公开(公告)号：WO2016030050A1

公开(公告)日：2016-03-03

申请号：PCT/EP2015/064672

申请日：2015-06-29

Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG

Inventor： KIM, Ki Ho ,  TARK, Yong -Deok ,  KANG, Il Tae ,  KIM, Byoung Gil ,  KIM, Tae Yeop

IPC: H01L23/49

CPC classification number: H01L24/43 ,  H01B1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01045 ,  H01L2924/0102 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2224/05599

Abstract: There are provided a bonding wire and a method of manufacturing the bonding wire. The bonding wire includes 90.0 to 99.0 wt% of silver (Ag); 0.2 to 2.0 wt% of gold (Au); 0.2 to 4.0 wt% of palladium (Pd), platinum (Pt) or rhodium (Rh), or a combination thereof; 10 to 1000 ppm of dopants; and inevitable impurities, in which a ratio of (a)/(b) is 3 to 5. The (a) refers to the amount of crystal grains having orientation in crystalline orientations in a wire lengthwise direction, and the (b) refers to the amount of crystal grains having orientation in crystalline orientations in the wire lengthwise direction.

Abstract translation: 提供了接合线和制造接合线的方法。 接合线包含90.0〜99.0重量％的银（Ag）; 0.2〜2.0重量％的金（Au）; 钯（Pd），铂（Pt）或铑（Rh）的0.2〜4.0重量％，或其组合; 10〜1000ppm的掺杂剂; 和（a）/（b）的比例为3〜5的不可避免的杂质。（a）是指在电线长度方向上的结晶取向的<100>取向的晶粒的量， （b）是指在电线长度方向上的结晶取向中具有<111>取向的晶粒的量。