公开(公告)号：WO2020139434A1

公开(公告)日：2020-07-02

申请号：PCT/US2019/054059

申请日：2019-10-01

Applicant: INTEL CORPORATION

Inventor： SHIN, Woorim ,  HULL, Christopher ,  PELLERANO, Stefano

IPC: G01S13/00

Abstract: Radar circuitry can include an isolator and a mixer. The isolator can isolate a transmission signal path and a reception signal path from each other, and generate a mixing (e.g. oscillation) signal based on a transmission signal. The isolator can be coupled to the mixer such that the drive signal drives the mixer (e.g. serves as the local oscillation signal of the mixer). The mixer mixes a received signal and the drive signal to generate a converted signal (e.g. a down-converted signal). The isolator can be a hybrid transformer or electrically balanced duplexer.

公开(公告)号：WO2018182584A1

公开(公告)日：2018-10-04

申请号：PCT/US2017/024653

申请日：2017-03-29

Applicant: INTEL CORPORATION

Inventor： ROBERTS, Jeanette M. ,  PELLERANO, Stefano ,  CLARKE, James S. ,  ELSHERBINI, Adel A. ,  CAUDILLO, Roman ,  YOSCOVITS, Zachary R. ,  MICHALAK, David J. ,  PILLARISETTY, Ravi ,  GEORGE, Hubert C. ,  THOMAS, Nicole K. ,  SINGH, Kanwaljit

IPC: G06N99/00

CPC classification number: G06N10/00

Abstract: Embodiments of the present disclosure propose new microwave resonator structures for providing microwave connectivity to, from, and/or between qubits, or to set the frequencies that address individual qubits. An exemplary proposed resonator structure includes a resonant microwave transmission line having periodic high-impedance and low-impedance sections along at least a portion of the entire length of the line. In some embodiments, such sections can be implemented by providing periodic conductive elements which are substantially perpendicular to a signal line of a microwave transmission line. In various embodiments, the periodic conductive elements may be provided either in the same plane as the signal line, or in a plane below the signal line and separated from the signal line by a dielectric material. Fabrication techniques for forming such resonators are also disclosed.

公开(公告)号：WO2018119153A2

公开(公告)日：2018-06-28

申请号：PCT/US2017/067739

申请日：2017-12-20

Applicant: INTEL CORPORATION ,  INTEL IP CORPORATION ,  ALPMAN, Erkan ,  AMADJIKPE, Arnaud Lucres ,  OSAF, Omer ,  AZADET, Kameran ,  BANIN, Rotem ,  BARYAKH, Miroslav ,  BAZOV, Anat ,  BRENNA, Stefano ,  CASPER, Bryan K. ,  CHAKRABARTI, Anandaroop ,  CHANCE, Gregory ,  CHOUDHURY, Debabani ,  COHEN, Emanuel ,  DA SILVA, Claudio ,  DALMIA, Sidharth ,  DANESHGAR ASL, Saeid ,  DASGUPTA, Kaushik ,  DATTA, Kunal ,  DAVIS, Brandon ,  DEGANI, Ofir ,  FAHIM, Amr M. ,  FREIMAN, Amit ,  GENOSSAR, Michael ,  GERSON, Eran ,  GOLDBERGER, Eyal ,  GORDON, Eshel ,  GORDON, Meir ,  HAGN, Josef ,  KANG, Shinwon ,  KAO, Te Yu ,  KOGAN, Noam ,  KOMULAINEN, Mikko S. ,  KUSHNIR, Igal Yehuda ,  LAHTI, Saku ,  LAMPINEN, Mikko M. ,  LANDSBERG, Naftali ,  LEE, Wook Bong ,  LEVINGER, Run ,  MOLINA, Albert ,  MONTOYA MORENO, Resti ,  MUSAH, Tawfiq ,  NAREVSKY, Nathan G. ,  NIKOPOUR, Hosein ,  ORHAN, Oner ,  PALASKAS, Georgios ,  PELLERANO, Stefano ,  PONGRATZ, Ron ,  RAVI, Ashoke ,  RAVID, Shmuel ,  SAGAZIO, Peter Andrew ,  SASOGLU, Eren ,  SHAKEDD, Lior ,  SHOR, Gadi ,  SINGH, Baljit ,  SOFFER, Menashe ,  SOVER, Ra'anan ,  TALWAR, Shilpa ,  TANZI, Nebil ,  TEPLITSKY, Moshe ,  THAKKAR, Chintan S. ,  THAKUR, Jayprakash ,  TSARFATI, Avi ,  TSFATI, Yossi ,  VERHELST, Marian ,  WEISMAN, Nir ,  YAMADA, Shuhei ,  YEPES, Ana M. ,  KITCHIN, Duncan

