- 专利标题: Integrated abrasive polishing pads and manufacturing methods
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申请号: US17946547申请日: 2022-09-16
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公开(公告)号: US11980992B2公开(公告)日: 2024-05-14
- 发明人: Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson + Sheridan, LLP
- 分案原申请号: US16042016 2018.07.23
- 主分类号: B24B37/24
- IPC分类号: B24B37/24 ; B24B37/16 ; B24B37/20 ; B24B37/26 ; B24D11/04 ; B24D18/00 ; B29C64/112 ; B33Y10/00 ; B33Y30/00 ; B33Y80/00 ; H01L21/306
摘要:
Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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