Invention Grant
- Patent Title: Colloidal silica chemical-mechanical polishing composition
- Patent Title (中): 胶体二氧化硅化学机械抛光组合物
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Application No.: US14749923Application Date: 2015-06-25
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Publication No.: US09422456B2Publication Date: 2016-08-23
- Inventor: Steven Grumbine , Jeffrey Dysard , Ernest Shen , Mary Cavanaugh
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Arlene Hornilla
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B1/00 ; C09G1/00 ; C09G1/04 ; C09K3/14 ; H01L21/306 ; H01L21/321 ; H01L21/3105
Abstract:
A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive particles include an aminosilane compound or a phosphonium silane compound incorporated therein. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.
Public/Granted literature
- US20150376458A1 COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION Public/Granted day:2015-12-31
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