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    SURGICAL INSTRUMENT WITH TRACKING DEVICE CONNECTED VIA A FLEXIBLE CIRCUIT
    2.
    发明公开
    SURGICAL INSTRUMENT WITH TRACKING DEVICE CONNECTED VIA A FLEXIBLE CIRCUIT 审中-公开
    CHIRULGISCHES INSTRUMENT MIT EINERÜBEREINE FLEXIBLE SCHALTUNG VERBUNDENEN VERFOLGUNGSVORRICHTUNG

    公开(公告)号：EP2948074A1

    公开(公告)日：2015-12-02

    申请号：EP14706985.0

    申请日：2014-01-24

    Applicant: Medtronic Xomed, Inc.

    Inventor： JACOBSEN, Brad ,  BURG, Bruce M. ,  BLOCK, Orey G. ,  BZOSTEK, Andrew ,  DOERR, Vince J. ,  JAIN, Abhishek ,  MERKL, Brandon ,  CILKE, Joseph Thomas

    IPC: A61B17/24 ,  A61B19/00 ,  H05K1/03

    CPC classification number: H05K3/34 ,  A61B17/24 ,  A61B34/20 ,  A61B2017/00862 ,  A61B2017/00946 ,  A61B2034/2051 ,  H05K1/0245 ,  H05K1/118 ,  H05K2201/051 ,  H05K2201/056 ,  H05K2201/097 ,  H05K2201/10287

    Abstract: A surgical instrument (100) is disclosed having an elongated body portion (126) having a proximal end and a distal end. The body portion is formed from a plastically deformable material such that the body portion can be bent between the proximal and distal ends from a first configuration to a second bent configuration and maintains the bent configuration. A flexible circuit sheet (232) having at least a pair of lead wires (236) disposed around the body portion. The pair of lead wires are configured to conform to the bent configuration of the body portion such that they do not break during bending of the body portion. A tracking device (84) adapted to cooperate with a navigation system (10) to track the distal end of the instrument (100) is coupled to the flexible circuit.

    Abstract translation: 公开了具有细长主体部分（126）的外科器械（100），其具有近端和远端。 主体部分由可塑性变形的材料形成，使得主体部分可以在近端和远端之间从第一构型弯曲到第二弯曲构型并保持弯曲构型。 具有设置在主体部分周围的至少一对引线（236）的柔性电路板（232）。 一对引线构造成符合主体部分的弯曲构造，使得它们在主体部分的弯曲期间不会断裂。 适于与导航系统（10）协作以跟踪仪器（100）的远端的跟踪设备（84）被耦合到柔性电路。

    PRINTED CIRCUIT SUBSTRATE AND NOISE SUPPRESSING STRUCTURE
    3.
    发明公开
    PRINTED CIRCUIT SUBSTRATE AND NOISE SUPPRESSING STRUCTURE 审中-公开
    BEDRUCKTES SCHALTSUBSTRAT UNDGERÄUSCHUNTERDRÜCKUNGSSTRUKTUR

    公开(公告)号：EP2947974A1

    公开(公告)日：2015-11-25

    申请号：EP14741098.9

    申请日：2014-01-09

    Applicant: NSK Ltd.

    Inventor： SHINKAWA, Naoto ,  FUKINUKI, Shigeru

    IPC: H05K1/16 ,  H05K3/46 ,  B62D5/04

    CPC classification number: H05K1/0231 ,  B62D5/0406 ,  H01L2224/4103 ,  H01L2924/00014 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/097 ,  H05K2201/1006 ,  H01L2224/37099

    Abstract: There is provided a printed circuit substrate and a noise suppression structure capable of minimizing constraint on a component layout on a substrate and suppressing noise. The printed circuit substrate (110) includes conductive patterns (111, 113, 115) of odd numbered layers and conductive patterns (112, 114, 116) of even numbered layers which are alternately arranged in a vertical direction and hold an insulating layer between each layer. Portions excepting predetermined areas for connecting a first through-hole (117) and predetermined areas for insulating from a second through-hole (118) in the conductive patterns (111, 113, 115) of the odd numbered layers have a same shape as portions excepting predetermined areas for connecting the second through-hole (118) and predetermined areas for insulating the first through-hole (117) in the conductive patterns (112, 114, 116) of the even numbered layers, and the portions are laminated on one another at the same position in the vertical direction.

    Abstract translation: 提供了一种印刷电路基板和噪声抑制结构，其能够最小化对基板上的部件布局的约束并抑制噪声。 印刷电路基板（110）包括奇数层的导电图案（111,113,115）和偶数层的导体图案（112,114,116），它们沿垂直方向交替布置并且在每个层间保持绝缘层 层。 除了用于连接第一通孔（117）和用于与奇数层的导电图案（111,113,115）中的第二通孔（118）绝缘的预定区域的预定区域之外的部分具有与部分 除了用于连接第二通孔（118）的预定区域和用于将第一通孔（117）绝缘在偶数层的导电图案（112,114,116）中的预定区域之外，并且这些部分层压在一个 另一个在垂直方向相同的位置。

    WIRING BOARD
    4.
    发明公开
    WIRING BOARD 审中-公开
    LEITERPLATINE

    公开(公告)号：EP2927950A1

    公开(公告)日：2015-10-07

    申请号：EP13858236.6

    申请日：2013-05-27

    Applicant: NGK Spark Plug Co., Ltd.

