公开(公告)号：WO2012040735A2

公开(公告)日：2012-03-29

申请号：PCT/US2011053325

申请日：2011-09-26

Applicant: INTEL CORP ,  NALLA RAVI K ,  MANUSHAROW MATHEW J ,  MALATKAR PRAMOD

Inventor： NALLA RAVI K ,  MANUSHAROW MATHEW J ,  MALATKAR PRAMOD

IPC: H01L23/48 ,  H01L23/12 ,  H01L23/485

CPC classification number: H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/93 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/22 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/24011 ,  H01L2224/24146 ,  H01L2224/251 ,  H01L2224/25105 ,  H01L2224/2518 ,  H01L2224/82005 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/82106 ,  H01L2224/93 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2221/68304 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include a die embedded in a coreless substrate, wherein a mold compound surrounds the die, and wherein the die comprises TSV connections on a first side and C4 pads on a second side of the die, a dielectric material on a first side and on a second side of the mold compound; and interconnect structures coupled to the C4 pads and to the TSV pads. Embodiments further include forming packaging structures wherein multiple dies are fully embedded within a BBUL package without PoP lands.

Abstract translation: 描述了形成微电子封装结构和由此形成的相关结构的方法。 这些方法可以包括嵌入无芯基板中的管芯，其中模制化合物围绕管芯，并且其中管芯包括第一侧上的TSV连接和管芯第二侧上的C4焊盘，第一侧上的电介质材料以及 在模塑料的第二侧上; 以及耦合到C4焊盘和TSV焊盘的互连结构。 实施例还包括形成封装结构，其中多个管芯完全嵌入在没有PoP焊盘的BBUL封装内。