Inventor： ALPMAN, Erkan ,  AMADJIKPE, Arnaud Lucres ,  OSAF, Omer ,  AZADET, Kameran ,  BANIN, Rotem ,  BARYAKH, Miroslav ,  BAZOV, Anat ,  BRENNA, Stefano ,  CASPER, Bryan K. ,  CHAKRABARTI, Anandaroop ,  CHANCE, Gregory ,  CHOUDHURY, Debabani ,  COHEN, Emanuel ,  DA SILVA, Claudio ,  DALMIA, Sidharth ,  DANESHGAR ASL, Saeid ,  DASGUPTA, Kaushik ,  DATTA, Kunal ,  DAVIS, Brandon ,  DEGANI, Ofir ,  FAHIM, Amr M. ,  FREIMAN, Amit ,  GENOSSAR, Michael ,  GERSON, Eran ,  GOLDBERGER, Eyal ,  GORDON, Eshel ,  GORDON, Meir ,  HAGN, Josef ,  KANG, Shinwon ,  KAO, Te Yu ,  KOGAN, Noam ,  KOMULAINEN, Mikko S. ,  KUSHNIR, Igal Yehuda ,  LAHTI, Saku ,  LAMPINEN, Mikko M. ,  LANDSBERG, Naftali ,  LEE, Wook Bong ,  LEVINGER, Run ,  MOLINA, Albert ,  MONTOYA MORENO, Resti ,  MUSAH, Tawfiq ,  NAREVSKY, Nathan G. ,  NIKOPOUR, Hosein ,  ORHAN, Oner ,  PALASKAS, Georgios ,  PELLERANO, Stefano ,  PONGRATZ, Ron ,  RAVI, Ashoke ,  RAVID, Shmuel ,  SAGAZIO, Peter Andrew ,  SASOGLU, Eren ,  SHAKEDD, Lior ,  SHOR, Gadi ,  SINGH, Baljit ,  SOFFER, Menashe ,  SOVER, Ra'anan ,  TALWAR, Shilpa ,  TANZI, Nebil ,  TEPLITSKY, Moshe ,  THAKKAR, Chintan S. ,  THAKUR, Jayprakash ,  TSARFATI, Avi ,  TSFATI, Yossi ,  VERHELST, Marian ,  WEISMAN, Nir ,  YAMADA, Shuhei ,  YEPES, Ana M. ,  KITCHIN, Duncan

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：WO2022139827A1

公开(公告)日：2022-06-30

申请号：PCT/US2020/066747

申请日：2020-12-23

Applicant: INTEL CORPORATION

Inventor： ACIKALIN, Tolga ,  YANG, Tae, Young ,  CHOUDHURY, Debabani ,  YAMADA, Shuhei ,  DOOSTNEJAD, Roya ,  NIKOPOUR, Hosein ,  KIPNIS, Issy ,  ORHAN, Oner ,  RAHMAN, Mehnaz ,  FOUST, Kenneth P. ,  HULL, Christopher, D. ,  KAMGAING, Telesphor ,  KARHADE, Omkar ,  PELLERANO, Stefano ,  SAGAZIO, Peter ,  VADLAMANI, Sai

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/532 ,  H01L23/66 ,  H01L23/498 ,  H01L23/48 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H01L23/50

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

公开(公告)号：WO2020050921A1

公开(公告)日：2020-03-12

申请号：PCT/US2019/043176

申请日：2019-07-24

Applicant: INTEL CORPORATION

Inventor： CALLENDER, Steven ,  HULL, Christopher ,  PELLERANO, Stefano ,  SHIN, Woorim ,  KWOK, Ka Chun

IPC: H04B1/44

Abstract: A transmit receive switch (TRSW) system is disclosed. The system has a transmission line, a transformer based matching network, a shunt switch, an amplifier and circuitry. The transmission line is connected to an antenna port. The transformer based matching network is connected to the transmission line and has a first coil and a second coil, wherein the second coil is connected to the transmission line. The amplifier can be configured as a shunt switch when inactive. The shunt switch, including the amplifier configured as the shunt switch, can be connected to the first coil of the transformer based matching network. The circuitry is configured to cause the shunt switch to be ON during an inactive mode and create a short across the first coil. Combined, the length of transmission line needed to complete the impedance transformation is reduced, thereby lowering the overall insertion loss of the transmit/receive switch.

公开(公告)号：WO2018182571A1

公开(公告)日：2018-10-04

申请号：PCT/US2017/024396

申请日：2017-03-28

Applicant: INTEL CORPORATION

Inventor： ROBERTS, Jeanette M. ,  PELLERANO, Stefano ,  CAUDILLO, Roman ,  YOSCOVITS, Zachary R. ,  CLARKE, James S. ,  ELSHERBINI, Adel A. ,  MICHALAK, David J. ,  PILLARISETTY, Ravi ,  GEORGE, Hubert C. ,  THOMAS, Nicole K. ,  SINGH, Kanwaljit

IPC: G06N99/00

CPC classification number: G06N10/00 ,  B82Y10/00 ,  G01R33/00 ,  G01R33/035 ,  H01L29/66977

Abstract: Embodiments of the present disclosure propose new flux bias line configurations for controlling frequencies of superconducting qubits. One exemplary proposed flux bias line structure includes a single center conductor line forming two partial loops. Another exemplary structure includes two separately driven center conductor lines, each of the two center conductor lines forming a respective partial loop. Yet another exemplary flux bias line structure includes a single center conductor line split into two center conductor lines, each of the two center conductor lines forming a respective partial loop and comprising a respective inductor loop. Such structures provide improvements over conventional flux bias lines in generating a magnetic field that can tune the frequency of a qubit with sufficient degree of control while ensuring that the magnetic field does not substantially affect other components of a quantum circuit.

