Invention Grant
- Patent Title: Integrated abrasive polishing pads and manufacturing methods
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Application No.: US16042016Application Date: 2018-07-23
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Publication No.: US11471999B2Publication Date: 2022-10-18
- Inventor: Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24D11/04 ; B24B37/26 ; B24D18/00 ; B24B37/16 ; B24B37/20 ; B33Y80/00 ; B33Y10/00 ; B29C64/112 ; B33Y30/00 ; H01L21/306

Abstract:
Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
Public/Granted literature
- US20190030678A1 INTEGRATED ABRASIVE POLISHING PADS AND MANUFACTURING METHODS Public/Granted day:2019-01-31
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