摘要:
The present invention is related to the field of semiconductor processing equipment and methods and provides, in particular, methods and equipment for the sustained, high-volume production of Group III-V compound semiconductor material suitable for fabrication of optic and electronic components, for use as substrates for epitaxial deposition, for wafers and so forth. In preferred embodiments, these methods and equipment are optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. Specifically, the precursor is provided at a mass flow of at least 50g Group III element/hour for a time of at least 48 hours to facilitate high volume manufacture of the semiconductor material. Advantageously, the mass flow of the gaseous Group III precursor is controlled to deliver the desired amount.
摘要:
Pile ups of threading dislocations in thick graded buffer layer are reduced by enhancing dislocation gliding. During formation of a graded SiGe buffer layer, deposition of SiGe from a silicon precursor and a germanium precursor is interrupted one or more times with periods in which the flow of the silicon precursor to the substrate is stopped while the flow of the germanium precursor to the substrate is maintained.
摘要:
A method of forming silicon carbide wherein silicon and carbon precursors are successively pulsed into a reactor in the gas phase. The precursors react to form silicon carbide before reaching the growth surface. A precursor will be preheated in the reaction chamber before reacting with the other precursor. The formed silicon carbide sublime then condenses on a growth surface.
摘要:
A stacked photoelectric conversion device includes a first photoelectric conversion layer, a second photoelectric conversion layer and a third photoelectric conversion layer each having a p-i-n junction and made of a silicon base semiconductor, stacked in this order from a light entrance side, wherein the first and the second photoelectric conversion layers have an i-type amorphous layer made of an amorphous silicon base semiconductor, respectively, and the third photoelectric conversion layer has an i-type microcrystalline layer made of a microcrystalline silicon base semiconductor.
摘要:
The present invention provides a method for manufacturing an epitaxial wafer by supplying a raw material gas onto a silicon wafer to perform vapor-phase growth of an epitaxial layer, wherein a thickness of the epitaxial layer that is formed at a peripheral portion of the silicon wafer is controlled by controlling a growth rate and/or a growth temperature of the epitaxial layer that is subjected to vapor-phase growth. As a result, there is provided the method that enables manufacturing an epitaxial wafer having a small roll-off value by controlling a thickness of an epitaxial layer near the outermost periphery at the time of epitaxial growth.
摘要:
A silicon carbide manufacturing device includes a graphite crucible (1), in which a seed crystal (9) is disposed, a gas-inducing pipe (3) coupled with the graphite crucible (1), and an attachment prevention apparatus (4). The gas-inducing pipe (3) has a column-shaped hollow part, through which a source gas flows into the graphite crucible (1). The attachment prevention apparatus (4) includes a rod (16) extending to a flow direction of the source gas, and a revolving and rotating element (12-15, 17) for revolving the rod (16) along an inner wall of the gas-inducing pipe (3) while rotating the rod (16) on an axis of the rod (16) in parallel to the flow direction.
摘要:
A method of depositing a hafnium-based dielectric film is provided. The method comprises atomic layer deposition using ozone and one or more reactants comprising a hafnium precursor. A semiconductor device is also provided. The device comprises a substrate, a hafnium-based dielectric layer formed atop the substrate, and an interfacial layer formed between the substrate and the hafnium-based dielectric layer, wherein the interfacial layer comprises silicon dioxide and has a crystalline structure.
摘要:
The invention relates to a method for controlling the surface temperatures of substrates arranged on substrate supports borne by a substrate support carrier on dynamic gas cushions in a processing chamber of a CVD-reactor. The aim of the invention is to reduce or adjust the temperature variations. According to the invention, an average surface temperature value (T1-T5) is calculated, being measured in a particularly optical manner, and the level of the gas cushions (8) is regulated by varying the individually controlled gas flow producing the gas cushions in such a way that the variations of the measured surface temperatures (T1 - T5) in relation to the average value lies within a predetermined temperature window (TU, TL).
摘要:
A crystal growing apparatus comprises a vacuum vessel (10), a heating lamp (12), a lamp controller (13) for controlling the heating lamp (12), a gas inlet port (14), a flow rate adjuster (15) for adjusting the flow rate of a gas, a pyrometer (19) for measuring the temperature of a substrate, and a gas supply unit (30) for supplying a Si 2 H 6 gas or the like to the vacuum vessel (10). An apparatus for ellipsometric measurement comprises: a light source (20), a polariscope (21), a modulator (22), an analyzer (24), a spectroscope/detector unit (25), and an analysis control unit (26) for calculating Ψ, Δ. In removing a chemical oxide film on the substrate therefrom, in-situ ellipsometric measurement allows a discrimination between a phase 1 during which a surface of the substrate is covered with the oxide film and a phase 2 during which the surface of the substrate is partially exposed so that the supply of gas suitable for the individual phases is performed and halted.
摘要:
In a method of and an apparatus for epitaxially growing a chemical-compound crystal, a plurality of raw-material gasses are alternately introduced into a closed chamber of a crystal growing device to grow the crystal placed within the closed chamber. At growing of the crystal, a light from a light source is emitted to a crystal growing film of the crystal. Intensity of a light reflected from the crystal growing film and received by a photo detector is measured. Charge amounts of the respective raw-material gasses are controlled by a control system on the basis of a change in the reflected-light intensity, thereby controlling a growing rate of the growing film.