公开(公告)号：WO2004112094A2

公开(公告)日：2004-12-23

申请号：PCT/US2004017864

申请日：2004-06-07

Applicant: FREESCALE SEMICONDUCTOR INC ,  WENZEL ROBERT J ,  HARPER PETER R

Inventor： WENZEL ROBERT J ,  HARPER PETER R

IPC: H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50 ,  H01L23/66 ,  H01L

CPC classification number: H01L24/06 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/66 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05082 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/0616 ,  H01L2224/06163 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48233 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48601 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48701 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48801 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49052 ,  H01L2224/49096 ,  H01L2224/49097 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49179 ,  H01L2224/49431 ,  H01L2224/854 ,  H01L2224/85401 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00013

Abstract: Closely-spaced bonding wires may be used in a variety of different packaging applications to achieve improved electrical performance. In one embodiment, two adjacent bonding wires within a wire grouping are closely-spaced if a separation distance D between the two adjacent wires is met for at least 50 percent of the length of the shorter of the two adjacent wires. In one embodiment, the separation distance D is at most two times a diameter of the wire having the larger diameter of the two adjacent wires. In another embodiment, the separation distance D is at most three times a wire-to-wire pitch between the two adjacent wires. Each wire grouping may include two of more closely-spaced wires. Wire groupings of closely-spaced bonding wires may be used to form, for example, power-signal-ground triplets, signal-ground pairs, signal-power pairs, or differential signal pairs or triplets.

Abstract translation: 紧密间隔的接合线可用于各种不同的包装应用中，以实现改进的电气性能。 在一个实施例中，如果两条相邻导线之间的间隔距离D达到两条相邻导线中较短的长度的至少50％，则导线组内的两个相邻接合线是紧密间隔的。 在一个实施例中，分离距离D为具有两个相邻线的较大直径的线的直径的至多两倍。 在另一个实施例中，分离距离D至少为两条相邻线之间的线对线间距的三倍。 每个线分组可以包括两个更紧密间隔的导线。 紧密间隔的接合线的电线组可以用于形成例如功率 - 信号 - 接地三联体，信号 - 接地对，信号 - 功率对或差分信号对或三元组。

公开(公告)号：WO2015067985A1

公开(公告)日：2015-05-14

申请号：PCT/IB2013/002732

申请日：2013-11-07

Applicant: FREESCALE SEMICONDUCTOR, INC. ,  VOLOKHINE, Youri

Inventor： VOLOKHINE, Youri

IPC: H01L21/60

CPC classification number: H03K17/689 ,  H01L23/66 ,  H01L24/05 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/09505 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/49052 ,  H01L2224/49096 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03F3/193 ,  H03F3/213 ,  H03F2200/411 ,  H03F2200/451 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The invention provides a bond wire arrangement comprising a signal bond wire (1) for operably connecting a first electronic device (6) to a second electronic device (8), and a control bond wire (2) being arranged alongside the signal bond wire at a distance so as to have a magnetic coupling with the signal bond wire (1), and having a first end (11) coupled to ground, and a second end (12) coupled to ground via a resistive element (14). The proposed solution allows the control of the Q factor (losses) of wire bond inductors during assembly phase, which will save time and reduce overall design cycle as compared to known methods.

Abstract translation: 本发明提供了一种接合线布置，其包括用于将第一电子设备（6）可操作地连接到第二电子设备（8）的信号接合线（1），以及控制接合线（2），其沿着信号接合线 距离，以便与信号接合线（1）具有磁耦合，并且具有耦合到地的第一端（11）和经由电阻元件（14）耦合到地的第二端（12）。 所提出的解决方案允许在组装阶段控制引线接合电感器的Q因子（损耗），与已知方法相比，这将节省时间并减少总体设计周期。

公开(公告)号：WO2017031222A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/047388

申请日：2016-08-17

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： STOLTENBERG, Randall Mark ,  ZINN, Alfred A.

IPC: B23K37/00 ,  B23K31/00

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45193 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49096 ,  H01L2224/49175 ,  H01L2224/7815 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78601 ,  H01L2224/78611 ,  H01L2224/8502 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2224/8593 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/05599 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2224/85399

Abstract: Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in this respect. Wire bonding methods can include providing a wire payout at a first location from a rolled wire source via a dispensation head, contacting a first metal nanoparticle composition and a first portion of the wire payout with a bonding pad, and at least partially fusing metal nanoparticles in the first metal nanoparticle composition together to form an adhering interface between the bonding pad and the first portion of the wire payout. The adhering interface can have a nanoparticulate morphology. Wire bonding systems can include a rolled wire source, a dispensation head configured to provide a wire payout, and an applicator configured to place a metal nanoparticle composition upon at least a portion of the wire payout or upon a bonding pad.

Abstract translation: 通过使用金属纳米颗粒组合物可以促进引线接合操作。 在这方面，可以提高球接合和楔接合工艺。 引线接合方法可以包括通过分配头在轧制线源的第一位置提供电线支付，使第一金属纳米颗粒组合物和电线支付的第一部分与焊盘接触，并且至少部分地将金属纳米颗粒 所述第一金属纳米颗粒组合物一起在所述接合焊盘和所述电线支付的所述第一部分之间形成粘合界面。 粘附界面可以具有纳米颗粒形态。 引线接合系统可以包括卷绕的线源，被配置为提供引线支撑的分配头，以及施用器，其被配置为将金属纳米颗粒组合物放置在至少一部分导线支撑上或者在接合焊盘上。