公开(公告)号：WO2002061822A1

公开(公告)日：2002-08-08

申请号：PCT/NL2002/000068

申请日：2002-01-29

Applicant: FICO B.V. ,  VAN DALEN, Adrianus, Wilhelmus ,  VAN EGMOND, Henri, Joseph

Inventor： VAN DALEN, Adrianus, Wilhelmus ,  VAN EGMOND, Henri, Joseph

IPC: H01L21/48

CPC classification number: H01L21/4842 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/97 ,  Y10T29/515 ,  Y10T83/0207 ,  Y10T83/04 ,  Y10T83/9447

Abstract: The invention relates to a method for removing from a carrier a carrier part with a housing arranged thereon, characterized in that prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, manufactured with the present method. The invention moreover relates to an apparatus for performing the method.

Abstract translation: 本发明涉及一种用于从载体上移除具有布置在其上的壳体的载体部分的方法，其特征在于，在执行分离操作之前，在载体的至少一侧沿着至少一部分 要布置的分离边缘的长度。 本发明还涉及一种其上布置有壳体的载体部分，该载体部分包含在远离壳体的载体侧上的开口，填充有用本方法制造的封装材料。 本发明还涉及一种用于执行该方法的装置。

公开(公告)号：WO0003576A3

公开(公告)日：2000-02-24

申请号：PCT/IB9901180

申请日：1999-06-24

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  PHILIPS SVENSKA AB

Inventor： HO CHUAN R

IPC: H01L23/50 ,  H01L21/00 ,  H05K13/00

CPC classification number: H01L21/67092 ,  Y10T29/515 ,  Y10T74/18216

Abstract: A process and an apparatus for manufacturing semiconductor devices. The semiconductor devices comprise a carrier on which a die is mounted. During a stamping process a shaft is rotated and a plunger with a stamping tool are moved in the stamping direction in a reciprocating manner. When the stamping tool is lifted, a strip comprising semiconductor devices is moved such that a semiconductor device is positioned under the stamping tool. Subsequently the stamping tool is lowered whereby the leads are cut loose from the strip and are bent into an appropriate shape.

Abstract translation: 一种制造半导体器件的工艺和设备。 半导体器件包括其上安装管芯的载体。 在冲压过程中，轴旋转并且具有冲压工具的柱塞以往复方式在冲压方向上移动。 当抬起冲压工具时，移动包括半导体器件的条带，使得半导体器件位于冲压工具下方。 随后降低冲压工具，从而将导线从带材上松开并弯曲成合适的形状。

公开(公告)号：WO2015145730A1

公开(公告)日：2015-10-01

申请号：PCT/JP2014/059161

申请日：2014-03-28

Applicant: 富士機械製造株式会社

Inventor： 中西　雄祐 ,  前田　晴章

IPC: H05K13/04

CPC classification number: H05K13/0473 ,  H01L21/4842 ,  H01R43/048 ,  H05K13/0015 ,  H05K13/0061 ,  Y10T29/5145 ,  Y10T29/5149 ,  Y10T29/515

Abstract: １つの駆動源により互いに接近・離間させられる一対の可動子の位置精度を向上させる。一対の可動子の設定ピッチとピッチずれ量、軸線ずれ角、中心点ずれ量との関係がずれテーブルとして記憶されている。基板に挿入されるリード部品のリード線の間隔で決まる目標ピッチとずれテーブルとに基づいて、補間法により目標ピッチである場合のピッチずれ量、軸線ずれ量、中心点ずれ量が取得され(Ｓ２５)、これらずれ量に対応する補正値を考慮して、ｘ軸モータ、ｙ軸モータ、θモータ、Ｐモータへの制御指令値が作成されて、制御される（Ｓ２６～２８）。その結果、一対の可動子の位置を精度よく制御することが可能となり、リード線挿入穴が基板に設けられた貫通穴に対向する位置に至るように制御することが可能となる。リード部品のリード線が良好にリード線挿入穴に挿入され、良好にカットアンドクリンチを行うことができる。

Abstract translation: 本发明的目的是提高通过一个驱动源彼此接近和分离的一对可移动元件的位置精度。 将一对可移动元件的设定间距，间距偏差量，轴偏离角度和中心点偏差量之间的关系存储为偏差表。 基于偏差表和由插入到基板中的引线分量的引线之间的间隔确定的目标间距，通过装置获取用于该目标间距的间距偏差量，轴偏差量和中心点偏差量 的插值技术（S25）。 考虑到与上述偏差量对应的校正值，创建x轴电动机，y轴电动机，θ电动机和P电动机的控制指令值，并进行相应的控制（S26〜S28）。 结果，可以精确地控制一对可动元件的位置，并且可以进行控制，使得引线插入孔到达设置在基板上的通孔的位置。 因此，引线部件的引线更好地插入引线插入孔，并且可以更好地进行切割和钳制操作。

公开(公告)号：WO00003576A2

公开(公告)日：2000-01-20

申请号：PCT/IB1999/001180

申请日：1999-06-24

IPC: H01L23/50 ,  H01L21/00 ,  H05K13/00

CPC classification number: H01L21/67092 ,  Y10T29/515 ,  Y10T74/18216

Abstract: A process and an apparatus for manufacturing semiconductor devices. The semiconductor devices comprise a carrier on which a die is mounted. During a stamping process a shaft is rotated and a plunger with a stamping tool are moved in the stamping direction in a reciprocating manner. When the stamping tool is lifted, a strip comprising semiconductor devices is moved such that a semiconductor device is positioned under the stamping tool. Subsequently the stamping tool is lowered whereby the leads are cut loose from the strip and are bent into an appropriate shape.

