公开(公告)号：WO2012050524A1

公开(公告)日：2012-04-19

申请号：PCT/SG2011/000267

申请日：2011-07-26

Applicant: ROKKO VENTURES PTE LTD ,  YANG, Hae Choon ,  JANG, Deok Chun

Inventor： YANG, Hae Choon ,  JANG, Deok Chun

IPC: H01L21/67

CPC classification number: H01L21/67766 ,  H01L21/67333 ,  H01L21/67721 ,  H01L21/67778

Abstract: A shuttle table assembly comprising a shuttle table for receiving a plurality of IC units at a first position and for offloading said units at a second position, said shuttle table movable from said first to second position; a cover assembly mounted to said shuttle table, the cover assembly having at least one cover movable from an open position to a closed position, said closed position covering said units on the shuttle table; wherein the cover assembly is coupled to a guide for closing the cover as the shuttle table moves from the first to the second position.

Abstract translation: 一种梭床组件，包括用于在第一位置处接纳多个IC单元并在第二位置卸载所述单元的梭床，所述梭台可从所述第一位置移动到第二位置; 安装到所述梭台的盖组件，所述盖组件具有至少一个可从打开位置移动到关闭位置的盖，所述关闭位置覆盖所述穿梭台上的所述单元; 其中当所述梭台从所述第一位置移动到所述第二位置时，所述盖组件联接到导向件以关闭所述盖。

公开(公告)号：WO2009128786A3

公开(公告)日：2011-09-09

申请号：PCT/SG2008000200

申请日：2008-05-30

Applicant: ROKKO VENTURES PTE LTD ,  LIM CHONG CHEN ,  BAEK SEUNG HO ,  JUNG JONG JAE ,  JANG DEOK CHUN ,  LEE SEOK CHAN

Inventor： LIM CHONG CHEN ,  BAEK SEUNG HO ,  JUNG JONG JAE ,  JANG DEOK CHUN ,  LEE SEOK CHAN

IPC: H01L21/00 ,  H01L21/304

CPC classification number: B28D5/0082 ,  B28D5/0076 ,  B28D5/0094 ,  B28D5/029 ,  Y10T83/202 ,  Y10T83/242 ,  Y10T83/889

Abstract: An assembly for cutting a plurality of substrates into individual integrated circuit units comprising a first block for receiving a first substrate, said first block movable between a first loading position, a first alignment inspection station and a first cutting zone; a second block for receiving a second substrate, said second block movable between a second loading position, a second alignment inspection station and a second cutting zone; a cutting device for cutting a substrate into individual integrated circuit units, said cutting device movable between the first cutting zone and the second cutting zone, and; an alignment inspection device for determining the alignment of a substrate positioned on either the first or second block, said alignment inspection device movable between the first alignment inspection station and the second alignment inspection station.

Abstract translation: 一种用于将多个基板切割成单个集成电路单元的组件，包括用于接收第一基板的第一块，所述第一块可在第一加载位置，第一对准检查台和第一切割区之间移动; 用于接收第二基板的第二块，所述第二块可在第二装载位置，第二对准检查台和第二切割区之间移动; 用于将基板切割成单个集成电路单元的切割装置，所述切割装置可在所述第一切割区域和所述第二切割区域之间移动， 对准检查装置，用于确定位于第一或第二块上的基板的对准，所述对准检查装置可在第一对准检查台和第二对准检查台之间移动。

公开(公告)号：WO2011037543A1

公开(公告)日：2011-03-31

申请号：PCT/SG2010/000360

申请日：2010-09-24

Applicant: ROKKO TECHNOLOGY PTE LTD. ,  YANG, Hae Choon ,  SHEN, Xue Fang ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary ,  LIM, Siok Chun ,  SHIN, Yun Suk

Inventor： YANG, Hae Choon ,  SHEN, Xue Fang ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary ,  LIM, Siok Chun ,  SHIN, Yun Suk

IPC: H01L21/78 ,  H01L21/677 ,  B21D28/00 ,  H01L21/68

CPC classification number: H01L21/67092 ,  H01L21/67132 ,  Y10T83/647 ,  Y10T83/6572

Abstract: A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.

Abstract translation: 一种用于分离IC单元的冲压系统，包括：冲压组件，布置成接收衬底并将所述衬底分离成IC单元; 旋转载体，可从第一位置旋转到第二位置，所述旋转载体布置成在第一位置处接收所述单元，并通过旋转将所述单元运送到第二位置; 其中所述旋转载体包括用于容纳所述单元的至少一部分的凹部。 一种冲压组件，其包括具有用于接收可选择性地替换的插入件的凹部的模具块，其中所述插入件对应于特定于预定IC封装布置的冲压模式。

公开(公告)号：WO2009128786A2

公开(公告)日：2009-10-22

申请号：PCT/SG2008/000200

申请日：2008-05-30

Applicant: ROKKO VENTURES PTE LTD ,  LIM, Chong Chen ,  BAEK, Seung Ho ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  LEE, Seok Chan

Inventor： LIM, Chong Chen ,  BAEK, Seung Ho ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  LEE, Seok Chan

IPC: H01L21/00 ,  H01L21/304

CPC classification number: B28D5/0082 ,  B28D5/0076 ,  B28D5/0094 ,  B28D5/029 ,  Y10T83/202 ,  Y10T83/242 ,  Y10T83/889

Abstract: An assembly for cutting a plurality of substrates into individual integrated circuit units comprising a first block for receiving a first substrate, said first block movable between a first loading position, a first alignment inspection station and a first cutting zone; a second block for receiving a second substrate, said second block movable between a second loading position, a second alignment inspection station and a second cutting zone; a cutting device for cutting a substrate into individual integrated circuit units, said cutting device movable between the first cutting zone and the second cutting zone, and; an alignment inspection device for determining the alignment of a substrate positioned on either the first or second block, said alignment inspection device movable between the first alignment inspection station and the second alignment inspection station.

