公开(公告)号：WO2018182658A1

公开(公告)日：2018-10-04

申请号：PCT/US2017/025230

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： DARMAWIKARTA, Kristof ,  MAY, Robert, Alan ,  BOYAPATI, Sri Ranga, Sai Sai ,  JEN, Wei-Lun, Kane ,  SOTO GONZALEZ, Javier

IPC: H01L23/538 ,  H01L23/522 ,  H01L23/48 ,  H01L23/00

Abstract: A die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate comprises a multilayer substrate structure comprising a substrate interconnect, wherein the bridge die is embedded in the multilayer substrate structure. The die interconnect substrate comprises a via portion formed on the first bridge die pad of the bridge die. An average angle between a surface of the first bridge die pad and a sidewall of the via portion lies between 85° and 95°.

公开(公告)号：WO2014098966A1

公开(公告)日：2014-06-26

申请号：PCT/US2013/044440

申请日：2013-06-06

Applicant: INTEL CORPORATION

Inventor： ROY, Mihir, K. ,  LOTZ, Stephanie, M. ,  JEN, Wei-Lun, Kane

IPC: H01L23/48 ,  H01L23/12

CPC classification number: H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2924/0002 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1579 ,  H01L2924/2064 ,  H05K1/0313 ,  H05K1/141 ,  H05K1/142 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/467 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2203/016 ,  H01L2924/00

Abstract: Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

Abstract translation: 描述允许使用有机桥的多芯片互连的实施例。 在一些实施例中，有机封装衬底具有嵌入式有机桥。 有机桥可以具有允许通过有机桥连接管芯的互连结构。 在一些实施例中，有机桥包括金属布线层，金属衬垫层和交错的有机聚合物电介质层，但没有衬底层。 只有几层的实施例可以嵌入到有机封装衬底的顶层或顶层几层中。 还描述了制造方法。