公开(公告)号：WO2006048845A3

公开(公告)日：2006-08-03

申请号：PCT/IB2005053624

申请日：2005-11-04

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L23/495 ,  C01B31/02 ,  H01L21/60 ,  H01L23/498

CPC classification number: B82Y30/00 ,  B82Y10/00 ,  H01L23/49579 ,  H01L23/49877 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/45193 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49162 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with another material (130, 125) such as a metal. The carbon nanotube material facilitates the electrical connection between different circuit components. Exemples include bond wires, leadframes and circuit board interconnects.

Abstract translation: 利用碳纳米管促进集成电路布置中的电连接。 根据各种示例性实施例，碳纳米管材料（120,135）与诸如金属的另一材料（130,125）相关联。 碳纳米管材料有助于不同电路部件之间的电连接。 示例包括接合线，引线框和电路板互连。

公开(公告)号：WO2006048845A2

公开(公告)日：2006-05-11

申请号：PCT/IB2005/053624

申请日：2005-11-04

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  WYLAND, Chris

Inventor： WYLAND, Chris

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/60 ,  C01B31/02

CPC classification number: B82Y30/00 ,  B82Y10/00 ,  H01L23/49579 ,  H01L23/49877 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/45193 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49162 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with another material (130, 125) such as a metal. The carbon nanotube material facilitates the electrical connection between different circuit components.

Abstract translation: 利用碳纳米管促进集成电路布置中的电连接。 根据各种示例性实施例，碳纳米管材料（120,135）与诸如金属的另一材料（130,125）相关联。 碳纳米管材料有助于不同电路部件之间的电连接。

公开(公告)号：WO2017031222A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/047388

申请日：2016-08-17

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： STOLTENBERG, Randall Mark ,  ZINN, Alfred A.

IPC: B23K37/00 ,  B23K31/00

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45193 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49096 ,  H01L2224/49175 ,  H01L2224/7815 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78601 ,  H01L2224/78611 ,  H01L2224/8502 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2224/8593 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/05599 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2224/85399

Abstract: Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

Abstract translation: 通过使用金属纳米颗粒组合物可以促进引线接合操作。 在这方面，可以提高球接合和楔接合工艺。 引线接合方法可以包括通过分配头在轧制线源的第一位置提供电线支付，使第一金属纳米颗粒组合物和电线支付的第一部分与焊盘接触，并且至少部分地将金属纳米颗粒 所述第一金属纳米颗粒组合物一起在所述接合焊盘和所述电线支付的所述第一部分之间形成粘合界面。 粘附界面可以具有纳米颗粒形态。 引线接合系统可以包括卷绕的线源，被配置为提供引线支撑的分配头，以及施用器，其被配置为将金属纳米颗粒组合物放置在至少一部分导线支撑上或者在接合焊盘上。