Abstract translation: 一种用于制造半导体器件的工艺和装置。 半导体器件包括其上安装有管芯的载体。 在冲压过程中，轴被旋转，并且具有冲压工具的柱塞以往复方式沿冲压方向移动。 当冲压工具被提起时，包括半导体器件的条被移动，使得半导体器件位于冲压工具下方。 随后，冲压工具下降，从而使引线从带材上松开并弯曲成适当的形状。

公开(公告)号：WO98033126A1

公开(公告)日：1998-07-30

申请号：PCT/US1998/001340

申请日：1998-01-27

IPC: G05B19/418 ,  G06F17/00 ,  G06F19/00

CPC classification number: G05B19/4184 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/22 ,  Y10T29/5143 ,  Y10T29/5148 ,  Y10T29/515 ,  Y10T29/5193 ,  Y10T29/53174

Abstract: A method and system (100) for monitoring process parameters associated with a manufacturing or testing process. The system (100) includes: at least one machine (101) which is used in the manufacturing or testing process; at least one sensing device (115), coupled to the at least one machine (101), for measuring a process parameter associated with the at least one machine (101); and a controller (DNM), coupled to the at least one sensing device (115), for receiving and storing measured data from the at least one sensing device (115). The method includes the acts of: measuring a value of a process parameter associated with a machine (101) used in the manufacturing or testing process; converting the measured value of the process parameter into a digital data signal having a specified data format; transmitting the digital data signal to a controller (DNM); and storing the digital data signal in a database.

Abstract translation: 一种用于监视与制造或测试过程相关联的过程参数的方法和系统（100）。 该系统（100）包括：在制造或测试过程中使用的至少一个机器（101）; 耦合到所述至少一个机器（101）的至少一个感测装置（115），用于测量与所述至少一个机器（101）相关联的过程参数; 以及耦合到所述至少一个感测装置（115）的用于接收和存储来自所述至少一个感测装置（115）的测量数据的控制器（DNM）。 该方法包括以下动作：测量与制造或测试过程中使用的机器（101）相关联的过程参数的值; 将所述处理参数的测量值转换成具有指定数据格式的数字数据信号; 将数字数据信号发送到控制器（DNM）; 并将数字数据信号存储在数据库中。

公开(公告)号：WO1995023444A1

公开(公告)日：1995-08-31

申请号：PCT/US1995002421

申请日：1995-02-27

Applicant: PSI TELECOMMUNICATIONS, INC. ,  SUAREZ, Wilson

Inventor： PSI TELECOMMUNICATIONS, INC.

IPC: H01R43/04

CPC classification number: H01R43/04 ,  H01R43/01 ,  H01R43/015 ,  H01R43/042 ,  Y10T29/49181 ,  Y10T29/515 ,  Y10T29/53217 ,  Y10T29/53235

Abstract: A lightweight, economical, reliable and adaptable tool (100) for use in joining wire connector assemblies such as those utilized in telecommunications includes a base member (102) including a housing (118) and a cam mechanism (400) with a T-bar (114) pivotally connected with a cam mechanism (400). Removable wire connector holders (200) are provided which can be interchanged on the base member (204) and force applicators (200 and 320) for use with particular wire connectors can be applied to the T-bar (114). By providing interchangeability for the wire connector holders (200) and the force applicators (220 and 320) the disclosed tool (100) is capable of being utilized with a variety of industry standard wire connector assemblies without requiring multiple tools. In addition, the tool (100) is formed utilizing a simplified construction and is made from materials which reduce the weight, increase the reliability and reduce the cost thereof.

Abstract translation: 用于连接电线连接器组件（例如电信中使用的那些）的轻量级，经济，可靠和适应性强的工具（100）包括：基座构件（102），包括壳体（118）和具有T形杆的凸轮机构（400） （114）与凸轮机构（400）枢转地连接。 提供了可移动的线连接器支架（200），其可以在基底构件（204）上互换，并且用于特定线缆连接器的施力器（200和320）可以施加到T形杆（114）。 通过提供电线连接器保持器（200）和施力器（220和320）的互换性，所公开的工具（100）能够与各种工业标准的电线连接器组件一起使用，而不需要多个工具。 此外，工具（100）利用简化的结构形成，并且由减轻重量，增加可靠性并降低其成本的材料制成。

