公开(公告)号：WO2019094822A1

公开(公告)日：2019-05-16

申请号：PCT/US2018/060166

申请日：2018-11-09

申请人： FINISAR CORPORATION

发明人： STAPLETON, Brent ,  KHURANA, Pritha ,  LYE, Nathan

IPC分类号： H01S5/022 ,  H01S5/024 ,  H01S5/42 ,  H01L23/00 ,  H01S5/183 ,  H01S5/026

CPC分类号： H01S5/02296 ,  G03B21/2033 ,  H01L25/0655 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49173 ,  H01L2224/49176 ,  H01L2224/49177 ,  H01L2924/15153 ,  H01L2924/1715 ,  H01S5/02208 ,  H01S5/02228 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/18308 ,  H01S5/18361 ,  H01S5/423 ,  H01L2924/0665 ,  H01L2924/00014

摘要： An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.

公开(公告)号：WO2013090823A1

公开(公告)日：2013-06-20

申请号：PCT/US2012/069919

申请日：2012-12-14

申请人： FINISAR CORPORATION ,  STAPLETON, Brent ,  DWIVEDI, Rajeev ,  WALKER, Jr., Harold, Young ,  LANDRY, Gary

发明人： STAPLETON, Brent ,  DWIVEDI, Rajeev ,  WALKER, Jr., Harold, Young ,  LANDRY, Gary

IPC分类号： G02B6/43

CPC分类号： G02B6/4246 ,  G02B6/4257 ,  G02B6/4263 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286 ,  G02B6/4292 ,  G02B6/4295 ,  G02B6/43 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H04B10/40 ,  H04B10/503 ,  H05K13/046 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005

摘要： One example embodiment includes an optical subassembly (OS A). The OS A includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

摘要翻译： 一个示例实施例包括光学子组件（OSA）。 OS A包括柔性电路，光学端口和有源光学部件子组件。 柔性电路由至少一个导电层和至少一个电绝缘体层构成。 光学端口限定了一个机筒空腔，并且在挠性连接处机械地连接到柔性电路。 有源光学元件子组件定位在镜筒腔内并电耦合到柔性电路。