Abstract translation: 一种用于将多个基板切割成单个集成电路单元的组件，包括用于接收第一基板的第一块，所述第一块可在第一加载位置，第一对准检查台和第一切割区之间移动; 用于接收第二基板的第二块，所述第二块可在第二装载位置，第二对准检查台和第二切割区之间移动; 用于将基板切割成单个集成电路单元的切割装置，所述切割装置可在所述第一切割区域和所述第二切割区域之间移动， 对准检查装置，用于确定位于第一或第二块上的基板的对准，所述对准检查装置可在第一对准检查台和第二对准检查台之间移动。

公开(公告)号：WO2011078802A1

公开(公告)日：2011-06-30

申请号：PCT/SG2010/000484

申请日：2010-12-23

Applicant: ROKKO SYSTEMS PTE LTD ,  YANG, Hae Choon ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary

Inventor： YANG, Hae Choon ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary

IPC: H01L21/67 ,  H01L21/677 ,  B65H29/00

CPC classification number: H05K13/0408 ,  H05K13/0413 ,  H05K13/0478 ,  Y10T74/18296 ,  Y10T74/19051

Abstract: A picker assembly comprising: a plurality of pickers in selective variable spaced relation; a shaft having a plurality of cam plates, said cam plates co-axial with said shaft and having a variable thickness; said cam plates in engagement with said pickers and positioned in interstitial spaces between said pickers; wherein the selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.

Abstract translation: 选择器组件包括：多个选择性可变间隔关系的拾取器; 具有多个凸轮板的轴，所述凸轮板与所述轴同轴并具有可变的厚度; 所述凸轮板与所述拾取器接合并定位在所述拾取器之间的间隙空间中; 其中间隔的选择性变化通过轴的旋转来提供，使得凸轮板的厚度变化沿着平行于轴的轴线移动各个拾取器。

公开(公告)号：WO2009134212A1

公开(公告)日：2009-11-05

申请号：PCT/SG2009/000158

申请日：2009-05-04

Applicant: ROKKO VENTURES PTE LTD ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  HA, Chang Hwan ,  LIM, Chong Chen ,  BEAK, Seung Ho

Inventor： JUNG, Jong Jae ,  JANG, Deok Chun ,  HA, Chang Hwan ,  LIM, Chong Chen ,  BEAK, Seung Ho

IPC: B28D5/00 ,  H01L21/304 ,  H01L21/78

CPC classification number: B28D5/0058 ,  H01L21/78

Abstract: A system for cutting a plurality of substrates of integrated circuit units comprising a plurality of tables (40, 55), each table including a plurality of trays (37A, 37B, 57A, 57B), each tray arranged to receive one of said substrates; each of said tables selectively movable between a respective loading station (20) for receiving said substrates and a cutting station for cutting the substrates, and a substrate placement device (35) for placing the substrates on the respective trays of said tables; wherein the substrate placement device is arranged to sequentially place substrates on said tables with said tables arranged to sequentially move to the cutting station after receiving the substrates and then return to their respective loading stations for placement of additional substrates.

Abstract translation: 一种用于切割包括多个台（40,55）的集成电路单元的多个基板的系统，每个台包括多个托盘（37A，37B，57A，57B），每个托盘布置成容纳所述基板之一; 每个所述台可以选择性地在相应的用于接收所述基板的装载站（20）和用于切割基板的切割站之间移动;以及基板放置装置（35），用于将所述基板放置在所述台的各个托盘上; 其中所述基板放置装置被布置成将基板顺序地放置在所述台上，其中所述台布置成在接收到所述基板之后依次移动到所述切割站，然后返回到其各自的装载站以放置附加的基板。

公开(公告)号：WO2011068478A8

公开(公告)日：2011-06-09

申请号：PCT/SG2010/000447

申请日：2010-11-30

Applicant: ROKKO SYSTEMS PTE LTD ,  JUNG, Jong Jae ,  SHIN, Yun Suk ,  YANG, Hae Choon ,  JANG, Deok Chun

Inventor： JUNG, Jong Jae ,  SHIN, Yun Suk ,  YANG, Hae Choon ,  JANG, Deok Chun

IPC: H01L21/66 ,  B07C5/34 ,  B07C5/02 ,  H01L21/67

Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.

公开(公告)号：WO2011068478A1

公开(公告)日：2011-06-09

申请号：PCT/SG2010000447

申请日：2010-11-30

Applicant: ROKKO SYSTEMS PTE LTD ,  JUNG JONG JAE ,  SHIN YUN SUK ,  YANG HAE CHOON ,  JANG DEOK CHUN

Inventor： JUNG JONG JAE ,  SHIN YUN SUK ,  YANG HAE CHOON ,  JANG DEOK CHUN

IPC: H01L21/66 ,  B07C5/02 ,  B07C5/34 ,  H01L21/67

CPC classification number: H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.

Abstract translation: 一种用于检查和分类多个IC单元的方法，包括以下步骤：将包含所述IC单元的框架传送到单元拾取工位; 在递送步骤期间对所述单元进行第一次检查并记录后续结果; 从框架中取出所述单元，并将所述单元从单元拾取工位移动到翻转工位; 在移动步骤期间对所述单元进行第二次检查并记录后续结果; 翻转所述单元以暴露所述单元的相对面; 然后对所述相对面进行第三次检查并记录后续结果; 根据第一，第二和第三检查步骤的记录结果将所述单元分类成类别。