Method of fabricating flexible device
    136.
    发明公开
    Method of fabricating flexible device 审中-公开
    Verfahren zur Herstellung einer flexiblen Vorrichtung

    公开(公告)号:EP2428988A1

    公开(公告)日:2012-03-14

    申请号:EP11167494.1

    申请日:2011-05-25

    CPC classification number: H01L21/6835 H01L2221/68318 H01L2221/6835

    Abstract: Disclosed is a method of fabricating a flexible device, which includes surface-treating one or both sides of a carrier plate (1) so that regions (2,2',2'') with different surface-treatments are formed on the same side of the carrier plate, forming a glass-filler reinforced plastic substrate film (3) on the surface-treated carrier plate, forming thin film patterns (4) on the glass-filler reinforced plastic substrate film, and separating the glass-filler reinforced plastic substrate film having the thin film patterns formed thereon from the carrier plate, and in which the surface-treating of the carrier plate enables the glass-filler reinforced plastic substrate film to be easily separated from the carrier plate without an additional process such as using a solvent or a laser release technique.

    Abstract translation: 公开了一种制造柔性装置的方法,其包括对载体板(1)的一侧或两侧进行表面处理,使得在同一侧上形成具有不同表面处理的区域(2,2',2“) 的载体板上,在表面处理的载体板上形成玻璃填充剂增强的塑料基材膜(3),在玻璃填料增强塑料基材膜上形成薄膜图案(4),并分离玻璃填料增强塑料 从载体板形成有薄膜图案的基板薄膜,并且其中承载板的表面处理使得玻璃填充增强塑料基材膜能够容易地与载体板分离,而不需要额外的工艺,例如使用 溶剂或激光释放技术。

    Substrate treatment apparatus, substrate treatment method, preliminary electrode structure, measuring electrode structure, and process electrode structure
    137.
    发明公开
    Substrate treatment apparatus, substrate treatment method, preliminary electrode structure, measuring electrode structure, and process electrode structure 审中-公开
    基板处理装置,基板处理方法,Vorelektrodenstruktur,测量电极的结构和工艺的电极结构

    公开(公告)号:EP2239759A3

    公开(公告)日:2011-12-28

    申请号:EP09014045.0

    申请日:2009-11-10

    CPC classification number: H01J37/32541

    Abstract: Provided are a substrate treatment method, a substrate treatment apparatus, a preliminary electrode structure, and a process electrode structure. The substrate treatment method includes selecting a shape of a hole by confirming at least one of plasma characteristics and a process result based on the shape of a hole with the use of a preliminary electrode structure where holes are formed to have shapes varying with positions; selecting an optimal process position by treating a substrate with the use of a measuring electrode structure where density of the hole varies with positions; providing a process electrode structure by transferring a hole of the measuring electrode structure corresponding to the optimal process position; and compensating process nonuniformity based on positions with the use of the process electrode structure.

    Method for fabricating carbon nanotube-metal-polymer nanocomposites
    139.
    发明公开
    Method for fabricating carbon nanotube-metal-polymer nanocomposites 审中-公开
    一种用于制备碳纳米管 - 金属 - 聚合物纳米复合材料的过程

    公开(公告)号:EP2154187A3

    公开(公告)日:2011-09-07

    申请号:EP09290117.2

    申请日:2009-02-18

    CPC classification number: C08J5/005 B82Y30/00 C08J3/2053 C08J2363/00

    Abstract: Disclosed is a method for fabricating carbon nanotube-metal-polymer nanocomposites, in particular, to a method for fabricating a carbon nanotube-metal-polymer nanocomposite wherein the carbon nanotubes decorated with metal portion in a necklace form are homogeneously dispersed in a polymer base. The method for fabricating a carbon nanotube-metal-polymer nanocomposite comprises: preparing carbon nanotube-metal nanocomposite powder by introducing a polyol reducing agent as well as metal precursor in a carbon nanotube colloidal solution and heating the same; dispersing the carbon nanotube-metal nanocomposite powder in a polymer base; and curing the polymer base to form the carbon nanotube-metal-polymer nanocomposite. According to the present invention, as the carbon nanotubes decorated with metal particles in a necklace form are homogeneously dispersed in the polymer base, microwave absorbing and shielding properties of the final product are improved.

    FAULT LOCALIZATION METHOD AND FAULT LOCALIZATION DEVICE IN A PASSIVE OPTICAL NETWORK, AND PASSIVE OPTICAL NETWORK HAVING THE FAULT LOCALIZATION DEVICE
    140.
    发明公开
    FAULT LOCALIZATION METHOD AND FAULT LOCALIZATION DEVICE IN A PASSIVE OPTICAL NETWORK, AND PASSIVE OPTICAL NETWORK HAVING THE FAULT LOCALIZATION DEVICE 审中-公开
    无源光网络和光网络故障定位方法和设备故障定位与故障定位装置STAND

    公开(公告)号:EP2357737A2

    公开(公告)日:2011-08-17

    申请号:EP09819404.6

    申请日:2009-10-09

    CPC classification number: H04B10/0771 G01M11/3136 H04B10/071

    Abstract: The present invention discloses a fault localization method and a fault localization apparatus in a Passive Optical Network (PON) and a passive optical network having the same.
    A fault localization method in PON according to the present invention comprises a) configuring an optical path of a remote node (RN) selectively by electric power being fed temporarily only when necessary, while the PON is regularly being operated as a passive network; and b) detecting a fault occurring on the selectively configured optical path by inserting a monitoring signal of an OTDR unit, which is positioned in a central office (CO), through the selectively configured optical path.

    Abstract translation: 本发明盘松故障定位方法和无源光网络(PON)和具有相同的无源光网络中的故障定位设备。 在PONgemäß的故障定位方法,本发明通过电力选择性包括:a)在远程节点(RN)的光路的配置被馈送暂时只在必要时,当PON被通常为无源网络操作; 和b)检测的故障通过插入OTDR单元的监测信号的选择性地配置光学路径上出现,所有这些都在一个中心局(CO),其定位,通过选择性地配置的光路。

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