Patent search ap:("KEMET ELECTRONICS CORP") AND inv:"CHACKO ANTONY P" Page 1

1.

发明公开
SOLID ELECTROLYTIC CAPACITORS WITH IMPROVED ESR STABILITY 审中-公开
Title translation: 具有增加ESR稳定性的固体电解电容器

公开(公告)号：EP2460164A4

公开(公告)日：2013-04-03

申请号：EP10805097

申请日：2010-07-30

Applicant: KEMET ELECTRONICS CORP

Inventor： CHACKO ANTONY P , NARAMORE DEBRA L

IPC: H01G4/236 , H01G4/005 , H01G11/28

CPC classification number: H01G9/004 , H01G9/04 , H01G11/28 , Y02E60/13 , Y10T29/417 , Y10T29/43

2.

发明公开
CONDUCTIVE POLYMER DISPERSIONS FOR SOLID ELECTROLYTIC CAPACITORS 审中-公开
Title translation: 导电聚合物分散体固体电解质电容器

公开(公告)号：EP2715753A4

公开(公告)日：2015-05-27

申请号：EP12789407

申请日：2012-05-24

Applicant: KEMET ELECTRONICS CORP

Inventor： CHACKO ANTONY P

IPC: H01G9/012 , H01G9/00 , H01G9/028 , H01G9/048 , H01G9/15

CPC classification number: H01G9/0032 , H01G9/0036 , H01G9/028 , H01G9/042 , H01G9/048 , H01G9/15 , H01G2009/0014 , H01G2009/0404

Abstract: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.

3.

发明公开
ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES 有权
Title translation: 连接和安装过渡和液相的电子元件的POLYMERLÖTPASTEN

公开(公告)号：EP2577694A4

公开(公告)日：2014-07-02

申请号：EP11787439

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E , BULTITUDE JOHN , PHILLIPS REGGIE , HILL ALLEN , RENNER GARRY L , LESSNER PHILIP M , CHACKO ANTONY P , BELL JEFFREY , BROWN KEITH

IPC: H01G4/232 , H01G4/005 , H01G4/30

CPC classification number: H01G4/2325 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2201/42 , H01G4/005 , H01G4/30 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00

4.

发明公开
METHOD OF IMPROVING ELECTROMECHANICAL INTEGRITY OF CATHODE COATING TO CATHODE TERMINATION INTERFACES IN SOLID ELECTROLYTIC CAPACITORS 审中-公开
Title translation: 一种提高电动阴极阴极涂层的机械完整性，用于固体电解电容器终端界面

公开(公告)号：EP2577695A4

公开(公告)日：2014-12-03

申请号：EP11787450

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： CHACKO ANTONY P , MCCONNELL JOHN E , LESSNER PHILIP M , HAHN RANDOLPH S , BULTITUDE JOHN

IPC: H01G9/012 , H01G9/042

CPC classification number: H01G9/012 , H01G9/0425 , H01G9/15 , Y02E60/13 , Y10T29/43

5.

发明公开
SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE 审中-公开
Title translation: 具有嵌入式结构容量的物质

公开(公告)号：EP2313900A4

公开(公告)日：2011-12-28

申请号：EP09803461

申请日：2009-07-28

Applicant: KEMET ELECTRONICS CORP , MOTOROLA SOLUTIONS INC

Inventor： PRYMAK JOHN D , STOLARSKI CHRIS , MELODY ALETHIA , CHACKO ANTONY P , DUNN GREGORY J

IPC: H01G4/40 , H01G4/12 , H05K1/16

CPC classification number: H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435

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