摘要:
Only one or only a few channels are sent at a time from circuitry located in a curbside box (15), via link (22) such as either a coaxial or a fiber cable, into a customer's home TV set (14) or personal computer. However, many more than a few channels are delivered to the curbside box, via a line (46,47) such as a fiber or a coaxial cable, from a central office (36) or a central bank (37) of paid video-movies to be selected by the customers. Thus whereas the link from the central office or central bank is relatively broad-band (e.g., 500 MHz to 1,000 MHz), the cable from the curbside to the home (or any other kind of building) can be relatively narrow-band (e.g., 5 MHz to 50 MHz). The curbside box serves a multitude of homes -- a separate (narrow-band) cable running to each home from the (same) curbside switch. Each channel can be a free radio or free TV channel, a stored or an on-line newspaper pay channel, or a pay TV channel, or pay-per-view channel (i.e., the customer must give advance notice per view, and may begin viewing in the middle of a selected program, or may come in at the beginning of a selected program with a short delay, depending on the sender's arrangement). Requests from each TV set in each home (e.g., initiated by means of a hand-held remote control infra-red sending device (11)) can be sent to the curbside box from the home along a link (23) such as a wire or along the same curbside-to-home cable itself. In addition, billing of customers can be accomplished by means of another link (50) connecting a junction in the wire or in the curbside-to-home cable to one or more remote billing centers (40).
摘要:
One or more metallized wiring or chip terminals (8,9) of an electronic device (10), such as an integrated circuit chip or a laser chip, in one embodiment are temporarily bonded to one or more metallized substrate pads of a wiring substrate (10), as for the purpose of electrically testing the electronic device. The composition of the metallized chip terminals is suitably different from that of the metallized substrate pads. The pads and terminals are aligned and electrically connected together with solder located between them under pressure and a temperature above the melting point of the solder. The solder is cooled, and electrical tests of the electronic device are performed by means of electrical access from testing circuitry to the chip terminals through the substrate pads. Then the solder is heated again above its melting point while being immersed in a liquid flux, whereby the liquid solder wets the metallized chip terminals but not the metallized substrate pads, and the device is gently pulled away by mechanical forces (F) from the wiring substrate and is cooled thereafter. This substrate can thereafter be reused for testing other electronic devices that have similarly suitably metallized terminals. In another embodiment, testing can be performed or not as may be desired; and, as for the purpose of chip operation as an integrated circuit or laser, the chip can be allowed to remain permanently bonded to the substrate in the form of a heat-sinking or heat-spreading submount, or it can be allowed to remain only temporarily bonded to the submount and subsequently pulled away from the submount for the purpose of reuse of the submount for another chip.
摘要:
A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such multichip module. The disclosed assembly process makes the heretofore difficult and expensive flip chip bonding technique achievable at low cost. The flip chip bonding technique is simplified by use of a solder paste which includes desirable reflow alignment, fluxing and printability characteristics. These desirable characteristics allow the assembly process to be further economically achieved by permitting the use of standard surface mount equipment in the process. High volume production of standard inexpensive modules are thus possible through this process while also achieving the advantage of high density interconnections afforded through the flip-chip bonding technology.
摘要:
A method and apparatus for fabricating a device is disclosed, which involves a new reactive ion etching technique. Bnth a high etch rate and, for example, a high etch selectivity are simultaneously achieved with the inventive reactive ion etching technique by discharging an electrode of the reactive ion etching apparatus in response to a preselected criterion, e.g., a magnitude of a DC bias at said electrode which equals, or exceeds, a preselected value.
摘要:
Disclosed is a novel "hermetic" optical assembly. A radiation-transmissive member (10) seals an aperture (22) in the assembly housing. The member comprises two major surfaces and a recess (12) that extends from one surface towards the other, with a "septum" (14) between the bottom of the recess and the other surface. An optical or opto-electronic device (23) typically is mounted on the inside surface of the member, and the end of an optical fiber is maintained outside of the assembly in coupling relationship with the device. In a currently preferred embodiment the recess extends from the outward-facing surface of the member and serves to position the end of the optical fiber with respect to a device mounted in a "well" (11) in the inward-facing surface of the member. In another embodiment, the outward facing surface of the member comprises geometrical features (e.g., recesses) that mate with corresponding features (e.g., protrusions) on a guide plate that serves to position the ends of a multiplicity of fibers with respect to devices mounted on the bottom of a recess extending from the inward-facing surface of the radiation-transmissive member. In all embodiments radiation is transmitted through the septum. In preferred embodiments the radiation-transmissive member is (100) Si, with the recess (and other features) produced by means comprising photolithography and anisotropic etching.