Abstract:
An object of the present invention is to provide a low pass filter that allows the interval between attenuation poles to be easily adjusted. A low pass filter according to the present invention includes: a first via-hole conductor connected to a first end portion of a first inductor and a third end portion of a second inductor and extending to another side in a lamination direction with respect to a second end portion of the first inductor and a fourth end portion of the second inductor; and a first capacitor connected in parallel with at least a portion of the first inductor and a portion of the second inductor and formed by a first capacitor conductor layer.
Abstract:
Apparatus and methods for variable capacitor arrays are provided herein. In certain configurations, an apparatus includes a variable capacitor array and a bias voltage generation circuit. The variable capacitor array includes a plurality of metal oxide semiconductor (MOS) variable capacitor cells, which include one or more pairs of MOS capacitors (121,122,123,124) implemented in anti-parallel and/or anti-series configurations. In certain implementations, the MOS variable capacitor cells are electrically connected in parallel with one another between a radio frequency (RF) input and an RF output of the variable capacitor array. The bias voltage generation circuit generates bias voltages (VBl, VB2) for biasing the MOS capacitors of the MOS variable capacitor cells, such that the voltage coefficient of capacitance is kept low and non-linearities in the circuit are reduced.
Abstract:
A highly linear, variable capacitor array (400) constructed from multiple cells (100-0, 100_ 1,... 100_ N). Each cell includes a pair of passive, two-terminal capacitor components connected in antiparallel. The capacitor components may be Metal Oxide Semicondutor, MOS, capacitors. A control circuit (410) applies bias voltages (411_0, 411 1,... 411_ N) to bias voltage terminals associated with each capacitor component, to thereby control the overall capacitance of the array. The two capacitors in each cell are connected in anti-parallel to reduce the cell's and the array's voltage coefficient of capacitance. MOS capacitors are preferably operated in inversion or accumulation mode.
Abstract:
A signal handler providing high linearity in a small size, applicable across wide operating frequencies and bandwidths, while also adapted to preferred integrated circuit (IC) and printed circuit board technologies. In one implementation, a signal handling apparatus (100) includes an input impedance transformer (102) for receiving an input signal and matching an internal apparatus impedance, a splitter (104) for providing N split signals, a number of signal processing circuits (110; 112-1,..., 112-m) for processing the N split signals, a combiner (120) for combining the N split signals into a combined signal, and output impedance transformer (122) for receiving the combined signal and for matching the internal apparatus impedance to an output impedance of the apparatus. The apparatus may provide filtering, duplexing and other radio frequency signal processing functions. A tunable duplexer may be implemented using a vector inductor and tunable capacitor array with frequency dependent impedance transformers.
Abstract:
An improved electronic filter is provided with capacitance and integral inductance properties. The filter has a capacitor with first planar internal electrodes in electrical contact with a first termination and second planar internal electrodes in electrical contact with a second termination. A dielectric is between the first planar internal electrodes and the second planer internal electrodes. A third termination is provided and a conductive trace on a surface of the capacitor is between the third termination and the first termination. A ferromagnetic or ferrimagnetic material is coupled to the conductive trace. Sintering of the capacitor can be followed by formation of the components with inductance properties.
Abstract:
There is provided a multilayer electronic component and a multilayer electronic component manufacturing method capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors (54, 62) are formed so that they extend in a lamination direction in a laminate (12), and function as a first inductor. Via-hole conductors (56, 64) are formed so that they extend in the lamination direction in the laminate (12), and function as a second inductor. A first capacitor and the first inductor form a first resonance circuit. A second capacitor and the second inductor form a second resonance circuit. The via-hole conductors (54, 56) are formed in a first insulating layer so that they are apart from each other by a first distance D1. The via-hole conductors (62, 64) are formed in a second insulating layer so that they are apart from each other by a second distance D2.
Abstract:
A multilayer directional coupler which is easy to mass-produce and reduce in size, in which fine setting of the degree of electromagnetic coupling is facilitated, and which has a large bandwidth ratio is provided. A multilayer directional coupler 1 includes magnetic substrates 2-1 and 2-2, a laminate 3 including first and second transformers 5 and 6, and external electrodes 4-1 to 4-6. The electrode 4-2, which is connected to two ends of a primary coil 5-1 of the first transformer 5, is used as an input end for a main signal, and the electrode 4-1 is used as an output end. The electrode 4-3, which is connected to two ends of a secondary coil 6-2 of the second transformer 6, is used as an output end for a subsignal. A winding length ratio N1 (N2) of secondary coil 5-2 (6-1) to the primary coil 5-1 (6-2) is set to be greater than 1 and not greater than 10. Preferably, the ratio N2/N1 is set to be greater than 0.5 and less than 2.0.
Abstract:
In the nonmagnetic Zn-ferrite of the present invention comprising iron oxide and zinc oxide, the content of Fe 2+ is specifically limited. Alternately in the nonmagnetic Zn-ferrite comprising iron oxide and zinc oxide as main components, a given amount of at least one metal oxide selected from the group consisting of manganese oxide, nickel oxide and magnesium oxide is contained. It is thus possible to provide a nonmagnetic Zn-ferrite that can have high resistivity without containing Cu.
Abstract:
The present invention relates to a laminated chip element which can be manufactured to have desired electric properties by combining various elements in accordance with the desired objectives. More p articularly, t he present invention relates to a laminated chip element which has superior high frequency properties and can be manufactured to control capacitance and/or inductance of the laminated chip element to a desired value. There is provided a laminated chip element, comprising at least one first sheet on which first and second conductive patterns are formed, the first and second conductive patterns being spaced apart from each other in a direction of both ends of the first sheet; and at least one second sheet on which a third conductive pattern is formed, the third conductive pattern being formed in a transverse direction of both the ends of the first sheet; wherein one ends of the first and second conductive patterns are connected to first and second external terminals, respectively, at least one end of the third conductive pattern is connected to a third external terminal, and the first and second sheets are laminated. There is also provided a laminated chip element, comprising: at least one first sheet on which a first conductive pattern is formed, the first conductive pattern consisting of first to third portions, the first and second portions being spaced apart from each other in a direction of both ends of the first sheet, the second portion connecting the first and second portions to each other to have a predetermined inductance; and at least one second sheet on which a second conductive pattern is formed in a transverse direction of both the ends of the first sheet; wherein the first and second portions are connected to first and second external terminals, respectively, at least one ends of the second conductive pattern is connected to a third external terminal, and the first and second sheets are laminated.