摘要:
A 3-dimensinal (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.
摘要:
Provided is a method for manufacturing a coil element, which does not adversely affect the coil element pattern after taking out for use. A method for manufacturing a coil element using a transferring mold, includes: preparing a transferring mold, on a surface of which an inverted coil element pattern is engraved, the transferring mold having at least a surface part made of metal; forming a center conductive film by first electroplating at the transferring mold as a whole so as to have a thickness exceeding a thickness of an area where the inverted coil element pattern is engraved; removing the center conductive film from a surface by a predetermined thickness by polishing or grinding so as to flatten the surface of the center conductive film; releasing the flattened center conductive film from the transferring mold; coating a protective film at a surface as a whole of the released center conductive film on a side where the coil element pattern is formed; etching the center conductive film for removal from the side subjected to the flattening so that the side reaches the protective film; and removing the protective film and taking out the center conductive film.
摘要:
Provided is a method for manufacturing a coil element, capable of manufacturing a coil element using a resin mold and without performing releasing and transferring, and capable of thinning the coil element. A method for manufacturing a coil element using a resin mold that is soluble in organic solvent, includes: preparing a resin mold, on a surface of which an inverted coil element pattern is engraved; forming a metal seed film on the surface of the resin mold; removing the metal seed film in an area where the inverted coil element pattern is not formed; forming a center conductive film so as to fill an area where the inverted coil element pattern is engraved by first electroplating while using the metal seed film as a base; and dissolving the resin mold to take out the center conductive film.
摘要:
An assembly (10) and method for providing electromagnetic interference isolation. The assembly includes an enclosure (12) which has a first panel (20) and a second panel. Bus bars (26) extend through the first panel and the second panel. A mounting plate (30) is positioned between the first panel and the second panel. The mounting plate has locating members (32) thereon. A plurality of inductive cores (34, 38) are positioned proximate the locating members, the inductive cores having openings (48) through which the bus bars extend. The inductive cores are precisely positioned in the enclosure to facilitate the electromagnetic interference isolation. The assembly may comprise a circuit board, capacitors mounted on the circuit board, and conductive members extending between and electrically connecting the circuit board and the bus bars. The assembly may comprise tabs (32) extending from a surface of the mounting plate (30), pairs of tabs forming respective cradles into which the inductive cores (34, 38) are positioned.
摘要:
An integrated transformer comprising a primary coil and a secondary coil, the primary coil comprising a first subsection and a second subsection, the first subsection extending in a different plane to a plane in which the second subsection extends, the planes spaced from one another, the secondary coil comprising a first subsection and a second subsection, the first subsection extending in a different plane to a plane in which the second subsection extends, the planes spaced from one another, wherein the first subsection of the primary coil is stacked with the second subsection of the secondary coil and the second subsection of the primary coil is stacked with the first subsection of the secondary coil.