Invention Grant
- Patent Title: Adhesion layer forming method, adhesion layer forming system and recording medium
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Application No.: US15077988Application Date: 2016-03-23
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Publication No.: US10354915B2Publication Date: 2019-07-16
- Inventor: Tomohisa Hoshino , Masato Hamada , Takashi Tanaka , Yuichiro Inatomi , Yusuke Saito
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2015-064582 20150326
- Main IPC: B05D3/12
- IPC: B05D3/12 ; H01L21/70 ; H01L21/768 ; H01L21/67 ; C23C18/18 ; H01L21/288 ; B05D1/00 ; C23C18/16 ; C23C18/32 ; C23C18/38 ; C23C18/50
Abstract:
An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.
Public/Granted literature
- US20160284592A1 ADHESION LAYER FORMING METHOD, ADHESION LAYER FORMING SYSTEM AND RECORDING MEDIUM Public/Granted day:2016-09-29
Information query
