- 专利标题: HIGH PERFORMANCE INTERCONNECT
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申请号: US15393153申请日: 2016-12-28
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公开(公告)号: US20170109315A1公开(公告)日: 2017-04-20
- 发明人: Robert J. Safranek , Robert G. Blankenship , Venkatraman Iyer , Jeff Willey , Robert H. Beers , Darren S. Jue , Arvind A. Kumar , Debendra Das Sharma , Jeffrey C. Swanson , Bahaa Fahim , Vedaraman Geetha , Aaron T. Spink , Fulvio Spagna , Rahul R. Shah , Sitaraman V. Iyer , William Harry Nale , Abhishek Das , Simon P. Johnson , Yuvraj S. Dhillon , Yen-Cheng Liu , Raj K. Ramanujan , Robert A. Maddox , Herbert H. Hum , Ashish Gupta
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G06F13/42
- IPC分类号: G06F13/42 ; H04L9/06 ; G06F11/10 ; G06F13/40
摘要:
A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.
公开/授权文献
- US10248591B2 High performance interconnect 公开/授权日:2019-04-02
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