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1.发明申请
公开(公告)号：WO2008021860A3
公开(公告)日：2008-10-23
申请号：PCT/US2007075437
申请日：2007-08-08
Applicant: TEXAS INSTRUMENTS INC , PIRKLE REX W , MALOLEPSZY SEAN M
Inventor： PIRKLE REX W , MALOLEPSZY SEAN M
CPC classification number: H01L21/6715 , H01L21/56 , H01L21/67005 , H01L24/85 , H01L2224/78301 , H01L2224/8502 , H01L2924/00014 , H01L2924/14 , H01L2924/3025 , Y10S438/958 , Y10T29/49201 , Y10T29/49224 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: The invention provides a process (100) by which an integrated circuit chip (110) has a layer of overcoat material ( 130), such as a stress buffer layer, deposited on a portion of its surface prior to molding of the chip. The surface portion of the chip that is covered in the overcoat is selected based upon the configuration of the chip. For example, only those areas of the chip that are sensitive to pressure could be coated while the areas that are not sensitive to pressure are not coated. The layer of overcoat material is deposited as the deposit head (160) follows a path over the region of the surface to be covered.
Abstract translation: 本发明提供一种方法（100），其中集成电路芯片（110）通过该工艺（100）在芯片成型之前具有沉积在其表面的一部分上的外涂层材料层（130），例如应力缓冲层。 基于芯片的配置选择覆盖在外涂层中的芯片的表面部分。 例如，只有对压力敏感的芯片的那些区域可以被涂覆，而不对压力敏感的区域没有被涂覆。 当沉积头（160）沿着要覆盖的表面的区域上的路径时，沉积涂层材料层。
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公开(公告)号：WO2017031222A1
公开(公告)日：2017-02-23
申请号：PCT/US2016/047388
申请日：2016-08-17
Applicant: LOCKHEED MARTIN CORPORATION
Inventor： STOLTENBERG, Randall Mark , ZINN, Alfred A.
CPC classification number: H01L24/85 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45193 , H01L2224/45664 , H01L2224/48091 , H01L2224/48465 , H01L2224/49096 , H01L2224/49175 , H01L2224/7815 , H01L2224/7825 , H01L2224/78301 , H01L2224/78601 , H01L2224/78611 , H01L2224/8502 , H01L2224/851 , H01L2224/85205 , H01L2224/8584 , H01L2224/8593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2224/05599 , H01L2924/20751 , H01L2924/20752 , H01L2224/85399
Abstract: Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.
Abstract translation: 通过使用金属纳米颗粒组合物可以促进引线接合操作。 在这方面，可以提高球接合和楔接合工艺。 引线接合方法可以包括通过分配头在轧制线源的第一位置提供电线支付，使第一金属纳米颗粒组合物和电线支付的第一部分与焊盘接触，并且至少部分地将金属纳米颗粒 所述第一金属纳米颗粒组合物一起在所述接合焊盘和所述电线支付的所述第一部分之间形成粘合界面。 粘附界面可以具有纳米颗粒形态。 引线接合系统可以包括卷绕的线源，被配置为提供引线支撑的分配头，以及施用器，其被配置为将金属纳米颗粒组合物放置在至少一部分导线支撑上或者在接合焊盘上。
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Patent Agency Ranking3.发明申请
公开(公告)号：WO2017117537A1
公开(公告)日：2017-07-06
申请号：PCT/US2016/069510
申请日：2016-12-30
Inventor： LIN, Yong , ZHANG, Rongwei , COOK, Benjamin, Stassen , CASTRO, Abram
CPC classification number: H01L21/50 , H01L23/3107 , H01L23/3142 , H01L23/49513 , H01L23/49548 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2021/60277 , H01L2224/2919 , H01L2224/296 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48996 , H01L2224/49171 , H01L2224/73265 , H01L2224/80856 , H01L2224/83192 , H01L2224/8392 , H01L2224/83951 , H01L2224/8502 , H01L2224/85051 , H01L2224/92247 , H01L2924/00014 , H01L2924/14 , H01L2924/3511 , H01L2924/35121 , H01L2224/45099 , H01L2924/0665
Abstract: In described examples, a method (400) includes applying a die attach material to a die pad of an integrated circuit (410). The die attach material is employed as a bonding material to the die pad. The method (400) includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material (420). The method (400) includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad (430).
