公开(公告)号：EP0246657A3

公开(公告)日：1988-01-07

申请号：EP87107481

申请日：1987-05-22

申请人： HITACHI, LTD.

发明人： Nakanishi, Keiichirou Hitachi Daini Kyoshinryo ,  Yamada, Minoru

IPC分类号： H01L23/46

CPC分类号： H01L23/4332 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152

摘要： An improved integrated circuit chips cooling module (100) in which a cooling member (1) having an inside space through which a coolant flows is attached to each of the integrated circuit chips (2) by pressure welding or anchoring to effect cooling, wherein the improvement comprises providing coated portions for each portion of the surface of coolant flow system (5, 7, 10) where the coolant leakage may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular compound (14) curable by reacting with the coolant to keep the latter from leakage.

公开(公告)号：EP0246657A2

公开(公告)日：1987-11-25

申请号：EP87107481.1

申请日：1987-05-22

申请人： HITACHI, LTD.

发明人： Nakanishi, Keiichirou Hitachi Daini Kyoshinryo ,  Yamada, Minoru

IPC分类号： H01L23/46 ,  C09K3/12

CPC分类号： H01L23/4332 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152

摘要： An improved integrated circuit chips cooling module (100) in which a cooling member (1) having an inside space through which a coolant flows is attached to each of the integrated circuit chips (2) by pressure welding or anchoring to effect cooling, wherein the improvement comprises providing coated portions for each portion of the surface of coolant flow system (5, 7, 10) where the coolant leakage may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular compound (14) curable by reacting with the coolant to keep the latter from leakage.

摘要翻译： 其中冷却构件（1）具有在通过由压接或锚定附着到每个所述集成电路芯片（2）的，以实现冷却的冷却剂流的内部空间的改进的集成电路芯片冷却模块（100），worin的 改进之处包括用于冷却剂流动系统（5，7，10），其中冷却剂泄漏可能发生，所述涂覆部分的包含有机或无机高分子化合物的涂层（14）可固化的表面的每个部分中提供涂布的部分 通过与冷却剂反应到泄漏保持后者。

公开(公告)号：EP0228212A2

公开(公告)日：1987-07-08

申请号：EP86309619.4

申请日：1986-12-10

申请人： HITACHI, LTD.

发明人： Funamoto, Takao ,  Katou, Mituo ,  Kajiwara, Ryoichi ,  Matsuzaka, Takeshi ,  Shida, Tomohiko ,  Takahashi, Kazuya ,  Wachi, Hiroshi ,  Watanabe, Masatoshi ,  Yamada, Minoru ,  Sugawara, Katuo ,  Nakanishi, Keiichirou

IPC分类号： H05K7/20 ,  H01L23/46 ,  H01L23/52 ,  H01L23/42

CPC分类号： H05K1/0373 ,  H01L23/473 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/064 ,  H01L2924/00

摘要： An integrated circuit device has a wiring substrate (2) on one surface of which integrated circuit chips (l) are mounted. A power source substrate (5) of a laminated structure is in contact with the opposite surface of the wiring substrate (2), the power source substrate being of alternate laminations of conductor layers (7) of a heat conductive metal and insulating layers (6) of an elec­trically insulating material, which layers are bonded together. Means such as pins (4) electrically connect the wiring substrate and the power source substrate to each other, and hence connect the chips (l) to the conductive layers (7), a heat radiating means is provided in at least one of either or both of the conductor layers (7) and the insulating layers (6) and radiates heat, which occurs in the power source substrate (5), to the exterior of the device. Such an integrated circuit device has a power source substrate (5) of a remarkably high heat radiating effici­ency, and may permit a high density of integrated circuit chips (l) on the wiring substrate (2).

公开(公告)号：EP0193747A2

公开(公告)日：1986-09-10

申请号：EP86101516.2

申请日：1986-02-06

申请人： HITACHI, LTD.

发明人： Yamada, Minoru ,  Usui, Mitsuru Hitachi Yokohama Mitakeryo ,  Masaki, Akira ,  Nakanishi, Keiichirou Hitachi Daini Kyoshinryo ,  Tokuda, Masahide Hitachi Koyasudai Apartment House

IPC分类号： H01L23/46

CPC分类号： H01L24/83 ,  H01L23/3736 ,  H01L23/4332 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29191 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/0132

摘要： @ Disclosed is a cooling structure cooling a multichip module for effectively removing heat generated from integrated circuit chips. A suction plate (30) formed with minute grooves (31) on one of its surfaces is disposed between each of the integrated circuit chip (2) and an associated cooling block (20) and is brought into contact at the grooved surface with the integrated circuit chip through a layer of a liquid (200) such as silicone oil interposed therebetween, thereby producing negative hydrostatic pressure by the capillary action of the grooves. The suction plate (30) has a thickness small enough to be bent under influence of the negative hydrostatic pressure to follow up warping of the integrated circuit chip, so that the clearance between the opposing surfaces of the suction plate and the integrated circuit chip can be minimized. An integrated circuit chip cooling device of surface-to-surface contact type operable with a low thermal resistance is provided, which can improve the maintainability and reliability without sacrificing the cooling efficiency.

摘要翻译： 公开了冷却多芯片模块的冷却结构，用于有效地去除集成电路芯片产生的热量。 在其一个表面上形成有微小凹槽（31）的吸板（30）设置在每个集成电路芯片（2）和相关联的冷却块（20）之间，并且在开槽表面处与集成 电路芯片通过介于其间的诸如硅油的液体（200）层，由此通过槽的毛细管作用产生负静压力。 吸板30的厚度足够小以在负静压力的影响下弯曲，以跟随集成电路芯片的翘曲，使得吸板和集成电路芯片的相对表面之间的间隙可以是 最小化。 提供了以低热阻可操作的表面接触型的集成电路芯片冷却装置，可以在不牺牲冷却效率的情况下提高可维护性和可靠性。