Abstract:
본 발명은, 본 발명은 전자 방출체, 이의 제조방법 및 이를 포함하는 발광 장치에 관한 것으로, 보다 구체적으로, 적어도 일부분에 나노 구조체가 형성된 반도체 웨이퍼를 포함하는 전자 방출체에 관한 것이다. 본 발명은, 대면적의 전자 방출체를 제공할 수 있고, 전자 주입 방식으로 구동가능할 뿐 아니라 발광 효율이 개선된 발광 장치를 제공할 수 있다.
Abstract:
A semiconductor cold-cathode device (1) for emitting electrons has an integral structure composed of a semiconductor (2) between a first electrode (3) and a second electrode (4). A collector electrode (6) is arranged opposite the semiconductor (2A) placed between the first electrode (3) and the second electrode (4). The first electrode (3) is connected with the negative terminal of a voltage supply (8) connected in series with a collector supply (7). The collector electrode (6) is connected with the positive terminal of the collector supply. The second electrode (4) is connected with the positive terminal of the voltage supply (8). The semiconductor cold-cathode device efficiently emits electrons, and it can be manufactured easily.
Abstract:
A photocathode utilizes an field emitter array (FEA) integrally formed on a silicon substrate to enhance photoelectron emissions, and a thin boron layer disposed directly on the output surface of the FEA to prevent oxidation. The field emitters are formed by protrusions having various shapes (e.g., pyramids or rounded whiskers) disposed in a two-dimensional periodic pattern, and may be configured to operate in a reverse bias mode. An optional gate layer is provided to control emission currents. An optional second boron layer is formed on the illuminated (top) surface, and an optional anti-reflective material layer is formed on the second boron layer. An optional external potential is generated between the opposing illuminated and output surfaces. An optional combination of n-type silicon field emitter and p-i-n photodiode film is formed by a special doping scheme and by applying an external potential. The photocathode forms part of sensor and inspection systems.
Abstract:
A semiconductor power handling device, includes a cathode pillar, a gate surrounding the cathode pillar, and an anode spaced from the cathode by a nano-vacuum gap. An array of semiconductor power handling devices, each comprises a cathode pillar, a gate surrounding the cathode pillar, and an anode spaced from the cathode pillar by a nano-vacuum gap. The semiconductor power handling devices can be arranged as rows and columns and can be interconnected to meet the requirements of various applications. The array of power handling devices can be fabricated on a single substrate.
Abstract:
An electron tube provided with a semiconductor cathode for emitting electrons, which semiconductor cathode is arranged on a support, a source being arranged in the vicinity of the cathode, in particular, so as to face the free (Si) surface of the cathode, which source is capable of evolving, at the increased temperatures occurring during evacuation of the tube in the manufacturing process, a reducing agent such as F2 or HF, which passivates the free (Si) surface of the cathode.
Abstract:
A junction-based field emission display, wherein the junctions are formed by depositing a semiconducting or dielectric, low work function, negative electron affinity (NEA) silicon-based compound film (SBCF) onto a metal or n-type semiconductor substrate. The SBCF can be doped to become a p-type semiconductor. A small forward bias voltage is applied across the junction so that electron transport is from the substrate into the SBCF region. Upon entering into this NEA region, many electrons are released into the vacuum level above the SBCF surface and accelerated toward a positively biased phosphor screen anode, hence lighting up the phosphor screen for display. To turn off, simply switch off the applied potential across the SBCF/substrate. May be used for field emission flat panel displays.
Abstract:
A method for growing on a substrate strongly aligned uniform cross-section semiconductor composite nanocolumns is disclosed. The method includes: (a) forming faceted pyramidal pits on the substrate surface; (b) initiating nucleation on the facets of the pits; and; (c) promoting the growth of nuclei toward the center of the pits where they coalesce with twinning and grow afterwards together as composite nanocolumns. Multi-quantum-well, core-shell nanocolumn heterostructures can be grown on the sidewalls of the nanocolumns. Furthermore, a continuous semiconductor epitaxial layer can be formed through the overgrowth of the nanocolumns to facilitate fabrication of high-quality planar device structures or for light emitting structures.
Abstract:
A method of forming a cathodic device includes the steps of forming a p-type layer (18) and an n-type layer (20) below a surface (20) of a substrate. The material has a conduction band which is at an energy level no more than 0.5 electron-Volts (eV) below the lowest vacuum energy level. The layers are formed so that they are in contact, with the p-type layer located between the surface and the n-type layer, and so that they form a p-n junction. The thickness of the p-type layer is somewhat less than the average distance which an electron injected into the p-type layer travels by diffusion and the thickness of the negatively charged depletion layer in the p-type layer is such that the difference between the thickness of the p-type layer and the thickness of the negatively charged depletion layer in the p-type layer is substantially less than the said average distance.