Abstract:
Disclosed is an aqueous adhesive composition which comprises an admixture of: (a) a first aqueous composition comprising, (i) one or more film forming polymers, (ii) one or more lower crystallinity polynitroso compounds, (iii) one or more higher crystallinity polynitroso compounds, and (iv) one or more bismaleimide-containing monomers; and (b) a second aqueous composition comprising (i) an aqueous dispersion of at least one phenolic resin which is a condensation product of a phenol and formaldehyde, wherein the aqueous dispersion is stabilized by at least one polyacrylate; (b) one or more latices formed from one or more halogenated polyolefins; and (c) one or more metal oxides.
Abstract:
Adhesive compositions comprising a copolymer of isobutylene repeat units and alkene repeat units are described. At least a portion of the alkene repeat units are bonded to a pendent nitrogen atom of a quaternary ammonium salt comprising a free-radically polymerizable substituent. The adhesive optionally comprises other components such as tackifier, unfunctionalized polyisobutylene polymer, plasticizer, and combinations thereof.
Abstract:
The present invention provides a polymer composition having a low water absorption ( i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.
Abstract:
A multi-layered structure comprising a polyolefin layer and a polyketone layer bonded together with an adhesive composition comprising an amine-functionalised polyolefin. The amine functionalised polyolefin is a copolymer having units derived from a nitrogen-containing olefinic monomer, and at least one further olefinic monomer selected from the group consisting of ethylene, an alpha-olefin and a non-conjugated diene and is obtainable by masked polymerisation.
Abstract:
A dry-to-the-touch moisture curing composition useful as a sealant and adhesive which includes a reactive modified methylene diisocyanate polymer component having isocyanate functionality of about 8% to about 18% by weight of the polymer.
Abstract:
A dry-to-the-touch moisture curing composition useful as a sealant and adhesive which includes a reactive modified methylene diisocyanate polymer component having isocyanate functionality of about 8% to about 18% by weight of the polymer.
Abstract:
An adhesive composition is described having an amine-modified, low acid ethylene-methacrylic acid copolymer with a melt flow index (MI) of 1.5 or less. Preferably, the acid copolymer has an acid content between 2 and 5wt% and an amine content between 0.05 and 0.5 wt%. The adhesive is useful for bonding with an aliphatic polyketone copolymer such as an ethylene-carbon monoxide copolymer.
Abstract:
An adhesive composition which can be formulated to have low or substantially no VOC emissions is provided. Adhesives in accordance with the invention can be formulated as high solids, one-part, reactive, cross-linked adhesives. This can be achieved by utilizing amide-ester-acrylate reactions or reactions with any other carboxylated polymers. Adhesive compositions in accordance with the invention can include oils, such as various drying oils and similarly acting polymers, co-polymers, and fatty acids. Adhesives in accordance with the invention can also include various hydrocarbon resins, particularly crosslinkable hydrocarbons having a melting point in the range 70 °C to 140 °C. Cross-linking agents, such as materials with pendant oxazoline groups are also advantageously included. Various other mixing, flow and other handling ingredients can also be included.
Abstract:
An adhesive composition that contains a tackifier, a butyl rubber ionomer and a plasticizer. The hot melt adhesive compositions may exhibit one or more of improved creep resistance and improved adhesion.