中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

31 records (took 0.012 seconds)

    SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE
    1.
    发明申请
    SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE 审中-公开
    集成电路设备的提供机制

    公开(公告)号：WO2006022597A2

    公开(公告)日：2006-03-02

    申请号：PCT/SG2005/000288

    申请日：2005-08-23

    Applicant: ROKKO SYSTEMS PTE LTD ,  YANG, Hae Choon

    Inventor： YANG, Hae Choon

    IPC: H01L21/304 ,  H01L21/677 ,  B28D5/02

    CPC classification number: H01L21/67144 ,  B28D5/0082 ,  B28D5/0094 ,  H01L21/67092 ,  H01L21/78

    Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).

    Abstract translation: 用于切割基板以对其内的集成电路单元进行切割的系统包括与卡盘台（4）一起操作的切割机（Z）。 提升组件（Ax，Ay）基本上同时从基板（4）移除先前分离的单元的同时将衬底分离到卡盘台（4）上。

    PROCESSING SYSTEM AND METHOD FOR LARGE SCALE SUBSTRATES
    2.
    发明申请
    PROCESSING SYSTEM AND METHOD FOR LARGE SCALE SUBSTRATES 审中-公开
    大规模基板的加工系统和方法

    公开(公告)号：WO2016105277A1

    公开(公告)日：2016-06-30

    申请号：PCT/SG2015/050243

    申请日：2015-07-30

    Applicant: ROKKO SYSTEMS PTE LTD

    Inventor： SHIN, Yun Suk ,  JUNG, Jong Jae ,  BAEK, Seung Ho

    IPC: H01L21/68 ,  H01L21/304 ,  H01L21/67

    CPC classification number: H01L21/67144 ,  H01L24/97 ,  H01L2924/14

    Abstract: An alignment assembly for aligning a plurality of IC units, the assembly comprising: a plate having vacuum apertures for receiving said IC units on an engagement surface; a first alignment member having a plurality of projections and recesses uniformly distributed along a first engagement edge; a second alignment member having a plurality of projections and recesses uniformly distributed along a second engagement edge; said first and second alignment members in sliding contact with the engagement surface; wherein said first and second alignment members arranged to move relative to each other so as to intermesh said respective projections and recesses, said intermeshed projections and recesses arranged to define a linear array of rectangular apertures sized to fit said IC units in an aligned condition.

    Abstract translation: 一种用于对准多个IC单元的对准组件，所述组件包括：具有用于在所述接合表面上接收所述IC单元的真空孔的板; 第一对准构件，其具有沿着第一接合边缘均匀分布的多个突起和凹部; 第二对准构件，具有沿着第二接合边缘均匀分布的多个突起和凹部; 所述第一和第二对准构件与所述接合表面滑动接触; 其中所述第一和第二对准构件被布置成相对于彼此移动以便互相啮合所述相应的突起和凹部，所述相互啮合的突起和凹陷布置成限定矩形孔的线性阵列，其大小适于将所述IC单元配合成对准状态。

    SYSTEM AND METHOD FOR ENGAGING SINGULATED SUBTRATES
    3.
    发明申请
    SYSTEM AND METHOD FOR ENGAGING SINGULATED SUBTRATES 审中-公开
    用于接合复合物的系统和方法

    公开(公告)号：WO2010053451A3

    公开(公告)日：2013-02-28

    申请号：PCT/SG2009000406

    申请日：2009-11-04

    Applicant: ROKKO SYSTEMS PTE LTD ,  BAEK SEUNG HO ,  JUNG JONG JAE ,  YANG HAE CHOON

    Inventor： BAEK SEUNG HO ,  JUNG JONG JAE ,  YANG HAE CHOON

    IPC: H01L21/683 ,  H01L21/687

    CPC classification number: H05K13/0408 ,  H01L21/6838 ,  H01L24/74 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

    Abstract: A unit picker assembly for engaging singulated IC units, the assembly comprising; a plurality of unit pickers, each unit picker having an engagement end for engagement of an IC unit; each of said unit pickers movably mounted to permit movement from a retracted position to a unit engagement position; an actuator assembly arranged to move to a plurality of actuating positions, each of said positions corresponding to one of said unit pickers from the retracted position to the unit engagement position; wherein whilst in any of said actuating positions the actuator assembly is arranged to move the corresponding unit picker from the retracted position to the engagement position.

