Abstract:
A generic address scrambler for a memory circuit test engine. An embodiment of a memory device includes a memory stack having one or more of coupled memory elements, a built-in self-test circuit including a generic programmable address scrambler for the mapping of logical addresses to physical addresses for the memory elements, and one or more registers to hold programming values for the generic programmable address scrambler.
Abstract:
The present disclosure provides a memory device, wherein: an address latch can output a block selection control signal according to a block selection enable signal; a test mode selection unit can output a test mode selection signal according to a test mode selection instruction signal; a block selection unit outputs a block selection signal according to a mode selection signal and a block selection enable signal; when the memory enters a first test mode according to the test mode selection signal, an output buffer disables some of the input/output ports, and sequentially outputs the first input/output data and the second input/output data through un-disabled the input/output ports. The memory device according to the present disclosure can occupy less input/output ports of a test machine.
Abstract:
Methods, systems, and devices for repair operation techniques are described. A memory device may detect a failure of a read operation associated with a physical row address of a memory die. The memory device may store information associated with the physical row address before performing a media management operation and after detecting the failure. Additionally or alternatively, the memory device may initiate a counter based on detecting the failure and may increment a value of the counter for each media management operation performed after detecting the failure. The memory device may send a command or other information to perform a repair operation for the physical row address. The memory device may determine the physical row address for the repair operation (e.g., despite media management operations) based on the stored information or the value of the counter, and may perform the repair operation on the physical row address.
Abstract:
The present disclosure is drawn to, among other things, a method of managing a memory device. In some aspects, the method includes determining whether a first address for a page in a first memory region is mapped in a map table, setting a target address as a second address identified in the map table as being mapped to the first address, setting the target address as the first address, determining a number of bits that fail in each word of a plurality of first-layer error correction code (ECC) words for the target address, and adding the target address to the map table, writing-back contents from the target address to a repair address in the first memory region, and updating the map table by mapping the target address to the repair address.
Abstract:
디스플레이, 반도체 메모리 모듈, 메모리 컨트롤러, 프로세서, 및 상기 프로세서에 작동적으로(operatively) 연결되는 메모리를 포함하는 전자 장치가 개시된다. 전자 장치는 지정된 주기에 기반하여 상기 반도체 메모리 모듈의 불량 메모리 셀을 검출하도록 하는 테스트 신호를 생성하고, 상기 테스트 신호를 기반으로 테스트 동작을 수행하여 상기 반도체 메모리 모듈에 포함된 메모리 셀 어레이에서 적어도 하나의 불량 메모리 셀을 검출하고, 상기 적어도 하나의 불량 메모리 셀이 검출된 경우, 상기 적어도 하나의 불량 메모리 셀과 연관된 데이터를 상기 메모리에 저장하고, 상기 메모리 컨트롤러는 상기 메모리에 저장된 상기 적어도 하나의 불량 메모리 셀과 연관된 데이터를 포함하는 리페어 신호를 생성하여 상기 반도체 메모리 모듈로 전송하도록 하는 하나 이상의 인스트럭션들(instructions)을 저장할 수 있다. 이 외에도, 명세서를 통하여 파악되는 다양한 실시예들이 가능할 수 있다.
Abstract:
Embodiments of a memory device are described. This memory device includes a signal connector which is electrically coupled to a command/address (CA) link, and an interface circuit, which is electrically coupled to the signal connector, and which receives CA packets via the CA link. A given CA packet includes an address field having address information corresponding to one or more storage locations in the memory device. Moreover, the memory device includes control logic having two operating modes, where, during a first operating mode, the control logic decodes address information in the CA packets using full-field sampling, and, during the second operating mode, the control logic decodes a portion of the address information in the CA packets using sub-field sampling.
Abstract:
A memory circuit which is provided with a memory cell array in which a plurality of memory cells are arranged at the intersections of a plurality of word lines and a plurality of bit line pairs and a peripheral circuit which selects the address of the memory cell array. The memory circuit is further provided with an arithmetic circuit which generates address signals for testing the memory circuit, a packet decoder which designates the contents of operation of the arithmetic circuit, and an input circuit which supplies a test signal composed of a plurality of bits for designating the test operation of the packet decoder.
Abstract:
A memory transparent in-system built-in self-test may include performing in-system testing on subsets of memory cells over one or more test intervals of one or more test sessions. A test interval may include copying contents of a subset of memory cells to a register(s), writing test data (e.g., a segment of a pattern) to the subset of memory cells, reading back contents of the subset of memory cells, and restoring the content from the register(s) to the subset of memory cells. In-system testing may be performed on overlapping sets of memory cells. In- system testing may be performed on successive subsets of memory cells within a row (i.e., fast column addressing) and/or within a column (fast column addressing). In-system testing may be performed on sets of m blocks of memory cells during respective test intervals. The number of m blocks tested per interval may be configurable/selectable.