公开(公告)号：WO9324945A3

公开(公告)日：1994-03-03

申请号：PCT/US9304552

申请日：1993-05-12

Applicant: DIGITAL EQUIPMENT CORP

Inventor： SAARI DAVID S ,  KOWALESKI KELLI

IPC: H01C17/242 ,  H01G13/00 ,  H05K13/04 ,  H05K13/08 ,  H01C17/24

CPC classification number: H05K13/08 ,  H01C17/242 ,  H01G13/00 ,  H05K13/04 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/4913 ,  Y10T29/5143 ,  Y10T29/515 ,  Y10T29/5313 ,  Y10T29/53178

Abstract: Methods and apparatus for facilitating the use of existing onsertion machines (50) by trimming and sequencing a plurality of components to be onserted on an as-needed basis from components of generic values obtained from the manufacturer and providing the sequence of components to a single pick-up (30) point on the onsertion machine. Post-encapsulation trimming of these components by laser (222) also results in novel components of high precision.

公开(公告)号：WO1992014284A1

公开(公告)日：1992-08-20

申请号：PCT/US1992000668

申请日：1992-01-28

Applicant: PANDUIT CORP.

Inventor： PANDUIT CORP. ,  LEBAN, Joseph F. ,  LEVIN, Robert F.

IPC: H01R43/04

CPC classification number: H01R43/01 ,  H01R43/04 ,  Y10T29/515 ,  Y10T29/53217 ,  Y10T29/53261

Abstract: A modular connector press (20) for terminating different types of connectors (40) to a flat cable (22) includes left and right cable tray assemblies (48, 49) that are mounted for accurately positioning and laterally translating the cable in a first direction transverse to the axial direction of the cable between a loading position for initial positioning of the cable and a termination position where the cable is positioned beneath a press ram (21). Each tray assembly (48, 49) includes a main body (54), a cable tray (55) and means for mounting the cable tray (55) to the main body (54) to allow adjustable translation of the cable tray in a second direction transverse to the first direction of translation of the tray assembly means. Each cable tray (55) includes a plurality of connector positioning slots (61) allowing the accurate positioning of terminated connectors of a harness on each cable tray. The left and right tray assemblies (48, 49) can be fastened together to form a two tray unit, each tray of which, with respect to the ram of the press, can be accurately and relatively positioned in the second direction allowing the accurate positioning and termination of a third connector therebetween. The modular press (20) also includes a plurality of different types of interchangeable connector test heads (26) allowing the press to be easily modified to terminate and test a variety of different connectors to a connector harness.

公开(公告)号：WO1989000898A1

公开(公告)日：1989-02-09

申请号：PCT/US1988002438

申请日：1988-07-19

Applicant: HOLCOMB, Gregory, W.

IPC: B21F01/00

CPC classification number: H05K13/0092 ,  Y10T29/515 ,  Y10T29/53183

Abstract: A component lead cutting and forming apparatus for axial lead electronic components respectively having first and second leads secured to tape, including bending dies for supporting the first and second leads of an axial lead component in process. The bending dies (121) are supported by slide blocks (125), and strain relief clamps (133) selectively clamp the first and second leads against the bending dies. First and second parallel carriage blocks (129), which are adjustable in separation, support the slide blocks. Driving apparatus including an air cylinder translates the slide blocks between a first position and a second position in a linear direction generally orthogonal to the orientation of the axial leads of the component in process, and further controls cutting blades (149) for cutting the leads of the component in process. The cutting blades are secured in parallel cutting blade support blocks (151) which are adjustable as to separation. Bending rollers (143) supported by the carriage blocks cooperate with the bending dies to bend the leads of the axial lead component in process as the slide blocks are linearly translated from the first position to the second position. When the slide blocks are in the second position, grippers (211, 213) grasp the processed component legs and translate the component for robotic pick-up presentation.

公开(公告)号：WO00065895A1

公开(公告)日：2000-11-02

申请号：PCT/JP2000/002810

申请日：2000-04-27

IPC: H05K13/04 ,  H05K13/08

CPC classification number: H05K13/0473 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/515 ,  Y10T29/53174 ,  Y10T29/53183

Abstract: A piezoelectric element (1) is mounted to a clinch lever (144) for detecting stress-strain generated therein when cutting and clinching leads (100a) of an electronic component (100) that has been inserted in corresponding holes (102a) formed in a circuit board substrate (102). A detected voltage d is compared to a threshold voltage s selected from a plurality of threshold voltages preset in the device. When the detected voltage d exceeds the threshold voltage s, the insertion detecting section outputs a signal indicating that the insertion of the leads in the holes has been performed normally.

Abstract translation: 压电元件（1）安装到夹紧杆（144）上，用于检测已经插入到形成于其中的相应的孔（102a）中的电子部件（100）的切割和紧固引线（100a）时产生的应力应变 电路板基板（102）。 将检测电压d与从设备中预设的多个阈值电压中选择的阈值电压s进行比较。 当检测到的电压d超过阈值电压s时，插入检测部分输出指示孔中的引线插入正常的信号。