公开(公告)号：WO2013095670A1

公开(公告)日：2013-06-27

申请号：PCT/US2011/067277

申请日：2011-12-23

Applicant: INTEL CORPORATION ,  SIDHU, Rajen S. ,  DUDEK, Martha A. ,  MATAYABAS, JR., James C. ,  PHEN, Michelle S. ,  TAN, Wei

Inventor： SIDHU, Rajen S. ,  DUDEK, Martha A. ,  MATAYABAS, JR., James C. ,  PHEN, Michelle S. ,  TAN, Wei

IPC: H01L21/60 ,  H01L23/48

CPC classification number: B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01083

Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

Abstract translation: 描述了在制造电子器件组件期间的焊剂配方和焊料附着。 一种熔剂形成包括助熔剂组分和金属颗粒组分，金属颗粒组分的存在量为焊剂配方的5至35体积％。 在某些实施方案的一个特征中，金属颗粒组分包括焊料颗粒。 描述和要求保护其他实施例。