公开(公告)号：WO2021076274A1

公开(公告)日：2021-04-22

申请号：PCT/US2020/051727

申请日：2020-09-21

申请人： MICRON TECHNOLOGY, INC.

发明人： FAY, Owen R. ,  RICHARDS, Randon K. ,  LIMAYE, Aparna U. ,  LIM, Dong Soon ,  YOO, Chan H. ,  STREET, Bret K. ,  NAKANO, Eiichi ,  LUO, Shijian

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/525 ,  H01L23/528 ,  H01L23/48 ,  H01L23/60

摘要： Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.

公开(公告)号：WO2021252188A1

公开(公告)日：2021-12-16

申请号：PCT/US2021/034194

申请日：2021-05-26

申请人： MICRON TECHNOLOGY, INC.

发明人： FAY, Owen R. ,  RICHARDS, Randon K. ,  LIMAYE, Aparna U. ,  LIM, Dong Soon ,  YOO, Chan H. ,  STREET, Bret K. ,  NAKANO, Eiichi ,  LUO, Shijian

IPC分类号： H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/552 ,  H01L23/66 ,  H01L23/34 ,  H01L25/18 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1047 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/5384 ,  H01L24/10 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50

摘要： Disclosed are microelectronic device assemblies comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device having bond pads operably coupled to conductive traces in contact with the microelectronic devices and extending over a dielectric material to conductive via locations beyond at least one side of the stack for routing power and ground/bias extending through the dielectric materials to contact exposed conductors of the substrate. Data signals are routed between and through microelectronic devices of the stack by structure for data signal communication. Methods of fabrication and related electronic systems are also disclosed.

公开(公告)号：WO2020132277A1

公开(公告)日：2020-06-25

申请号：PCT/US2019/067534

申请日：2019-12-19

申请人： MICRON TECHNOLOGY, INC.

发明人： KINSLEY, Thomas H. ,  PAX, George E. ,  SHARMA, Yogesh ,  KING, Gregory A. ,  YOO, Chan H. ,  RICHARDS, Randon K. ,  HOLLIS, Timothy M. ,  STAVE, Eric J.

IPC分类号： G06F13/16 ,  G06F13/42 ,  G06F12/02 ,  G06F11/10 ,  G06F5/06

摘要： An apparatus is provided, comprising a plurality of memory devices and a buffering device that permits memory devices with a variety of physical dimensions and memory formats to be used in an industry-standard memory module format. The buffering device includes memory interface circuitry and at least one first-in first-out (FIFO) or multiplexer circuit. The apparatus further comprises a parallel bus connecting the buffering device to the plurality of memory devices. The parallel bus includes a plurality of independent control lines, each coupling the memory interface circuitry to a corresponding subset of a plurality of first subsets of the plurality of memory devices. The parallel bus further includes a plurality of independent data channels, each coupling the at least one FIFO circuit or multiplexer circuit to a corresponding subset of a plurality of second subsets of the plurality of memory devices.