机成分(例如具有环氧基的有机物,胺基或PMDA)官能化的无机填充材料(例如官能化的CNT,有机粘土,ZnO)。 底部填充材料还有利地包括与反应性基团(例如缩水甘油基)官能化的多面体低聚倍半硅氧烷和/或树枝状硅氧烷基团,其与底部填料的环氧体系的其它组分反应。

    THERMALLY ENHANCED ELECTRICALLY INSULATIVE ADHESIVE PASTE
    4.
    发明申请
    THERMALLY ENHANCED ELECTRICALLY INSULATIVE ADHESIVE PASTE 审中-公开
    电加强电绝缘胶粘剂

    公开(公告)号:WO2009120376A3

    公开(公告)日:2010-01-21

    申请号:PCT/US2009001935

    申请日:2009-03-26

    IPC分类号: C09J9/00 C09J11/04

    摘要: A thermal interface material comprises larger conformable thermally conductive particles, and smaller ceramic thermally conductive particles in a binder. The binder can include thermoplastic (and optionally thermoset) particles and a fugitive liquid which are substantially insoluble in each other. The binder can also include a liquid epoxy. Each of the larger thermally conductive particles is itself a cohesive yet conformable agglomeration of platy particles.

    摘要翻译: 热界面材料包括更大的一致性导热颗粒和粘合剂中较小的陶瓷导热颗粒。 粘合剂可以包括基本上彼此不溶的热塑性(和任选的热固性)颗粒和短效液体。 粘合剂还可以包括液体环氧树脂。 每个较大的导热颗粒本身是片状颗粒的凝聚而且适形的聚集。