公开(公告)号：WO2014105233A3

公开(公告)日：2014-08-21

申请号：PCT/US2013061641

申请日：2013-09-25

Applicant: SANDIA CORP

Inventor： NIELSON GREGORY N ,  KIM BONGSANG ,  CRUZ-CAMPA JOSE LUIS ,  TAUKE-PEDRETTI ANNA ,  CEDERBERG JEFFREY ,  RESNICK PAUL J ,  SANCHEZ CARLOS ANTHONY ,  OKANDAN MURAT

IPC: H01L21/20

CPC classification number: H01L25/50 ,  B81C1/00373 ,  B81C2201/0194 ,  H01L21/283 ,  H01L21/31111 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/80 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/13005 ,  H01L2224/131 ,  H01L2224/14135 ,  H01L2224/80006 ,  H01L2224/80896 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2224/11 ,  H01L2224/80001 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A method includes forming a release layer over a donor substrate. A plurality of devices made of a first semiconductor material are formed over the release layer. A first dielectric layer is formed over the plurality of devices such that all exposed surfaces of the plurality of devices are covered by the first dielectric layer. The plurality of devices are chemically attached to a receiving device made of a second semiconductor material different than the first semiconductor material, the receiving device having a receiving substrate attached to a surface of the receiving device opposite the plurality of devices. The release layer is etched to release the donor substrate from the plurality of devices. A second dielectric layer is applied over the plurality of devices and the receiving device to mechanically attach the plurality of devices to the receiving device.

Abstract translation: 一种方法包括在供体衬底上形成释放层。 在释放层上形成由第一半导体材料制成的多个器件。 第一电介质层形成在多个器件上，使得多个器件的所有暴露表面被第一电介质层覆盖。 所述多个装置化学附着到由不同于所述第一半导体材料的第二半导体材料制成的接收装置，所述接收装置具有附接到与所述多个装置相对的所述接收装置的表面的接收基底。 蚀刻释放层以从多个器件释放供体衬底。 第二电介质层被施加在多个装置和接收装置上以机械地将多个装置附接到接收装置。