公开(公告)号：WO2018160185A1

公开(公告)日：2018-09-07

申请号：PCT/US2017/020562

申请日：2017-03-03

Applicant: INTEL CORPORATION

Inventor： ROBERTS, Jeanette M. ,  PELLERANO, Stefano ,  YOSCOVITS, Zachary R. ,  CAUDILLO, Roman ,  CLARKE, James S. ,  ELSHERBINI, Adel A. ,  MICHALAK, David J. ,  PILLARISETTY, Ravi ,  GEORGE, Hubert C. ,  THOMAS, Nicole K. ,  SINGH, Kanwaljit

IPC: H01P3/00 ,  H01P3/12 ,  H01P3/16

CPC classification number: H01P3/006

Abstract: Described herein are new transmission line structures for use as resonators and non-resonant transmission lines in quantum circuits. In one aspect of the disclosure, a proposed structure includes a conductive shield structure provided over or in the substrate, a dielectric layer provided over the conductive shield structure, a first and a second ground plane structures provided over the dielectric layer, and a signal line structure provided over the dielectric layer, between the first and second ground plane structures. The conductive shield structure is electrically floating and each of the first and second ground plane structures and the signal line are provided opposite a respective portion of the conductive shield structure. Transmission line structures as proposed herein could be used for providing microwave connectivity to, from, or/and between the qubits, or to control the qubits. Methods for fabricating such structures are disclosed as well.

公开(公告)号：WO2022066176A1

公开(公告)日：2022-03-31

申请号：PCT/US2020/052944

申请日：2020-09-25

Applicant: INTEL CORPORATION ,  PELLERANO, Stefano ,  HULL, Christopher ,  MLADENOV, Todor ,  PARK, JongSeok ,  KLOCHKOV, Ilya ,  SUBRAMANIAN, Sushil

Inventor： PELLERANO, Stefano ,  HULL, Christopher ,  MLADENOV, Todor ,  PARK, JongSeok ,  KLOCHKOV, Ilya ,  SUBRAMANIAN, Sushil

IPC: G06N10/00 ,  B82Y10/00

Abstract: Apparatus and methods for interfacing an integrated qubit control chip and a solid state qubit; detecting a qubit state with a transition pulse histogram; high resolution and high speed rectangular pulse generation; large-scale spin qubit state readout; and activity-based clock control.

公开(公告)号：WO2021236143A1

公开(公告)日：2021-11-25

申请号：PCT/US2020/052423

申请日：2020-09-24

Applicant: INTEL CORPORATION

Inventor： SHIN, Woorim ,  PELLERANO, Stefano ,  LEVINGER, Run ,  LANDSBERG, Naftali ,  GORDON, Meir ,  WEISMAN, Nir ,  SHUMAKER, Evgeny ,  RAHMAN, Mustafijur ,  OHEV ZION, Dan ,  NAHMANNY, Danniel ,  HOROVITZ, Gil ,  BERSHANSKY, Sergey ,  ASAF, Omer

IPC: G01S7/03 ,  G01S13/931 ,  G01S7/40

Abstract: Some demonstrative aspects include radar apparatuses, devices, systems and methods. In one example, an apparatus may include a plurality of Transmit (Tx) chains to transmit radar Tx signals, and a plurality of Receive (Rx) chains to process radar Rx signals. For example, the radar Rx signals may be based on the radar Tx signals. The apparatus may be implemented, for example, as part of a radar device, for example, as part of a vehicle including the radar device. In other aspects, the apparatus may include any other additional or alternative elements and/or may be implemented as part of any other device.

公开(公告)号：WO2019055038A1

公开(公告)日：2019-03-21

申请号：PCT/US2017/051950

申请日：2017-09-18

Applicant: INTEL CORPORATION

Inventor： ROBERTS, Jeanette M. ,  HARRISON, Wesley T. ,  ELSHERBINI, Adel A. ,  PELLERANO, Stefano ,  YOSCOVITS, Zachary R. ,  LAMPERT, Lester ,  PILLARISETTY, Ravi ,  CAUDILLO, Roman ,  GEORGE, Hubert C. ,  THOMAS, Nicole K. ,  MICHALAK, David J. ,  SINGH, Kanwaljit ,  CLARKE, James S.

IPC: G06N99/00 ,  B82Y10/00

Abstract: Embodiments of the present disclosure propose qubit substrates, as well as methods of fabricating thereof and related device assemblies. In one aspect of the present disclosure, a qubit substrate includes a base substrate of a doped semiconductor material, and a layer of a substantially intrinsic semiconductor material over the base substrate. Engineering a qubit substrate in this manner allows improving coherence times of qubits provided thereon, while, at the same time, being sufficiently mechanically robust so that it can be efficiently used in large-scale manufacturing.