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公开(公告)号：EP4034321A1
公开(公告)日：2022-08-03
申请号：EP20788707.6
申请日：2020-09-24
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公开(公告)号：EP3915718A1
公开(公告)日：2021-12-01
申请号：EP21187465.6
申请日：2012-08-02
发明人： PANDHER, Ranjit , SINGH, Bawa , SARKAR, Siuli , CHEGUDI, Sujatha , KUMAR, Anil K. N , CHATTOPADHYAY, Kamanio , LODGE, Dominic , DE AVILA RIBAS, Morgana
摘要： A lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0.01 to 0.5 %wt Ni; one or both of: from 0.05 to 1.0 %wt Cu, and from 0.01 to 1.0 wt% Ag; from 0 to 1.0 %wt Sb; and the balance Sn, together with any unavoidable impurities being not more than 1.0 wt.%.
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公开(公告)号：EP3907037A1
公开(公告)日：2021-11-10
申请号：EP21181116.1
申请日：2012-08-02
发明人： PANDHER, Ranjit , SINGH, Bawa , SARKAR, Siuli , CHEGUDI, Sujatha , KUMAR, Anil K. N. , CHATTOPADHYAY, Kamanio , LODGE, Dominic , DE AVILA RIBAS, Morgana
摘要： A lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0.003 to 0.5 %wt Co; from greater than 0 to 1.0 %wt Cu; from 0 to 1.0 %wt Ag; one or more of: from 0.001 to 1.0 %wt Sb; from 0.001 to 0.1 %wt Ge; and the balance Sn, together with any unavoidable impurities being not more than 1.0 %wt.
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公开(公告)号：EP3621767A1
公开(公告)日：2020-03-18
申请号：EP18798010.7
申请日：2018-05-11
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公开(公告)号：EP3062956B1
公开(公告)日：2019-09-11
申请号：EP14856974.2
申请日：2014-10-29
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公开(公告)号：EP3257109A4
公开(公告)日：2018-08-01
申请号：EP16749792
申请日：2016-02-10
IPC分类号： H01R4/04 , B23K35/00 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , B23K101/36
CPC分类号： B23K1/0016 , B23K3/04 , B23K35/00 , B23K35/0238 , B23K35/0244 , B23K35/262 , B23K35/362 , B23K2201/36 , C09J7/10 , C09J2201/28 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01R4/04
摘要： A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.
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公开(公告)号：EP2334728B1
公开(公告)日：2018-03-21
申请号：EP09793030.9
申请日：2009-09-25
发明人： HARIHARAN, Rajan , HURLEY, James , KANAGAVEL, Senthil , QUINONES, Jose , SOBCZAK, Martin , MAKITA, Deborah
IPC分类号： C08K5/09 , H01B1/22 , H01L23/498 , B23K35/36
CPC分类号： C08K5/09 , B23K35/3612 , B23K2101/36 , C08K3/08 , C08K2003/0806 , C08K2003/0837 , C08K2003/085 , H01B1/22 , H01L23/04 , H01L23/3178 , H01L23/4928 , H01L23/49883 , H01L24/80 , H01L2224/03332 , H01L2224/03442 , H01L2224/80011 , H01L2924/0002 , H05K7/02 , H01L2924/00
摘要： A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
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公开(公告)号：EP3038790B1
公开(公告)日：2018-02-21
申请号：EP14759052.5
申请日：2014-08-29
发明人： PANDHER, Ranjit , SINGH, Bawa , RAUT, Rahul , SANYOGITA, Arora , BHATKAL, Ravindra , MO, Bin
IPC分类号： B23K1/012 , B23K1/08 , B23K1/19 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/02 , C22C13/00
CPC分类号： B23K35/3612 , B23K1/012 , B23K1/085 , B23K1/19 , B23K35/025 , B23K35/262 , B23K35/3613 , B23K35/362 , C22C13/00
摘要： A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
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19.发明公开
公开(公告)号：EP4335557A3
公开(公告)日：2024-07-10
申请号：EP24153539.2
申请日：2018-05-22
发明人： CHAKI, Nirmalya Kumar , SHAH, Chetan Pravinchandra , DAS, Barun , DEVARAJAN, Supriya , SARKAR, Siuli , RAUT, Rahul , SINGH, Bawa , RUSTOGI, Anubhav , HARRIS, Anna, Jane , PARSONS, Keith, Paul , BRAHAM, Jeffrey, William
IPC分类号： B05D5/12 , C08K3/04 , C08K3/08 , C09D11/00 , C09D11/03 , C09D11/02 , C09D11/10 , C09D11/101 , H01L29/786 , H01L27/12 , C09D11/52 , C09D11/324 , C09D11/033 , C09D11/037 , C09D11/322 , H05K1/09 , H05K3/12 , H05K3/28
CPC分类号： C09D11/033 , C09D11/037 , C09D11/10 , C09D11/101 , C09D11/322 , C09D11/324 , C08K3/04 , C08K3/08 , C09D11/52 , H01L27/1292 , H05K3/285 , H05K3/12 , H05K1/095 , H05K2201/032320130101
摘要： A multilayered structure comprising: a flexible substrate; a layer comprising a metal ink; a layer comprising a graphene ink; and a layer comprising a dielectric ink.
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公开(公告)号：EP4326482A1
公开(公告)日：2024-02-28
申请号：EP22720553.1
申请日：2022-04-14
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