公开(公告)号：WO2019132941A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068814

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  EID, Feras ,  NAIR, Vijay K. ,  SWAN, Johanna M.

Inventor： DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  EID, Feras ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H01L23/485 ,  H01L23/498

Abstract: A hybrid filter having an acoustic wave resonator embedded in a cavity of a package substrate is described. In an example, a packaged system includes a package substrate having a die side and a land side opposite the die side. An active die is physically and electrically coupled to the die side of the package substrate. An acoustic wave resonator (AWR) device is in a cavity on the die side of the package substrate, the AWR device including an acoustic wave resonator (AWR) die. The AWR die includes an acoustic wave resonator wherein the AWR device is directly electrically coupled to the active die.

公开(公告)号：WO2019132926A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068754

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  NAIR, Vijay K. ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  LEUSCHNER, Stephan

Inventor： KAMGAING, Telesphor ,  NAIR, Vijay K. ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  LEUSCHNER, Stephan

IPC: H03H9/145 ,  H03H9/02

Abstract: RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

公开(公告)号：WO2019132925A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068752

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  NAIR, Vijay, K. ,  KAMGAING, Telesphor ,  EID, Feras ,  DOGIAMIS, Georgios, C. ,  SWAN, Johanna, M.

Inventor： NAIR, Vijay, K. ,  KAMGAING, Telesphor ,  EID, Feras ,  DOGIAMIS, Georgios, C. ,  SWAN, Johanna, M.

IPC: H03H9/64 ,  H03H9/25 ,  H03H9/145

CPC classification number: H03H9/0542 ,  H03H9/0557 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/542 ,  H03H2001/0085

Abstract: RF front end systems, and more particularly an RF front end system with an integrated and hermetically sealed acoustic wave resonator (AWR), are described. In an example, a system die includes a semiconductor substrate having a first side and a second side opposite the first side. An interconnect structure is on the first side of the semiconductor substrate, the interconnect structure comprising a plurality of metal layers and a plurality of dielectric layers. An acoustic wave resonator is in the interconnect structure. An inductor is in the interconnect structure. An active device area is in the first side of the semiconductor substrate. A cap is attached to the interconnect structure by a seal frame, the cap over the acoustic wave resonator and hermetically sealing the acoustic wave resonator.

公开(公告)号：WO2019132924A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068750

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  EID, Feras ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

Inventor： EID, Feras ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/64 ,  H03H9/25 ,  H03H9/145

Abstract: Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：WO2018057007A1

公开(公告)日：2018-03-29

申请号：PCT/US2016/053503

申请日：2016-09-23

Applicant: NAIR, Vijay K. ,  RAORANE, Digvijay

Inventor： NAIR, Vijay K. ,  RAORANE, Digvijay

IPC: H01L25/065 ,  H01L23/522 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00

Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.

Abstract translation: 这里一般讨论的是包括通信腔的系统，设备和方法。 根据一个示例，装置可以包括衬底，衬底具有在其中形成的第一空腔，暴露在空腔中并且被空腔包围的第一天线和第二天线以及形成在衬底上的互连结构，互连结构包括交替的导电材料层和层间 介质层。

公开(公告)号：WO2014051816A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/048780

申请日：2013-06-28

Applicant: INTEL CORPORATION ,  NAIR, Vijay, K. ,  GUZEK, John, S. ,  SWAN, Johanna, M.

Inventor： NAIR, Vijay, K. ,  GUZEK, John, S. ,  SWAN, Johanna, M.

IPC: H01L23/64 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83193 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Electronic assemblies and their manufacture are described. One assembly includes a coreless substrate comprising a plurality of dielectric layers and electrically conductive pathways, the coreless substrate including a first side and a second side opposite the first side. The assembly includes a first die embedded in the coreless substrate, the first die comprising an RF die, the first die positioned in a dielectric layer that extends to the first side of the coreless substrate. The assembly includes a second die positioned on first side, the second die positioned on the first die. In another aspect, a molding material may be positioned on the die side, wherein the first die and the second die are covered by the molding material. In another aspect, an electrical shielding layer may be positioned over the first side. Other embodiments are described and claimed.