    Inventor： WADA, Hidetoshi ,  ITO, Tatsuya ,  NAGAI, Makoto

    IPC: H01L23/12 ,  H05K3/46

    CPC classification number: H05K1/11 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2203/0594 ,  H05K2203/0597 ,  H01L2924/00

    Abstract: Provided is a wiring substrate which allows connection terminals to be disposed at high density, can increase the degree of freedom of wiring layout, and can enhance the reliability of connection of the connection terminals. A wiring substrate of the present invention includes a laminate which includes one or more insulating layers and one or more conductor layers laminated together; a wiring formed on the laminate; a columnar connection terminal which is formed directly on the wiring and is in contact with at least one of opposite side surfaces of the wiring; and a solder resist layer which covers the wiring and which exposes at least a portion of the connection terminal. The width of the wiring at a position at which the connection terminal is formed is smaller than the length of the connection terminal in the width direction.

    Abstract translation: 提供了一种允许以高密度设置连接端子的布线基板，可以增加布线布局的自由度，并且可以提高连接端子的连接的可靠性。 本发明的布线基板包括一层叠体，其包括一层或多层绝缘层和层叠在一起的一层或多层导体层; 形成在层压板上的布线; 柱状连接端子，其直接形成在布线上并且与布线的相对侧表面中的至少一个相接触; 以及覆盖所述布线并且暴露所述连接端子的至少一部分的阻焊层。 形成连接端子的位置的布线的宽度小于连接端子在宽度方向上的长度。

    Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
    8.
    发明公开
    Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module 审中-公开
    电感元件，层叠型电子部件模块与这些设备，部件和模块的层叠型电子部件及其制造方法

    公开(公告)号：EP1443529A1

    公开(公告)日：2004-08-04

    申请号：EP04002176.8

    申请日：2004-01-30

    Applicant: TDK Corporation

    Inventor： Takaya Minoru, c/o TDK Corporation ,  Endo, Toshikazu, c/o TDK Corporation

    IPC: H01F17/00 ,  H01F41/04 ,  H01L23/64 ,  H01L21/02

    CPC classification number: H01F41/041 ,  H01F17/0033 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H05K1/165 ,  H05K3/4602 ,  H05K2201/097 ,  H01L2924/00014

    Abstract: A laminated electronic component including at least one inductance element and produced froma laminate having electrical insulators and electrical conductors laminated alternately. The inductance element is formed as a helical coil having a plurality of turns each constituted by four sides. The inductance element has pairs of parallel conductor pieces and pairs of bridging conductor pieces. Each pair of parallel conductor pieces form two of the four sides of one turn of the coil. Each pair of bridging conductor pieces form the other two sides of one turn of the coil. Grooves are formed in the laminate to thereby form the parallel conductor pieces. The grooves are filled with an electrically insulating material. The bridging conductor pieces are formed on the electrically insulating material.

    Abstract translation: 甲层叠型电子部件包括至少一个电感元件和产生弗罗马层压具有电绝缘体和电导体交替层叠。 电感元件形成为具有各匝由四边构成的多个A螺旋线圈。 电感元件具有对平行的导体片和对桥接导体片的。 每对平行的导体片形成的两个线圈的一匝的四个侧面。 每对桥接导体片的形成的线圈的一匝的另外两侧。 槽在层叠物形成，从而形成平行的导体片。 槽填充有在电绝缘材料。 桥接导体片形成在电绝缘材料。

    ELECTRONIC TRANSFORMER/INDUCTOR DEVICES AND METHODS FOR MAKING SAME
    9.
    发明公开
    ELECTRONIC TRANSFORMER/INDUCTOR DEVICES AND METHODS FOR MAKING SAME 审中-公开
    电子发送/INDUKTIVITÄTSBAUELEMENTE及其制备方法

    公开(公告)号：EP1325545A2

    公开(公告)日：2003-07-09

    申请号：EP01975308.6

    申请日：2001-09-24

    Applicant: M-Flex Multi-Fineline Electronix, Inc.

    Inventor： HARDING, Philip, A.

    IPC: H02M1/00

    CPC classification number: H01F41/046 ,  H01F17/0033 ,  H05K1/165 ,  H05K3/06 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/097 ,  H05K2201/10416 ,  Y10S29/016 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T29/49165

    Abstract: The present invention relates to the methods of construction for inductive components of, preferably, ferromagnetic materials such as inductors, chokes, and transformers when used as an integral part of the fabrication of PCB's or FLEX's. In one preferred embodiment, holes (56, 58) are formed through a ferromagnetic substrate (50) and plated with conductive material. The arrangement of these holes, and the subsequent design that ensues, will form the inductive components within the plane of the media in which the device is formed; using the substrate (50) for a magnetic core (90). By using this approach, the inductive components can be miniaturized to physical sizes compatible with the requirements of modern surface mount technology (SMT) for integrated circuitry (IC). This process also allows these components to be fabricated using mass production techniques, thereby avoiding the need to handle discrete devices during the manufacturing process. In another preferred embodiment, a series of thin, concentric high permeability rings (315) are etched on a substrate (330) to provide high permeability transformers and inductors having minimal eddy current effects.

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