Abstract translation: 在所描述的示例中，方法（400）包括将管芯附着材料施加到集成电路（410）的管芯焊盘上。 芯片附着材料被用作芯片焊盘的结合材料。 该方法（400）包括经由管芯附接材料（420）将集成电路管芯安装到集成电路的管芯焊盘。 方法（400）包括在出现在集成电路管芯和集成电路的管芯焊盘的界面处的管芯附着材料上印刷粘附沉积材料，以减轻集成电路管芯和管芯焊盘（430）之间的分层。 / p>
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公开(公告)号：WO2010020753A2
公开(公告)日：2010-02-25
申请号：PCT/GB2009/001966
申请日：2009-08-11
Applicant: SEMBLANT LIMITED , HUMPHRIES, Mark, Robson , FERDINANDI, Frank , SMITH, Rodney, Edward
Inventor： HUMPHRIES, Mark, Robson , FERDINANDI, Frank , SMITH, Rodney, Edward
IPC: H05K3/28
CPC classification number: H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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公开(公告)号：WO2010020753A3
公开(公告)日：2010-06-24
申请号：PCT/GB2009001966
申请日：2009-08-11
Applicant: SEMBLANT LTD , HUMPHRIES MARK ROBSON , FERDINANDI FRANK , SMITH RODNEY EDWARD
Inventor： HUMPHRIES MARK ROBSON , FERDINANDI FRANK , SMITH RODNEY EDWARD
IPC: H05K3/28 , C12Q1/00 , H01H13/70 , H01L23/485 , H05K3/34
CPC classification number: H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
Abstract translation: 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB进一步包括附着到衬底的至少一个表面的多个导电迹线。 PCB还包括沉积在基底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，并且（ii）包括至少一个由卤代烃聚合物形成的层。 所述PCB还包括至少一个电子部件，所述至少一个电子部件通过焊点连接到至少一个导电轨道，其中所述焊点焊接穿过所述多层涂层，使得所述焊点邻接所述多层涂层。
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6.发明申请
公开(公告)号：WO2008021860A2
公开(公告)日：2008-02-21
申请号：PCT/US2007/075437
申请日：2007-08-08
Applicant: TEXAS INSTRUMENTS INCORPORATED , PIRKLE, Rex, W. , MALOLEPSZY, Sean, M.
Inventor： PIRKLE, Rex, W. , MALOLEPSZY, Sean, M.
IPC: H01L23/58
CPC classification number: H01L21/6715 , H01L21/56 , H01L21/67005 , H01L24/85 , H01L2224/78301 , H01L2224/8502 , H01L2924/00014 , H01L2924/14 , H01L2924/3025 , Y10S438/958 , Y10T29/49201 , Y10T29/49224 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: The invention provides a process (100) for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip (110) based upon the configuration.
Abstract translation: 本发明提供了一种用于制造集成电路（IC）封装和集成电路（IC）封装的工艺（100）。 该方法，但不限于，包括提供具有构造的集成电路芯片，并且基于该配置在集成电路芯片（110）上形成覆盖层材料层。
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公开(公告)号：WO1998032168A1
公开(公告)日：1998-07-23
申请号：PCT/GB1997003544
申请日：1997-12-24
Applicant: FORD MOTOR COMPANY , FORD MOTOR COMPANY LIMITED
Inventor： FORD MOTOR COMPANY , FORD MOTOR COMPANY LIMITED , PHAM, Cuong, Van , BAKER, Jay, DeAvis , NUNO, Rose, Lynda
IPC: H01L21/607
CPC classification number: H01L24/85 , B23K20/007 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/06135 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48505 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48744 , H01L2224/48824 , H01L2224/48844 , H01L2224/49175 , H01L2224/78268 , H01L2224/78301 , H01L2224/78313 , H01L2224/78318 , H01L2224/85001 , H01L2224/8502 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85444 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2224/05655 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
Abstract: A method is disclosed for on-line doping of metallic connecting wire for use in integrated circuits. The method comprises the steps of: providing a bonding apparatus (70) comprising a bonding tool (40), said bonding tool having a tip (44) through which a capillary (42) runs, such that metallic connecting wire (20) may be fed through said tip (44); extending an end of the connecting wire (20) a predetermined length beyond the tip (44) of said bonding tool (40); and forming a doped area on the end of said wire by: bringing the end of said wire into contact with dopant material (52), and applying predetermined amounts of pressure, heat, and ultrasonic vibration to said end of the wire (20) for a predetermined amount of time.
Abstract translation: 公开了用于在集成电路中使用的金属连接线的在线掺杂的方法。 该方法包括以下步骤：提供包括接合工具（40）的接合装置（70），所述接合工具具有尖端（44），毛细管（42）穿过该尖端，使得金属连接线（20）可以是 馈送通过所述尖端（44）; 将所述连接线（20）的端部延伸超过所述接合工具（40）的尖端（44）的预定长度; 以及通过以下方式在所述导线的端部上形成掺杂区域：使所述导线的端部与掺杂剂材料（52）接触，并且向所述导线（20）的所述端部施加预定量的压力，热和超声波振动 预定的时间量。
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