    Abstract translation: 一种用于接合单个IC单元的单元选择器组件，该组件包括： 多个单元选择器，每个单元选择器具有用于IC单元接合的接合端; 每个所述单元选择器可移动地安装以允许从缩回位置移动到单元接合位置; 致动器组件布置成移动到多个致动位置，每个所述位置对应于所述单元拾取器中的一个从缩回位置到单元接合位置; 其中在所述致动位置中的任何一个中，所述致动器组件布置成使所述对应的单元拾取器从所述缩回位置移动到所述接合位置。

    NET BLOCK ASSEMBLY
    5.
    发明申请
    NET BLOCK ASSEMBLY 审中-公开

    公开(公告)号：WO2008060244A8

    公开(公告)日：2008-08-28

    申请号：PCT/SG2007000373

    申请日：2007-11-05

    Applicant: ROKKO SYSTEMS PTE LTD ,  LING NEE SENG ,  ANG SOO LOO ,  LIM CHONG CHEN ,  BAEK SEUNG HO ,  JUNG JONG JAE ,  SHIN YUN SUK

    Inventor： LING NEE SENG ,  ANG SOO LOO ,  LIM CHONG CHEN ,  BAEK SEUNG HO ,  JUNG JONG JAE ,  SHIN YUN SUK

    IPC: H01L21/00 ,  B28D5/00

    CPC classification number: B28D5/0088 ,  B28D5/0094 ,  H01L21/67092 ,  H01L21/67144 ,  H01L21/67271

    Abstract: The present invention relates to a net block assembly in a system for positioning singulated integrated circuits, having a net block surface partially covered by a two dimensional array of first (12) and second elements (14), each first element (12) having an aperture provided with vacuum adapted to receive an integrated circuit and each second element (14) projecting from the surface said net block assembly including a plurality of rows of first (12) and second element (14) arranged in a chequer pattern, wherein the number of elements in the row is an odd number and a buffer row (16) in the array having two first elements (12) arranged adjacent to each other, wherein the number of elements in the buffer row (16) is an odd number.

    Abstract translation: 本发明涉及用于定位单个化的集成电路的系统中的网块组件，其具有由第一元件（12）和第二元件（14）的二维阵列部分覆盖的网块表面，每个第一元件（12）具有 具有适于接收集成电路的真空的孔以及从所述表面突出的每个第二元件（14），所述网状块组件包括布置成方格图案的多排第一元件（12）和第二元件（14），其中， （16）中的元素的数量是奇数，并且该阵列中的缓冲器行（16）具有彼此相邻布置的两个第一元素（12），其中缓冲器行（16）中的元素的数量是奇数。

    IMPROVED DRY BLOCK ASSEMBLY
    8.
    发明申请
    IMPROVED DRY BLOCK ASSEMBLY 审中-公开
    改进的干块组件

    公开(公告)号：WO2016013981A1

    公开(公告)日：2016-01-28

    申请号：PCT/SG2015/050228

    申请日：2015-07-23

    Applicant: ROKKO SYSTEMS PTE LTD

    Inventor： LIM, Chong Chen ,  BAEK, Seung Ho ,  JUNG, Jong Jae ,  SHIN, Yun Suk

    IPC: H01L21/683 ,  B23Q3/08 ,  H01L21/301 ,  H01L21/304 ,  H01L21/673

    CPC classification number: H01L21/67333 ,  H01L21/6838

    Abstract: A dry block assembly for receiving a plurality of IC units, comprising: a support plate; a rubber layer having an array of vacuum apertures, each aperture arranged to receive an IC unit thereon; a locking device for fixing the rubber layer onto the support plate; wherein the rubber layer is arranged into sections having sub-arrays of apertures, adjacent sections separated by expansion voids.

    Abstract translation: 一种用于接收多个IC单元的干块组件，包括：支撑板; 具有真空孔阵列的橡胶层，每个孔布置成在其上容纳IC单元; 用于将橡胶层固定到支撑板上的锁定装置; 其中橡胶层被布置成具有孔的子阵列的部分，相邻的部分由膨胀空隙分开。

    DICING SYSTEM AND METHOD
    9.
    发明申请
    DICING SYSTEM AND METHOD 审中-公开
    定标系统及方法

    公开(公告)号：WO2010056209A3

    公开(公告)日：2013-08-08

    申请号：PCT/SG2009000426

    申请日：2009-11-16

    Applicant: ROKKO SYSTEMS PTE LTD ,  JUNG JONG JAE ,  BAEK SEUNG HO ,  LIM CHONG CHEN GARY

    Inventor： JUNG JONG JAE ,  BAEK SEUNG HO ,  LIM CHONG CHEN GARY

    IPC: B28D5/02 ,  H01L21/304 ,  H01L21/67

    CPC classification number: B28D5/029 ,  B28D5/0082

    Abstract: A singulation system for dicing IC units from a substrate comprising; a block (30) for receiving said substrate (31), said block movable from a substrate receiving station to a dicing station; a first dicing saw (10) for dicing the substrate when at the dicing station; a second dicing saw (15) for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.

    Abstract translation: 一种用于从基板切割IC单元的分割系统，包括： 用于接收所述衬底（31）的块（30），所述块可从衬底接收站移动到切割站; 第一切割锯（10），用于在切割台处切割基底; 第二切割锯（15），用于在切割台处切割基板; 其中第一和第二切割锯具有不同的品种，从而在所述基板上执行不同的切割功能。

Patent Agency Ranking