公开(公告)号：WO2017048388A1

公开(公告)日：2017-03-23

申请号：PCT/US2016/045255

申请日：2016-08-03

申请人： MICRON TECHNOLOGY, INC.

发明人： MARIOTTINI, Giorgio ,  VADHAVKAR, Sameer ,  HUANG, Wayne ,  CHANDOLU, Anilkumar ,  BOSSLER, Mark

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/488 ,  H01L21/60

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02126 ,  H01L2224/02135 ,  H01L2224/0219 ,  H01L2224/03013 ,  H01L2224/0346 ,  H01L2224/03472 ,  H01L2224/0361 ,  H01L2224/03906 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/05687 ,  H01L2224/10145 ,  H01L2224/114 ,  H01L2224/11472 ,  H01L2224/13018 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/94 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/3651 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/053

摘要： The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.

摘要翻译： 本技术涉及制造用于管芯到管芯和/或封装到封装互连及相关系统的凸块下金属（UBM）结构的套圈。 半导体管芯包括具有固态部件的半导体材料和至少部分延伸穿过半导体材料的互连。 在半导体材料之上形成凸块下金属（UBM）结构，并且电耦合到相应的互连。 套环围绕UBM结构的侧表面的至少一部分，并且焊料材料设置在UBM结构的顶表面上。