公开(公告)号：WO2013064592A2

公开(公告)日：2013-05-10

申请号：PCT/EP2012071653

申请日：2012-11-01

Applicant: UNIV EINDHOVEN TECH

Inventor： DUAN PINXIANG ,  SMALBRUGGE ELBERTUS ,  RAZ ODED ,  DORREN HARMEN JOSEPH SEBASTIAAN

IPC: H01L25/065

CPC classification number: H01L24/85 ,  H01L24/24 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27618 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/82007 ,  H01L2224/82101 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85007 ,  H01L2224/85399 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2224/45099 ,  H01L2924/207

Abstract: A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die on top of a first die, heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound, using lithography, from a top surface of the first die to a top surface of the second die, heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die top surface and the second die top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die top surface and the second die top surface.

Abstract translation: 提供了一种用于将堆叠的裸片表面与导电迹线互连的方法和装置，其包括使用第一层光致抗蚀剂化合物将第二裸片接合在第一裸片的顶部上，将第一层加热到光致抗蚀剂化合物的热解点 ，其中所述光致抗蚀剂化合物转变到稳定层，使用平版印刷法将所述光致抗蚀剂化合物的第二层从所述第一管芯的顶表面沉积到所述第二管芯的顶表面，将所述第二光致抗蚀剂化合物层加热到液态 其中液态光致抗蚀剂化合物在第一模具顶表面和第二模具顶表面之间形成平滑的凸桥，并且在光滑的凸桥上沉积导电层，其中导电迹线形成在第一模具顶表面和 第二个模具顶面。