公开(公告)号：WO2019023078A1

公开(公告)日：2019-01-31

申请号：PCT/US2018/043186

申请日：2018-07-20

申请人： LOCKHEED MARTIN CORPORATION

发明人： STOLTENBERG, Randall Mark ,  ZINN, Alfred

IPC分类号： H01R4/04 ,  C08K3/08 ,  H01B9/00

摘要： A cable can be used to facilitate electrical connections between electrical components. The cable can include a plurality of cable strands forming a void space. An adhesive paste can be applied within the void space. The adhesive paste can include a plurality of metallic nanoparticles. The metallic nanoparticles can fuse with each other and with the plurality of cable strands when energy is applied the connector and the cable. The metallic nanoparticles can include a surfactant, which can be displaced as pressure is applied. Heat can be applied to the adhesive paste to fuse the metallic nanoparticles.

公开(公告)号：WO2017031222A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/047388

申请日：2016-08-17

申请人： LOCKHEED MARTIN CORPORATION

发明人： STOLTENBERG, Randall Mark ,  ZINN, Alfred A.

IPC分类号： B23K37/00 ,  B23K31/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45193 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49096 ,  H01L2224/49175 ,  H01L2224/7815 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78601 ,  H01L2224/78611 ,  H01L2224/8502 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2224/8593 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/05599 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2224/85399

摘要： Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

摘要翻译： 通过使用金属纳米颗粒组合物可以促进引线接合操作。 在这方面，可以提高球接合和楔接合工艺。 引线接合方法可以包括通过分配头在轧制线源的第一位置提供电线支付，使第一金属纳米颗粒组合物和电线支付的第一部分与焊盘接触，并且至少部分地将金属纳米颗粒 所述第一金属纳米颗粒组合物一起在所述接合焊盘和所述电线支付的所述第一部分之间形成粘合界面。 粘附界面可以具有纳米颗粒形态。 引线接合系统可以包括卷绕的线源，被配置为提供引线支撑的分配头，以及施用器，其被配置为将金属纳米颗粒组合物放置在至少一部分导线支撑上或者在接合焊盘上。

公开(公告)号：WO2015116857A2

公开(公告)日：2015-08-06

申请号：PCT/US2015/013599

申请日：2015-01-29

申请人： LOCKHEED MARTIN CORPORATION

发明人： SINSABAUGH, Steven Lloyd ,  BEDWORTH, Peter V. ,  CASEY, David Francis, Jr. ,  HEISE, Scott E. ,  SINTON, Steven W. ,  STOLTENBERG, Randall Mark ,  SWETT, Jacob Louis

IPC分类号： B01D39/20 ,  B01D39/16

CPC分类号： B01D67/0069 ,  B01D67/0004 ,  B01D67/002 ,  B01D67/003 ,  B01D67/0034 ,  B01D67/0037 ,  B01D67/0053 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D69/02 ,  B01D69/10 ,  B01D71/021 ,  B01D2323/39 ,  B01D2325/24

摘要： It can be difficult to remove atomically thin films, such as graphene, graphene-based material and other two-dimensional materials, from a growth substrate and then to transfer the thin films to a secondary substrate. Tearing and conformality issues can arise during the removal and transfer processes. Processes for forming a composite structure by manipulating a two-dimensional material, such as graphene or graphene-base material, can include: providing a two-dimensional material adhered to a growth substrate; depositing a supporting layer on the two-dimensional material while the two-dimensional material is adhered to the growth substrate; and releasing the two-dimensional material from the growth substrate, the two-dimensional material remaining in contact with the supporting layer following release of the two-dimensional material from the growth substrate.

摘要翻译： 可能难以从生长衬底去除诸如石墨烯，石墨烯基材料和其他二维材料的原子性薄膜，然后将薄膜转移到第二衬底。 拆卸和转移过程中可能会出现撕裂和保形问题。 通过操作诸如石墨烯或石墨烯基材料的二维材料来形成复合结构的工艺可以包括：提供粘附到生长基板的二维材料; 在所述二维材料粘附到所述生长基底上的同时在所述二维材料上沉积支撑层; 和从生长基底释放二维材料，二维材料在从生长基底释放二维材料之后保持与支撑层接触。