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公开(公告)号:CN1812081A
公开(公告)日:2006-08-02
申请号:CN200610000339.7
申请日:2006-01-06
Applicant: 太阳诱电株式会社
IPC: H01L23/485 , H01L23/12
CPC classification number: H05K3/3436 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/05655 , H01L2224/1147 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H05K3/3463 , H05K2201/10992 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
Abstract: 本发明提供一种具有柱状电极的半导体装置,所述柱状电极具有仅与柱状部的上表面接合的球状的低熔点层。当设各低熔点层(24)的体积为A、各柱状部(22)的上表面的面积为B时,通过调整低熔点层(24)的镀敷量和柱状部(22)的截面面积以满足A≤1.3×B1.5的关系,由此,当低熔点层(24)通过软熔形成球状时,可以防止该低熔点层(24)流淌到柱状部(22)的侧表面。
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公开(公告)号:CN100423248C
公开(公告)日:2008-10-01
申请号:CN200610000339.7
申请日:2006-01-06
Applicant: 太阳诱电株式会社
IPC: H01L23/485 , H01L23/12
CPC classification number: H05K3/3436 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/05655 , H01L2224/1147 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H05K3/3463 , H05K2201/10992 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
Abstract: 本发明提供一种具有柱状电极的半导体装置,所述柱状电极具有仅与柱状部的上表面接合的球状的低熔点层。当设各低熔点层(24)的体积为A、各柱状部(22)的上表面的面积为B时,通过调整低熔点层(24)的镀敷量和柱状部(22)的截面面积以满足A≤1.3×B1.5的关系,由此,当低熔点层(24)通过软熔形成球状时,可以防止该低熔点层(24)流淌到柱状部(22)的侧表面。
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