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公开(公告)号：US11471999B2
公开(公告)日：2022-10-18
申请号：US16042016
申请日：2018-07-23
Applicant: Applied Materials, Inc.
Inventor： Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24D11/04 , B24B37/26 , B24D18/00 , B24B37/16 , B24B37/20 , B33Y80/00 , B33Y10/00 , B29C64/112 , B33Y30/00 , H01L21/306
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US10384330B2
公开(公告)日：2019-08-20
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Aniruddh Khanna , Jason G. Fung , Mario Cornejo , Ashwin Chockalingam , Mayu Yamamura , Veera Raghava Reddy Kakireddy , Ashavani Kumar , Venkat Hariharan , Gregory E. Menk , Fred C. Redeker , Nag B. Patibandla , Hou T. Ng , Robert E. Davenport , Amritanshu Sinha
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US11980992B2
公开(公告)日：2024-05-14
申请号：US17946547
申请日：2022-09-16
Applicant: Applied Materials, Inc.
Inventor： Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24B37/16 , B24B37/20 , B24B37/26 , B24D11/04 , B24D18/00 , B29C64/112 , B33Y10/00 , B33Y30/00 , B33Y80/00 , H01L21/306
CPC classification number: B24B37/245 , B24B37/26 , B24D11/04 , B24D18/00 , B29C64/112 , B33Y10/00 , B33Y80/00 , B24B37/16 , B24B37/20 , B24D2203/00 , B33Y30/00 , H01L21/30625
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US10821573B2
公开(公告)日：2020-11-03
申请号：US14887240
申请日：2015-10-19
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Aniruddh Khanna , Jason G. Fung , Mario Cornejo , Ashwin Chockalingam , Mayu Yamamura , Veera Raghava Reddy Kakireddy , Ashavani Kumar , Venkat Hariharan , Gregory E. Menk , Fred C. Redeker , Nag B. Patibandla , Hou T. Ng , Robert E. Davenport , Amritanshu Sinha
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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