公开(公告)号：WO2019010049A1

公开(公告)日：2019-01-10

申请号：PCT/US2018/039889

申请日：2018-06-28

Applicant: INTEL CORPORATION ,  INTEL IP CORPORATION

Inventor： ALDANA, Carlos ,  BADIC, Biljana ,  CAVALCANTI, Dave ,  CHOUDHURY, Debabani ,  DREWES, Christian ,  FWU, Jong-Kae ,  GUNZELMANN, Bertram ,  HIMAYAT, Nageen ,  KARLS, Ingolf ,  KITCHIN, Duncan ,  MUECK, Markus, Dominik ,  RAAF, Bernhard ,  SIPRAK, Domagoj ,  SKINNER, Harry ,  STOBART, Christopher ,  TALWAR, Shilpa ,  YU, Zhibin

IPC: H04W74/08 ,  H04W72/04 ,  H04W4/08 ,  H04W4/40 ,  H04W4/80

Abstract: A communication device for a vehicular radio communications includes one or more processors configured to identify a plurality of vehicular communication devices that form a cluster of cooperating vehicular communication devices, determine channel resource allocations for the plurality of vehicular communication devices that includes channel resources allocated for a first vehicular radio communication technology and channel resources allocated for a second vehicular radio communication technology, and transmit the channel resource allocation to the plurality of vehicular communication devices.

公开(公告)号：WO2022139827A1

公开(公告)日：2022-06-30

申请号：PCT/US2020/066747

申请日：2020-12-23

Applicant: INTEL CORPORATION

Inventor： ACIKALIN, Tolga ,  YANG, Tae, Young ,  CHOUDHURY, Debabani ,  YAMADA, Shuhei ,  DOOSTNEJAD, Roya ,  NIKOPOUR, Hosein ,  KIPNIS, Issy ,  ORHAN, Oner ,  RAHMAN, Mehnaz ,  FOUST, Kenneth P. ,  HULL, Christopher, D. ,  KAMGAING, Telesphor ,  KARHADE, Omkar ,  PELLERANO, Stefano ,  SAGAZIO, Peter ,  VADLAMANI, Sai

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/532 ,  H01L23/66 ,  H01L23/498 ,  H01L23/48 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H01L23/50

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

公开(公告)号：WO2011075265A2

公开(公告)日：2011-06-23

申请号：PCT/US2010/057038

申请日：2010-11-17

Applicant: INTEL CORPORATION ,  CHOUDHURY, Debabani ,  ALLURI, Prasad

Inventor： CHOUDHURY, Debabani ,  ALLURI, Prasad

IPC: H01L27/02 ,  H01L25/16 ,  H01L23/02 ,  H01L23/34

CPC classification number: H01L23/5389 ,  C09K2219/03 ,  C09K2219/11 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/18 ,  H01L24/19 ,  H01L24/48 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/3025 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract translation: 根据本公开的各个方面，公开了一种装置，该装置包括：包括系统级封装体系结构的小型移动平台，所述系统级封装体系结构被布置为 层包括：具有第一适形材料的第一层; 具有第二适形材料的第二层; 具有第三材料的第三层; 以及嵌入在层堆叠内的一个或多个电子部件，其中第一可变形材料，第二可变形材料或二者被配置为允许高频信号路由。

公开(公告)号：WO2009114486A2

公开(公告)日：2009-09-17

申请号：PCT/US2009/036582

申请日：2009-03-09

Applicant: INTEL CORPORATION ,  CHOUDHURY, Debabani ,  ROBERTS, Richard, D. ,  KARACAOGLU, Ulun

Inventor： CHOUDHURY, Debabani ,  ROBERTS, Richard, D. ,  KARACAOGLU, Ulun

CPC classification number: H01Q1/246 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q3/34 ,  H01Q9/0407 ,  H01Q21/065 ,  H01Q21/067 ,  H01Q21/205 ,  H01Q21/24 ,  H01Q25/00 ,  H01Q25/04 ,  H04B7/0682

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

Abstract translation: 这里描述了实现三维波束覆盖的无线天线阵列系统的实施例。 其他实施例可以被描述和要求保护。

公开(公告)号：WO2009052029A1

公开(公告)日：2009-04-23

申请号：PCT/US2008/079561

申请日：2008-10-10

Applicant: INTEL CORPORATION ,  CHOUDHURY, Debabani ,  SUH, Seong-youp

Inventor： CHOUDHURY, Debabani ,  SUH, Seong-youp

IPC: H01P1/24 ,  H04B1/40

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q9/42

Abstract: Multi-band Front End Modules (FEMs) incorporate a multi-layer plastic substrate stack-up where metal layers are patterned on substrate layers in the stack-up to provide a compact, monopole-type antenna.

