Invention Grant
- Patent Title: Tungsten chemical-mechanical polishing composition
- Patent Title (中): 钨化学机械抛光组合物
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Application No.: US14750204Application Date: 2015-06-25
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Publication No.: US09567491B2Publication Date: 2017-02-14
- Inventor: Lin Fu , Steven Grumbine , Jeffrey Dysard , Tina Li
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika Wilson
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/3105 ; H01L21/306 ; H01L21/321 ; C09K3/14 ; C09K13/00
Abstract:
A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of a layer.
Public/Granted literature
- US20150376462A1 TUNGSTEN CHEMICAL-MECHANICAL POLISHING COMPOSITION Public/Granted day:2015-12-31
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