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    ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES
    2.
    发明申请
    ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES 审中-公开

    公开(公告)号：WO2018182753A1

    公开(公告)日：2018-10-04

    申请号：PCT/US2017/025652

    申请日：2017-04-01

    Applicant: INTEL CORPORATION

    Inventor： NAIR, Vijay K. ,  EID, Feras ,  SOUNART, Thomas L.

    IPC: H01L21/60 ,  H01L25/10 ,  H01L25/16 ,  H01L21/98 ,  H01L21/56

    Abstract: Electronics package device technology is disclosed. In one example, an electronics package device (202) comprises a substrate (206) supporting an electronics component (208) and an interconnect via (216a-c) electrically coupled to the electronics component such that at least a portion of the electronics component is disposed between the interconnect via and the substrate. The interconnect via can be directly coupled to the electronics component such that the interconnect via and the electronics component are vertically disposed between a second electronics package device (204) and the substrate. A second electronics package device can be stacked to the first electronics package device, and can comprise similar architecture of the interconnect via attached to the electronics component as with the first electronics package. Thus, 3D package size is significantly reduced. Associated systems and processes are disclosed.

    SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFFENER WITH AN EMI SHIELD FOR RF INTEGRATION
    3.
    发明申请
    SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFFENER WITH AN EMI SHIELD FOR RF INTEGRATION 审中-公开
    用于实施RF整合的具有EMI屏蔽的有机加速器的系统，方法和设备

    公开(公告)号：WO2017171893A1

    公开(公告)日：2017-10-05

    申请号：PCT/US2016/025789

    申请日：2016-04-02

    Applicant: INTEL CORPORATION

    Inventor： NAIR, Vijay K. ,  MALATKAR, Pramod

    IPC: H01L23/552 ,  H01L23/48

    Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces and a ground plane therein; a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer; a heat pipe thermally interfaced to a top surface of the functional semiconductor die; one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heat pipe; in which the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die; and further in which the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form. Other related embodiments are disclosed.

    Abstract translation: 根据所公开的实施例，提供了用于实现具有用于RF集成的EMI屏蔽的有机加强件的方法，系统和设备。 例如，根据一个实施例，存在一种装置，其中具有：其中具有电迹线和接地平面的衬底层; 与所述衬底层的电迹线电接合的功能半导体管芯; 与功能半导体管芯的顶表面热接合的热管; 一个或多个有机介电材料的中介层，电连接到基底层的接地平面并电连接到热管; 其中所述一个或多个中介层形成所述电磁屏蔽以电屏蔽所述功能半导体管芯; 并且进一步地，其中形成有机加强件的一个或多个中介层将机械地保持平面形式的基底层。 披露了其他相关的实施例。

    MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION MODULES HAVING STEERABLE BEAMFORMING CAPABILITY
    6.
    发明申请
    MICROELECTRONIC DEVICES DESIGNED WITH HIGH FREQUENCY COMMUNICATION MODULES HAVING STEERABLE BEAMFORMING CAPABILITY 审中-公开
    微波电子器件设计具有稳定的波束形成能力的高频通信模块

    公开(公告)号：WO2017111920A1

    公开(公告)日：2017-06-29

    申请号：PCT/US2015/067190

    申请日：2015-12-21

    Applicant: INTEL CORPORATION

    Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

    IPC: H01Q3/34 ,  H01Q21/06

    CPC classification number: H01Q3/36 ,  H01Q21/06 ,  H01Q23/00

    Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

    Abstract translation: 本发明的实施例包括通信模块，该通信模块包括具有收发器和耦合到管芯的移相器管芯的管芯。 移相器包括一个功率合成器和分配器。 通信模块还包括耦合到移相器管芯的衬底。 基片包括一个天线单元，具有可控波束形成能力，用于发送和接收通信。

    PIEZOELECTRIC PACKAGE-INTEGRATED FILM BULK ACOUSTIC RESONATOR DEVICES
    8.
    发明申请
    PIEZOELECTRIC PACKAGE-INTEGRATED FILM BULK ACOUSTIC RESONATOR DEVICES 审中-公开
    压电包装集成薄膜大容量声学谐振器装置

    公开(公告)号：WO2017172075A1

    公开(公告)日：2017-10-05

    申请号：PCT/US2017/017703

    申请日：2017-02-13

    Applicant: INTEL CORPORATION

    Inventor： NAIR, Vijay K. ,  EID, Feras ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  RAO, Valluri R. ,  SWAN, Johanna M.

    IPC: H03H3/02 ,  H03H9/58 ,  H03H9/02 ,  H03H3/007

    Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

    Abstract translation: 本发明的实施例包括压电封装集成滤波装置，其包括膜叠层。 在一个示例中，膜堆叠包括第一电极，与第一电极接触的压电材料以及与压电材料接触的第二电极。 薄膜叠层相对于具有有机材料的有机衬底的空腔悬挂，并且薄膜叠层响应于在第一和第二电极之间施加电信号而产生声波以传播穿过薄膜叠层。 p>

    PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES
    9.
    发明申请
    PIEZOELECTRIC PACKAGE-INTEGRATED DELAY LINES 审中-公开
    压电包装 - 集成延时线

    公开(公告)号：WO2017171995A1

    公开(公告)日：2017-10-05

    申请号：PCT/US2017/014720

    申请日：2017-01-24

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  EID, Feras ,  BICEN, Baris ,  KAMGAING, Telesphor ,  NAIR, Vijay K. ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  RAO, Valluri R.

    IPC: H03H9/42 ,  G10K11/36 ,  H03H9/02

    Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

    Abstract translation: 本发明的实施例包括波导结构，其包括第一压电换能器，该第一压电换能器位于有机衬底的空腔的第一端附近。 第一压电换能器接收输入电信号并产生要用传输介质传输的声波。 第二压电换能器位于腔的第二端附近。 第二压电传感器接收来自传输介质的声波并产生输出电信号。

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