Abstract translation: 多频带前端模块（FEM）包括多层塑料基板叠层，其中金属层在叠层的基板层上被图案化以提供紧凑的单极型天线。

公开(公告)号：WO2019135736A1

公开(公告)日：2019-07-11

申请号：PCT/US2018/012133

申请日：2018-01-03

Applicant: INTEL CORPORATION

Inventor： CHOUDHURY, Debabani ,  YAMADA, Shuhei

IPC: H01Q3/26 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q5/40

CPC classification number: H01Q3/2647 ,  H01Q5/40 ,  H01Q9/0457 ,  H01Q21/065

Abstract: Systems, methods, and circuitries are disclosed for providing a retrodirective array. One example retrodirective array includes a plurality of dual-polarized antenna elements configured to receive a pilot signal having a first polarization and phase conjugation circuitry. The phase conjugation circuitry includes, for each of the plurality of antenna elements, a mixer configured to mix the pilot signal with an LO signal to generate a phase conjugated signal and excitation circuitry configured to generate an excitation signal for the antenna element to transmit the phase conjugated signal with a second polarization that is different from the first polarization.

公开(公告)号：WO2018119153A2

公开(公告)日：2018-06-28

申请号：PCT/US2017/067739

申请日：2017-12-20

Applicant: INTEL CORPORATION ,  INTEL IP CORPORATION ,  ALPMAN, Erkan ,  AMADJIKPE, Arnaud Lucres ,  OSAF, Omer ,  AZADET, Kameran ,  BANIN, Rotem ,  BARYAKH, Miroslav ,  BAZOV, Anat ,  BRENNA, Stefano ,  CASPER, Bryan K. ,  CHAKRABARTI, Anandaroop ,  CHANCE, Gregory ,  CHOUDHURY, Debabani ,  COHEN, Emanuel ,  DA SILVA, Claudio ,  DALMIA, Sidharth ,  DANESHGAR ASL, Saeid ,  DASGUPTA, Kaushik ,  DATTA, Kunal ,  DAVIS, Brandon ,  DEGANI, Ofir ,  FAHIM, Amr M. ,  FREIMAN, Amit ,  GENOSSAR, Michael ,  GERSON, Eran ,  GOLDBERGER, Eyal ,  GORDON, Eshel ,  GORDON, Meir ,  HAGN, Josef ,  KANG, Shinwon ,  KAO, Te Yu ,  KOGAN, Noam ,  KOMULAINEN, Mikko S. ,  KUSHNIR, Igal Yehuda ,  LAHTI, Saku ,  LAMPINEN, Mikko M. ,  LANDSBERG, Naftali ,  LEE, Wook Bong ,  LEVINGER, Run ,  MOLINA, Albert ,  MONTOYA MORENO, Resti ,  MUSAH, Tawfiq ,  NAREVSKY, Nathan G. ,  NIKOPOUR, Hosein ,  ORHAN, Oner ,  PALASKAS, Georgios ,  PELLERANO, Stefano ,  PONGRATZ, Ron ,  RAVI, Ashoke ,  RAVID, Shmuel ,  SAGAZIO, Peter Andrew ,  SASOGLU, Eren ,  SHAKEDD, Lior ,  SHOR, Gadi ,  SINGH, Baljit ,  SOFFER, Menashe ,  SOVER, Ra'anan ,  TALWAR, Shilpa ,  TANZI, Nebil ,  TEPLITSKY, Moshe ,  THAKKAR, Chintan S. ,  THAKUR, Jayprakash ,  TSARFATI, Avi ,  TSFATI, Yossi ,  VERHELST, Marian ,  WEISMAN, Nir ,  YAMADA, Shuhei ,  YEPES, Ana M. ,  KITCHIN, Duncan

Inventor： ALPMAN, Erkan ,  AMADJIKPE, Arnaud Lucres ,  OSAF, Omer ,  AZADET, Kameran ,  BANIN, Rotem ,  BARYAKH, Miroslav ,  BAZOV, Anat ,  BRENNA, Stefano ,  CASPER, Bryan K. ,  CHAKRABARTI, Anandaroop ,  CHANCE, Gregory ,  CHOUDHURY, Debabani ,  COHEN, Emanuel ,  DA SILVA, Claudio ,  DALMIA, Sidharth ,  DANESHGAR ASL, Saeid ,  DASGUPTA, Kaushik ,  DATTA, Kunal ,  DAVIS, Brandon ,  DEGANI, Ofir ,  FAHIM, Amr M. ,  FREIMAN, Amit ,  GENOSSAR, Michael ,  GERSON, Eran ,  GOLDBERGER, Eyal ,  GORDON, Eshel ,  GORDON, Meir ,  HAGN, Josef ,  KANG, Shinwon ,  KAO, Te Yu ,  KOGAN, Noam ,  KOMULAINEN, Mikko S. ,  KUSHNIR, Igal Yehuda ,  LAHTI, Saku ,  LAMPINEN, Mikko M. ,  LANDSBERG, Naftali ,  LEE, Wook Bong ,  LEVINGER, Run ,  MOLINA, Albert ,  MONTOYA MORENO, Resti ,  MUSAH, Tawfiq ,  NAREVSKY, Nathan G. ,  NIKOPOUR, Hosein ,  ORHAN, Oner ,  PALASKAS, Georgios ,  PELLERANO, Stefano ,  PONGRATZ, Ron ,  RAVI, Ashoke ,  RAVID, Shmuel ,  SAGAZIO, Peter Andrew ,  SASOGLU, Eren ,  SHAKEDD, Lior ,  SHOR, Gadi ,  SINGH, Baljit ,  SOFFER, Menashe ,  SOVER, Ra'anan ,  TALWAR, Shilpa ,  TANZI, Nebil ,  TEPLITSKY, Moshe ,  THAKKAR, Chintan S. ,  THAKUR, Jayprakash ,  TSARFATI, Avi ,  TSFATI, Yossi ,  VERHELST, Marian ,  WEISMAN, Nir ,  YAMADA, Shuhei ,  YEPES, Ana M. ,  KITCHIN, Duncan

