Abstract:
An implanter provides two-dimensional scanning of a substrate (17) relative to an implant beam (19) so that the beam draws a raster of scan lines (35) on the substrate. The beam current is measured at turnaround points (38) off the substrate and the current value is used to control the subsequent fast scan speed so as to compensate for the effect of any variation in beam current on dose uniformity in the slow scan direction. The scanning may produce a raster of non-intersecting uniformly spaced parallel scan lines and the spacing between the lines is selected to ensure appropriate dose uniformity.
Abstract:
A system and method for optimizing the production of lithography reticles involves identifying "proximity effect halos" around tight tolerance features in an IC layout data file. Features and defects outside the halos will not have a significant effect on the printing of the tight tolerance features. During reticle formation, the tight tolerance features and associated halos can be carefully written and inspected to ensure accuracy while the other portions of the reticle can be written/inspected less stringently for efficiency. The halo width can be determined empirically or can be estimated by process modeling. If an electron beam tool is used to write the reticle, a small spot size can be used to expose the tight tolerance features and the halos, whereas a large spot size can be used to expose the remainder of the reticle. A reticle production system can include a computer to read an IC layout data file, identify tight tolerance features, and define proximity effect halos. Tight tolerance features can be individually selected or automatically flagged according to user specifications. A graphical user interface can be provided to enable user input and control. The reticle production system can be coupled to a remote IC layout database through a LAN or a WAN. The reticle production system can be coupled to directly send a reticle data file to a reticle-writing tool.
Abstract:
An ion implantation system (200) comprises a plasma source (204) for providing plasma (140) and a workpiece holder (210) arranged to receive a bias with respect to the plasma to attract ions across a plasma sheath toward the substrate. The system may also include an extraction plate arrangement (101) comprising a multiplicity of different apertures (112, 114, 116) each arranged to provide an ion beam (122, 124, 126) having tons distributed over a range o angles of incidence on the workpiece, wherein a first ion beam extracted from first aperture has a first beam profile that differs from a second ion beam extracted from a second aperture.
Abstract:
Die Erfindung betrifft ein Verfahren zur Bestimmung einer Wirkung eines Partikelstrahls (34a) in einem zu mindest teilweise bestrahlten oder zu bestrahlenden Material, wobei aus zumindest einem Parameter, der den Partikelstrahl (34a) charakterisiert, und aus zumindest einer Eigenschaft des Materials, die Wirkung des Partikelstrahls in dem Material zumindest teilweise auf Basis einer mikroskopischen Schadenskorrelation bestimmt wird. Die Erfindung betrifft ferner ein entsprechendes Verfahren zur Bestrahlungsplanung für ein Zielvolumen (44) und ein Verfahren zur Bestrahlung eines Zielvolumens (44) mit einem Partikelstrahl (34a). Die Erfindung betrifft ausserdem eine Bestrahlungsvorrichtung (30,66) mit mindestens einer Strahlmodifikationseinrichtung (32,70), die eine Einheit aufweist, insbesondere eine aktive Strahlmodifikationseinrichtung (32) und/oder eine passive Strahlmodifikationseinrichtung (70), die zum Durchführen des erfindungsgemässen Verfahrens (200) eingerichtet ist.
Abstract:
A method for ion implantation is disclosed which includes decreasing the implant energy level as the implant process is ongoing. In this way, either a box-like profile or a profile with higher retained dose can be achieved, enabling enhanced activation at the same junction depth. In one embodiment, the initial implant energy is used to implant about 25% of the dose. The implant energy level is then reduced and an additional 50% of the dose is implanted. The implant energy is subsequently decreased again and the remainder of the dose is implanted. The initial portion of the dose can optionally be performed at cold, such as cryogenic temperatures, to maximize amorphization of the substrate.
Abstract:
A charged particle beam apparatus capable of applying a charged particle beam to a specimen with a reduced aberration and without causing electric discharge even when gas is introduced onto the surface of the specimen. A charged particle beam apparatus (1) comprises a charged particle source (9) for emitting a charged particle beam (I), correcting/deflecting means (19) for correcting/deflecting the charged particle beam (I), a charged particle beam optical system (11) having an objective (16) composed of two outer electrodes (16a, 16b) and at least one intermediate electrode (16c) interposed between the outer electrodes (16a, 16b) the three arranged in the application direction and used for converging the charged particle beam (I) and applying it to a specimen (M), and an objective control power supply (36) for applying a voltage to the intermediate electrode (16c) to cause a positive or negative potential difference with respect to the outer electrodes (16a, 16b) by changing the voltage.
Abstract:
A charged particle beam exposure system has a blanking aperture array (31) having groups of apertures (53) controlled by shift registers (75), wherein different inputs (C) to the shift registers influence a different number of apertures. Charged particle beamlets traversing the apertures are scanned across a charged particle sensitive substrate in synchronism with a clock signal of the shift registers.