Abstract translation: 描述了电子组件及其制造。 一个组件包括包括多个电介质层和导电通路的无芯衬底，所述无芯衬底包括第一侧和与第一侧相对的第二侧。 组件包括嵌入在无芯基板中的第一模具，第一模具包括RF模头，第一模具位于延伸到无芯基板的第一侧的电介质层中。 组件包括位于第一侧上的第二模具，第二模具定位在第一模具上。 另一方面，成型材料可以位于模具侧，其中第一模具和第二模具被模制材料覆盖。 在另一方面，电屏蔽层可以位于第一侧上。 描述和要求保护其他实施例。

公开(公告)号：WO2008121723A1

公开(公告)日：2008-10-09

申请号：PCT/US2008/058472

申请日：2008-03-27

Applicant: INTEL CORPORATION ,  SUH, Seong-youp ,  NAIR, Vijay, K. ,  CHOUDHURY, Debabani

Inventor： SUH, Seong-youp ,  NAIR, Vijay, K. ,  CHOUDHURY, Debabani

IPC: H01Q13/08

CPC classification number: H01Q13/10 ,  H01Q1/243 ,  H01Q1/50 ,  H01Q9/16 ,  H01Q23/00

Abstract: An embodiment of the present invention provides an apparatus, comprising a multi-band highly isolated planar antenna directly integrated with a front-end module (FEM).

Abstract translation: 本发明的实施例提供一种装置，包括与前端模块（FEM）直接集成的多频带高度隔离的平面天线。

公开(公告)号：WO2019132937A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068795

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

Inventor： KAMGAING, Telesphor ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/145 ,  H03H9/64

CPC classification number: H03H9/0542 ,  H03H7/09 ,  H03H7/1766 ,  H03H7/1775 ,  H03H9/0552 ,  H03H9/0557 ,  H03H9/0561 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/542 ,  H03H2001/0085

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter incudes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

公开(公告)号：WO0119963A3

公开(公告)日：2001-08-09

申请号：PCT/US0040886

申请日：2000-09-13

Applicant: MOTOROLA INC ,  NAIR VIJAY K ,  GORONKIN HERBERT

Inventor： NAIR VIJAY K ,  GORONKIN HERBERT

IPC: G01N33/48 ,  C12M1/00 ,  C12M1/33 ,  C12N1/06 ,  C12N5/06 ,  C12N13/00 ,  H05B6/68 ,  H05B6/80 ,  C12N15/10

CPC classification number: H05B6/806 ,  C12N1/066 ,  C12N13/00

Abstract: Efficient cell lysis in small samples, i.e., samples less than one milliliter, is achieved by exposing the sample to microwave radiation in the frequency range of 18 to 26 GHz. The sample containing cells is supported in a wave-guide cavity, and a microwave source provides microwave radiation to the input port of the wave-guide cavity. A computer controls the frequency and source power level of the microwave radiation produced by the microwave source. The computer also monitors the input power level of the microwave radiation at the input port by means of an input power measuring instrument, the output power level at the output port by means of an output power measuring instrument, and the temperature of the sample by means of a thermocouple. In this way, the computer can control the operating parameters to achieve efficient cell lysis.

Abstract translation: 通过将样品暴露于18-26GHz的频率范围内的微波辐射，实现小样品（即小于1毫升的样品）中的有效细胞裂解。 包含细胞的样品被支撑在波导腔中，并且微波源向波导腔的输入端提供微波辐射。 计算机控制由微波源产生的微波辐射的频率和源功率水平。 计算机还通过输入功率测量仪器监视输入端口处的微波辐射的输入功率电平，借助输出功率测量仪器检测输出端口处的输出功率电平以及通过装置的样本温度 的热电偶。 这样，计算机可以控制操作参数以实现高效的细胞裂解。

公开(公告)号：WO2019132921A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068725

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  EID, Feras ,  NAIR, Vijay K. ,  SWAN, Johanna M.

Inventor： DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  EID, Feras ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/145 ,  H03H9/25

Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.