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：WO2014088635A1

公开(公告)日：2014-06-12

申请号：PCT/US2013/044080

申请日：2013-06-04

Applicant: INTEL CORPORATION

Inventor： CHOUDHURY, Debabani ,  YEPES, Ana ,  GOWDA, Vinay

IPC: H01Q5/01 ,  H01Q1/24

CPC classification number: H01Q13/106 ,  H01Q1/243 ,  H01Q5/321 ,  H01Q5/357 ,  H01Q9/40 ,  H01Q9/42

Abstract: Embodiments of a folded meta-inspired antenna for dual-band operation and user equipment for dual-band operation in a wireless network are generally described herein. In some embodiments, the folded meta-inspired antenna may include first and second conductive layers disposed on opposite sides of a substrate to provide a wideband distributed structure comprising a plurality of high-Q resonances resulting from, at least in part, metamaterial-based loading. Conductive material on the first side of the substrate is arranged around a central longitudinal slot coupled with a plurality of perpendicular slots. For dual-band operation, the folded meta-inspired antenna may operate as a folded monopole at a higher frequency band and operate as a slot-type radiator at a lower frequency band. The plurality of resonances may cause the folded meta-inspired antenna to achieve broader bandwidth at both lower and higher frequency bands.

Abstract translation: 用于双频带操作的折叠元启发天线和用于无线网络中的双频带操作的用户设备的实施例在此通常被描述。 在一些实施例中，折叠的元启发天线可以包括设置在衬底的相对侧上的第一和第二导电层，以提供宽带分布式结构，其包括由至少部分地基于超材料的负载产生的多个高Q谐振 。 基板第一侧上的导电材料围绕与多个垂直槽耦合的中心纵向槽布置。 对于双频段操作，折叠的元启发天线可以作为较高频带处的折叠单极子操作，并且作为较低频带处的时隙型辐射器工作。 多个谐振可能导致折叠的元启发天线在较低频段和较高频带处实现更宽的带宽。

公开(公告)号：WO2021133408A1

公开(公告)日：2021-07-01

申请号：PCT/US2019/068676

申请日：2019-12-27

Applicant: INTEL CORPORATION

Inventor： CHOUDHURY, Debabani ,  CAMACHO PEREZ, Jose Rodrigo ,  YAMADA, Shuhei ,  SKINNER, Harry ,  BURGER, Vida Ilderem ,  HORINE, Bryce

IPC: H01Q1/32 ,  H04W4/40 ,  H01Q21/24

Abstract: Various antennas elements including antennas arrays can support various communication technologies and can be integrated into different components or subcomponents of a vehicle, including various vehicle light assemblies. The vehicular antennas elements include low profile and/or concealed antenna elements that are inconspicuous aesthetically and do not affect or substantially affect vehicle aerodynamics.

公开(公告)号：WO2010078215A2

公开(公告)日：2010-07-08

申请号：PCT/US2009/069516

申请日：2009-12-23

Applicant: INTEL CORPORATION ,  CHOUDHURY, Debabani ,  PERRY, Richard, S.

Inventor： CHOUDHURY, Debabani ,  PERRY, Richard, S.

IPC: H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q3/26 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01Q1/02 ,  H01Q21/0025 ,  H01Q21/065 ,  H01Q23/00 ,  H01L2224/0401

Abstract: Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

Abstract translation: 公开了使用多层衬底技术的毫米波平面相控阵列型结构的集成方法。 例如，设备可以包括多个基板层，集成电路和连接器模块。 多个衬底层包括具有一个或多个相控阵列元件的第一衬底层。 集成电路与一个或多个相控阵列元件交换一个或多个射频（RF）信号（例如，毫米波信号）。 连接器模块与对应于一个或多个RF信号的集成电路交换进一步的信号。 例如，这些另外的信号可以是基带或中频（IF）信号。